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    LG Electronics's three strategies to counter competition from Chinese brands
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    InP enters a capacity race as TCL moves into indium phosphide laser chips
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    Taiwan’s semiconductor materials sector sees opportunity in advanced packaging and CPO
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    NEWS TAGGED CPO
    Tuesday 1 September 2026
    Marvell CTO: power and density bottlenecks are driving CPO adoption in AI data centers
    Speaking at the Silicon Photonics Global Summit ahead of Semicon Taiwan 2026, Marvell Technology CTO Radha Nagarajan highlighted that the core focus for upgrading connectivity in the...
    Tuesday 1 September 2026
    Research insights: AI Fabric optical interconnects move into racks as 400G/lane and CPO maturity emerge as key variables
    DIGITIMES observed that as AI systems continued to scale, interconnect requirements inside AI data centers had expanded from chips, packages, and boards to racks, clusters, and eventually...
    Tuesday 1 September 2026
    Cisco: CPO is ready for mass deployment amid surging AI data-center demand
    For global cloud operators and network vendors, Cisco said co-packaged optics (CPO) is moving from lab promise to commercial necessity as AI data centers strain power budgets and bandwidth...
    Tuesday 1 September 2026
    Luxnet eyes orders through 2028, DCI revenue set to double in 2027
    AI-driven demand for optical transceiver modules is rising rapidly, and LuxNet said its business in the second half of 2026 will grow sharply from the first half. With capacity coming...
    Monday 31 August 2026
    Marvell sees 2027 acceleration in scale-up optics
    Marvell said on its fiscal second-quarter of 2027 earnings call that customers are actively planning to deploy scale-up optical solutions as early as 2027, with demand for near-package...
    Monday 31 August 2026
    TSMC sees SiPh going mainstream in 2027
    Silicon photonics (SiPh) will become mainstream in 2027, with market share topping 50%, as AI scale-out drives explosive growth in optical transceiver demand, said K.C. Hsu, TSMC's...
    Monday 31 August 2026
    ASE: CPO scale-out demands deeper supply-chain coordination for mass production
    SEMICON Taiwan 2026 kicked off its pre-show program with the Silicon Photonics Global Summit.
    Monday 31 August 2026
    South Korea risks 'HBM 2.0' trap in emerging CPO market
    Co-packaged optics (CPO) is emerging as a critical next-generation technology for AI infrastructure, but unless South Korea strengthens its integration and validation capabilities,...
    Thursday 27 August 2026
    HTSI targets AI chip demand with SiPh, CPO, packaging push
    Hermes Testing Solutions (HTSI) said revenue for the first seven months of 2026 reached NT$2.7 billion (US$83.8 million), up 128.2% year-over-year and already exceeding its full-year...
    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026

    Global technology and innovation leader ASMPT will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, taking place from September 2 to 4 in Taipei. At...

    Thursday 27 August 2026
    AI glass substrate race shifts toward reliability and mass production
    The competition to develop glass substrates for artificial intelligence (AI) semiconductor packaging is intensifying, with Japanese and South Korean manufacturers pursuing different...
    Tuesday 25 August 2026
    Nvidia and SK Hynix CPO strategies diverge as 3D optics look toward a post-2030 horizon
    On August 20, SK Hynix's global research team published a paper in Nature Electronics detailing its co-packaged optics (CPO) development for high-performance computing (HPC)...
    Monday 24 August 2026
    Analysis: SK Hynix pushes beyond HBM with HBF and CPO
    SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published...
    Monday 24 August 2026
    ASE's Huang urges AI profits to fund R&D for CPO, PLP

    As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from...

    Monday 24 August 2026
    CPO hurdles linger as 800G and 1.6T SiPh surge, says analyst
    Challenges around co-packaged optics (CPO) remain unresolved, but they have not slowed the rapid rise of 800G and 1.6T silicon photonics, DIGITIMES analyst Kiwi Hsu said on August...
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    BIZ FOCUS
    Sep 1, 08:00
    Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing
    Monday 31 August 2026
    NewPower Worldwide expands credit facility to $750M for growth
    Monday 31 August 2026
    Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON
    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
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