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NEWS TAGGED CPO
Monday 21 September 2026
Intel reportedly in talks with AUO on advanced packaging
Intel is reportedly in talks with AUO on Micro LED substrate-based advanced packaging for co-packaged optics (CPO) and high-density computing, as display makers look to turn large-area...
Monday 21 September 2026
Largan makes seventh land, factory purchase of 2026 in co-packaged optics push

Major Taiwanese optical lens maker Largan Precision announced on September 17 that it acquired around 7,468.43 square meters of land...

Monday 21 September 2026
Ampoc AI PCB orders surge as it expands into CPO

Printed circuit board (PCB) wet-process equipment maker Ampoc Far-East said demand for its in-house high-end equipment has surged on...

Friday 18 September 2026
CPO raises PCB downgrade concerns but switches stick with M8 CCL

As the industry shifts toward greater use of optical interconnects and less reliance on copper, market speculation has emerged that...

Thursday 17 September 2026
Ardentec, Sigurd race into silicon photonics TIA testing as US client books capacity
The global optical communications module market continues to grow, and Taiwan's test and packaging companies are moving to capture demand in silicon photonics (SiPh) transimpedance...
Thursday 17 September 2026
20 of China's OSATs push into advanced packaging amid EUV curbs
China is broadening its advanced packaging base as restrictions on leading-edge semiconductor equipment complicate further process-node scaling. The effort now extends beyond the country's...
Wednesday 16 September 2026
BizLink's CPO breakthrough hits the hard part: scaling
BizLink has begun small-volume shipments of co-packaged optics (CPO), but chairman Roger Liang said mass deployment remains constrained by fiber array unit (FAU) assembly, thermal...
Wednesday 16 September 2026
CPO ramp pushes silicon photonics testing upstream to catch defects early

As AI servers drive demand for higher-speed optical interconnects and co-packaged optics (CPO) moves toward volume production, silicon...

Tuesday 15 September 2026
Interview: Corning sees CPO, glass core as new semiconductor battlegrounds

As artificial intelligence applications accelerate, surging global semiconductor demand is pushing advanced packaging, co-packaged optics...

Tuesday 15 September 2026
China optical transceivers avoid US FCC curbs as NPO, CPO battle for high-speed interconnect supremacy

The US Federal Communications Commission (FCC) recently updated its equipment authorization rules, prohibiting authorization of devices...

Tuesday 15 September 2026
Commentary: CIOE 2026 reveals the harder race behind AI optical interconnects

The 2026 China International Optoelectronic Exposition (CIOE) closed with 800G and 1.6T optical modules still dominating the show floor,...

Monday 14 September 2026
Foxconn subsidiary broadens AI interconnect role as 1.6T enters deployment
AI data centers are moving decisively toward 1.6T connectivity, with 800G now mainstream in AI clusters and 400G remaining common in general cloud and enterprise deployments.
Monday 14 September 2026
CPO nears mass production — next battle about interfaces, yield and maintenance
As AI computing bandwidth keeps rising, optical interconnect architectures are moving beyond pluggable optical modules toward near-packaged optics (NPO) and co-packaged optics (CPO)...
Monday 14 September 2026
Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
As AI continues to accelerate demand for high-speed optical connectivity, technologies such as silicon photonics, CPO, LPO, NPO and OCS are moving rapidly toward commercial deployment...
Sunday 13 September 2026
AI server tracker: Taiwan optics race beyond 1.6T

Taiwan's optical communications supply chain is entering a more consequential phase of the AI infrastructure cycle. Demand is broadening...