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NEWS TAGGED CPO
Tuesday 15 September 2026
Interview: Corning sees CPO, glass core as new semiconductor battlegrounds

As artificial intelligence applications accelerate, surging global semiconductor demand is pushing advanced packaging, co-packaged optics...

Tuesday 15 September 2026
China optical transceivers avoid US FCC curbs as NPO, CPO battle for high-speed interconnect supremacy

The US Federal Communications Commission (FCC) recently updated its equipment authorization rules, prohibiting authorization of devices...

Tuesday 15 September 2026
Commentary: CIOE 2026 reveals the harder race behind AI optical interconnects

The 2026 China International Optoelectronic Exposition (CIOE) closed with 800G and 1.6T optical modules still dominating the show floor,...

Monday 14 September 2026
Foxconn subsidiary broadens AI interconnect role as 1.6T enters deployment
AI data centers are moving decisively toward 1.6T connectivity, with 800G now mainstream in AI clusters and 400G remaining common in general cloud and enterprise deployments.
Monday 14 September 2026
CPO nears mass production — next battle about interfaces, yield and maintenance
As AI computing bandwidth keeps rising, optical interconnect architectures are moving beyond pluggable optical modules toward near-packaged optics (NPO) and co-packaged optics (CPO)...
Monday 14 September 2026
Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan

As AI continues to accelerate demand for high-speed optical connectivity, technologies such as silicon photonics, CPO, LPO, NPO and OCS are moving rapidly toward commercial...

Sunday 13 September 2026
AI server tracker: Taiwan optics race beyond 1.6T

Taiwan's optical communications supply chain is entering a more consequential phase of the AI infrastructure cycle. Demand is broadening...

Friday 11 September 2026
ficonTEC breaks CPO test bottleneck, teams with Hermes Testing
German silicon photonics (SiPh) test equipment maker ficonTEC has broken through a major bottleneck in co-packaged optics (CPO) "electrical-in, optical-out" testing and launched what...
Friday 11 September 2026
AUO, Innolux accelerate shift from displays to AI, CPO, advanced packaging
Taiwan's panel makers posted mixed August results as the industry's strategic focus shifts beyond monthly revenue toward AI, advanced packaging and co-packaged optics (CPO). AUO and...
Friday 11 September 2026
CPO startup Ayar Labs raises 2026 funding to US$650 million, adds Wiwynn as investor

Ayar Labs, a co-packaged optics (CPO) startup, has raised an additional US$150 million, bringing the primary capital it has raised so...

Thursday 10 September 2026
Huachuang Xinguang sees MicroLED optical interconnects entering data centers in 3 to 5 years

Shenzhen Huachuang Xinguang says MicroLED optical interconnect technology is feasible and expects to target data center applications...

Thursday 10 September 2026
AUO matching glass substrate size stokes TSMC collab speculation
AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.
Thursday 10 September 2026
Hermes Testing ships membrane probe cards, targets SiPh and CPO
Hermes Testing Solutions said its August revenue kept rising and topped NT$500 million for the first time, setting a new monthly record on steady growth in semiconductor test equipment...
Wednesday 9 September 2026
WinWay revenue surges on AI chip pin-count demand
Semiconductor test interface maker WinWay said AI-related orders drove August 2026 revenue to NT$1.706 billion (US$53.8 million), up more than 2x year-over-year and a record high for...
Tuesday 8 September 2026
CPO testing faces hurdles from Insertion 1 to 4, with '100% testing' expected to accelerate in 2027
Co-packaged optics (CPO) has officially entered the mass-production deployment stage, but the critical testing processes responsible for safeguarding yield continue to face different...