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NEWS TAGGED CPO
Monday 13 July 2026
CPO mass production accelerates new four-stage test equipment market
AI-driven demand is accelerating the shift of co-packaged optics (CPO) from technology validation to mass production, triggering a new wave of equipment demand. Companies including...
Monday 13 July 2026
MA-tek hits record June revenue on rising AI chip testing demand, CPO complexity
Semiconductor testing company Materials Analysis Technology (MA-tek) reported June 2026 revenue of NT$558 million (approx. US$17.41 million), up 2.56% from May and 11.01% year over...
Sunday 12 July 2026
SmartSens targets 2027 commercialization of Micro LED optical interconnects for AI infrastructure
The rapid expansion of AI servers and large language models (LLMs) is driving unprecedented demand for data center computing, making high-speed interconnect technologies one of the...
Saturday 11 July 2026
Interview: Why Geckos bets materials, not chips, will decide the next AI performance leap

As generative AI fuels rapid growth in demand for high-performance computing (HPC), the semiconductor industry is shifting from a process...

Friday 10 July 2026
Largan samples CPO product in July 2026, eyes GC edge
Largan said on July 9, 2026, that it will formally begin sampling fiber array (FA) products for a mass-production customer in July, while chairman En-Ping Lin outlined the company's...
Friday 10 July 2026
Largan sees variable-aperture ramp in 3Q26, eyes CPO samples

Largan said on July 9, 2026, that shipments of its variable-aperture lens will begin ramping up in the third quarter, and that it has...

Friday 10 July 2026
Former chip designer turned VC delivers reality check on AI, CPO hype
A veteran chip engineer turned venture capitalist used a panel at Taipei's Asia VC Summit on Wednesday to challenge two of the semiconductor industry's most fashionable narratives:...
Thursday 9 July 2026
Largan investor conference to spotlight optical communications push and smartphone demand
Taiwan lens maker Largan is drawing global attention as it prepares to update investors on handset shipments, new product mix, and its push into optical communications. The meeting...
Tuesday 7 July 2026
Exclusive: Geckos bets on AI materials beyond nano copper powders and CPO waveguides
As generative AI drives rapid growth in high-performance computing (HPC) demand, the semiconductor industry is shifting from process-node competition to materials competition. Geckos...
Friday 3 July 2026
BOE targets AI packaging with Micro LED optical interconnect and glass substrate CPO

BOE, China's leading display panel maker, is accelerating its move into next-generation packaging technologies for the AI era. The company...

Friday 3 July 2026
Competing Paths in Data Center Optics: XPO Could Beat CPO to Mass Production in 2027
DIGITIMES notes that Arista Networks unveiled XPO at The Optical Fiber Communication Conference and Exhibition 2026 (OFC 2026). Unlike CPO, which is associated with more disruptive...
Tuesday 30 June 2026
Ability Opto-Electronics targets CPO growth with V-groove and MT lines

Ability Opto-Electronics Technology, an optics maker, said on June 29 that its V-groove and mechanical transfer (MT) products for co-packaged...

Tuesday 30 June 2026
Interview: Why DuPont spinoff Qnity is betting its Taiwan growth on packaging, not process nodes

As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals...

Monday 29 June 2026
Foxconn unit ShunSin confirms TSMC COUPE partnership; capex to hit NT$5 billion for CPO and OCS
ShunSin Technology Holdings, Foxconn's semiconductor packaging and testing subsidiary, is accelerating its transition toward co-packaged optics (CPO). The company's latest appointment...
Saturday 27 June 2026
ShunSin sees CPO potential, adds TSMC veterans as independents
ShunSin, a Foxconn-affiliated packaging and testing company, held its 2026 annual general meeting, with chairman Shang-Yi Chiang presiding. Chiang said ShunSin will leverage its packaging,...