As data transmission and exchange volumes skyrocket, high-speed connectivity has emerged as a defining trend in the tech landscape. FOCI Fiber Optic Communications, a leading player...
Foxconn Interconnect Technology has reaffirmed its commitment to supporting Broadcom's co-packaged optics (CPO) initiatives, a transformative technology aimed at reducing signal loss...
Once Taiwan's second-largest PC maker, First International Computer (FIC), has reinvented itself as a top-three global supplier of optical modules. Leo Chien, Chairman of parent firm...
The rise of AI data centers is fueling demand for co-packaged optics (CPO) and silicon photonics (SiPh), compelling optical communications firm Browave to fast-track its CPO development...
OpenAI CPO Kevin Weil predicts that AI coding capabilities will surpass that of human coders in 2025, a development companies like Anthropic and Google are also closing monitoring.
TSMC's silicon photonic (SiPh) co-packaged optics (CPO) technology is progressing swiftly, with recent market speculation suggesting that related production lines are expected to...
Young Optics' consolidated revenue declined by 14.6% year over year in 2024 to NT$2.572 billion (US$78.7 million), largely due to competition from Chinese mid-range single-panel LCD...
Win Semiconductors, the leading gallium arsenide (GaAs) foundry, sees signs of recovery after industry downturns. As demand for mobile phones and Wi-Fi power amplifiers stabilizes,...
SK Hynix's memory business in China faces numerous uncertainties due to the ongoing US-China conflict. Chief Production Officer (CPO) Young-Sik Kim will reportedly lead the Wuxi fab...
Despite TSMC estimating that the mass production of silicon photonic (SiPh) co-packaged optics (CPO) technology will still require more than one to one and a half years, the optical...
Electric vehicle charge point operator (CPO) EVGallop Mobility System, commonly known as U-Power, intends to file for an initial public offering (IPO) in Taiwan by the end of 2025.
According to industry sources, TSMC is working to integrate CoWoS and SiPh, seeking to launch co-packaged optics (CPO) in 2026 that may inject fresh momentum into the semiconductor...
At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and...
The integration of silicon photonics co-packaged optics (CPO) technology into network communication chips has become inevitable**, driven by its ability** to enable high-speed, low-latency...
