Thursday 30 May 2024
HBM competition (1): advanced packaging technology divergence explained
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU...
Wednesday 15 May 2024
PCB industry moves up the ladder as silicon photonics packaging demand grows
As the AI and HPC markets develop, high-performance computing is rapidly growing, driving the demand for high-speed transmission. Naturally, the complexity of chip design has also...
Tuesday 14 May 2024
CPO promises to have presence in semiconductor advanced packaging
The AI boom is driving chipmaking advancements, with Co-Packaged Optics (CPO) promising to stake a claim as a favored semiconductor packaging technology along with CoWoS.
Thursday 25 April 2024
India-based Kaynes eyes advanced packaging and CPO in OSAT foray
India-based EMS player Kaynes Semicon believes its OSAT project is expected to be approved and eyes advanced packaging, including Co-Packaged Optics (CPO), to differentiate itself...
Tuesday 26 March 2024
Foxconn subsidiary and MediaTek team up for co-packaged optics devices
Foxconn Interconnect Technology (FIT), a subsidiary of Hon Hai Technology Group (Foxconn), has partnered with MediaTek to co-develop a groundbreaking 51.2T solution incorporating...
Friday 22 March 2024
MediaTek launches ASIC design platform with co-packaged optics
MediaTek has launched its next-generation ASIC design platform with co-packaged optics (CPO) solutions, which industry observers say marks a major step in the vendor's development...
Thursday 21 March 2024
Exclusive: Canadian silicon photonics firm Ranovus partners with MediaTek to seize AI opportunities
Ranovus, a Canadian silicon photonics scaleup company specializing in high-speed optical interconnect chips, announced on March 20, 2024, a groundbreaking partnership with MediaTek...
Friday 8 March 2024
Winway sees increases in AI-related revenue, inquiries for silicon photonics CPO testing systems
Taiwan-based testing interface giant Winway Technology, a manufacturer of Co-Packaged Optics (CPO) and Chip-on-Wafer-on-Substrate (CoWoS) testing devices, expects growth across the...
Tuesday 30 January 2024
OSAT providers optimistic and deploying for AI
OSAT providers are optimistic about business opportunities accompanying the AI boom, with many gearing up to develop new packaging technologies to support silicon photonics.
Wednesday 3 January 2024
IC backend firms put focus on AI chips, CPO
Semiconductor demand is improving gradually, with IC packaging and testing houses expressing optimism about market prospects for 2024 and focusing on AI chips and Co-Packaged Optics...
Thursday 21 December 2023
ShunSin to set up a subsidiary in Vietnam
ShunSin Technology, a subsidiary of Hon Hai Technology Group (Foxconn) that specializes in system-in-package (SiP) modules, has announced plans to open a subsidiary in Vietnam for...
Friday 17 November 2023
eLaser eyeing 800G optical modules as main growth driver in 2024
Elite Advanced Laser (eLaser), a Taiwan-based provider of optical communication solutions, is strategically adapting to the demands of the AI-driven era, with a particular focus on...
Friday 27 October 2023
Electromagnetic waves applications offer entrepreneurial opportunities, says PIDA chair
Where to find entrepreneurial opportunities? They can be found from electromagnetic waves, especially at the application level, where different wavelengths can be utilized at different...
Friday 27 October 2023
IC backend houses see AI chips, CPO stimulate advanced packaging demand
AI chips and co-packaged optics (CPO) will stimulate demand for advanced packaging in 2024, during which the semiconductor industry is expected to rebound.
Wednesday 25 October 2023
WinWay Technology takes the lead in CPO, silicon photonics advanced packaging
High-speed data transmission has come into the spotlight along with cloud-based AI accelerator chips as one of the most vital capabilities in the electronics industry, and silicon...
Research Report Database
Summary of Tech Supply Chain News!
Fuel cell is pivotal for Taiwan's hydrogen industry, according to DIGITIMES Research
Silicon shield doesn't guarantee military deterrence for Taiwan, says DIGITIMES Research
Taiwan IPC makers pushing integrated services to boost profits and to see revenues grow in 2024, says DIGITIMES Research