The magnetic pull of TSMC is making waves, as the upcoming SEMICON West exhibition scheduled for October 7, 2025, at the Phoenix Convention Center in Arizona, is poised to reach record...

At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the...

Nvidia is advancing its optical interconnect research to support the growing scale of "AI factories" and accelerated computing clusters.

Manish Mehta, vice president of Marketing and Operations for Broadcom's Optical Systems Division, delivered a keynote address at SEMICON Taiwan 2025 focused on heterogeneous integration...

Starting from September 2025, Japanese company Dai Nippon Printing (DNP) will launch its first research and development facility outside Japan, located in the High Tech Campus Eindhoven...

MicroLED is regarded as the next-generation display technology, with Taiwan leading global development due to strong semiconductor and display integration, plus government support...

Surging demand for AI, large language models (LLMS), and high-performance computing is propelling co-packaged optics (CPO) into the spotlight of the semiconductor industry. The technology...

At the inaugural Open Compute Project (OCP) APAC Summit in Taipei, ASE Group Executive Vice President Tingu Yin Chang said surging AI computing demand has become the primary catalyst...

As artificial intelligence continues to redefine the architecture and demands of modern computing, ASE is positioning Co-Packaged Optics (CPO) and advanced packaging at the center...

Silicon photonics (SiPh) is one of the cutting-edge technologies in a crucial Taiwanese government AI development program that aims to create more than US$500 billion in industry...

Japanese telecommunications company NTT is encountering significant challenges in its efforts to mass-produce co-packaged optics (CPO), a next-generation technology increasingly critical...

Surging demand for AI compute is driving global investment in GPUs, ASICs, and next-generation datacenter infrastructure. As conventional electronic interconnects fall short of meeting...

PCL Technologies has secured a significant laser optical packaging order from Broadcom for its next-generation data center switch chips, signaling a milestone in the commercial rollout...

As data transmission and exchange volumes skyrocket, high-speed connectivity has emerged as a defining trend in the tech landscape. FOCI Fiber Optic Communications, a leading player...