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NEWS TAGGED CPO
Friday 15 May 2026
Panel makers cool in April 2026, pivot to CPO and FOPLP
After the early pull-forward effect from customers began to fade, Taiwan's panel makers have started to show signs of slower operating momentum. Weaker demand for consumer electronics...
Friday 15 May 2026
Foxconn targets 3Q26 CPO switch mass production, eyes multifold 2027 growth
Foxconn announced at an online investor briefing on May 14 that its common-package optics (CPO) switches are scheduled for mass production and shipments beginning in the third quarter...
Thursday 14 May 2026
Foxconn briefing to clarify AI server orders, CPO commercialization, and EV alliances, investors say
Foxconn will hold its first-quarter 2026 earnings briefing on May 14, with investors expecting detailed updates on AI server demand, the commercialization of co-packaged optics, and...
Wednesday 13 May 2026
Ableprint posts record first-quarter profit as CPO orders set to begin in June
Ableprint reported record first-quarter 2026 revenue and profit as customers installed and qualified new advanced packaging production lines and expanded shipments of high-end process...
Monday 11 May 2026
Chinese semiconductor suppliers expand SEA presence at SEMICON SEA 2026
At SEMICON Southeast Asia 2026 in Kuala Lumpur, China's semiconductor equipment makers are steadily "infiltrating" the Southeast Asian market, extending from back-end packaging and...
Monday 11 May 2026
PCL Technologies to buy precision plastics and metal parts maker to target CPO components for data centers
PCL Technologies announced that its board approved a plan to acquire 100% of Pingood Group, including Pingood Enterprise Co., Pingood (Thailand) Co., Ltd., Pingji Electronics (Dongguan)...
Friday 8 May 2026
Coherent order backlog reaches 2030: 1.6T optics and 6-inch InP capacity accelerate
Driven by surging AI computing demand and the industry-wide shift toward higher-bandwidth, lower-power network infrastructure, optical communications company Coherent Corp. says customer...
Friday 8 May 2026
BenQ Materials bets on CPO and microLED amid optical communications push
BenQ Materials is seeing its diversification begin to pay off as it pushes into co-packaged optics (CPO) and microLED. The polarizer maker said its subsidiary Cenefom's chemical mechanical...
Wednesday 6 May 2026
GlobalFoundries sees optical and SiGe momentum drive strategic leap into high-value chip markets
GlobalFoundries used its first-quarter 2026 earnings call to spotlight advances in silicon photonics (SiPh), co-packaged optics (CPO), and silicon-germanium (SiGe) development while...
Tuesday 5 May 2026
Univacco eyes 2027 Vietnam plant ramp-up for CPO and advanced packaging materials
Univacco said its Vietnam plant will begin mass production in the second quarter of 2027 as the company moves to position itself in the co-packaged optics and advanced packaging materials...
Saturday 2 May 2026
Foxconn Industrial Internet posts 102% net profit growth in 1Q26 on AI GPU, ASIC demand
Benefiting from the continued expansion of artificial intelligence (AI) computing power demand, Foxconn Industrial Internet (FII), a subsidiary of Hon Hai Precision Industry (Foxconn),...
Thursday 30 April 2026
Taiwan OSAT Powertech lifts capex to US$1.6bn, targets AI packaging growth
Memory packaging and testing provider Powertech Technology posted net profit of NT$1.84 billion (US$57 million) for the first quarter of 2026, its second-highest for the same period,...
Thursday 30 April 2026
China photonics chipmaker Lightelligence lists in HK, CPO commercialization in focus
As generative AI drives a sharp rise in computing demand, traditional electrical interconnect architectures are increasingly constrained by power consumption and density limits. On...
Wednesday 29 April 2026
Huizuan Technology breaks ground on Thailand plant to scale high-end CPO, AI HDD and cooling
Superior Plating Technology announced a groundbreaking for a new factory in Ayutthaya, Thailand, with the first phase involving an investment of NT$300 million (US$9.52 million) for...
Wednesday 29 April 2026
Analysis: Taiwan's two major panel makers enter semiconductor packaging; CPO and FOPLP become key
Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level...