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    Inversion Semiconductor targets ASML with particle-accelerator X-ray lithography
    5min ago
    Intel offers bonuses to speed up Ohio fab construction and reaches EMIB-T yields of 90%
    24min ago
    Lite-On adds two major CSP customers as AI revenue tops 30%, targets 30% margin longer term
    24min ago
    NEWS TAGGED TECHNOLOGY
    Monday 3 August 2026
    India advances semiconductor ambitions as Visakhapatnam OSAT plant anchors South India packaging push

    India is moving deeper into semiconductor manufacturing with construction beginning on an INR23.87 billion (US$250 million) OSAT facility...

    Monday 3 August 2026
    FICG launches Singapore-Malaysia dual-core strategy
    FICG's advanced manufacturing subsidiary PRO3C signed a memorandum of understanding (MOU) with AME Elite Consortium Berhad, a Malaysia-listed integrated industrial space solutions...
    Monday 3 August 2026
    Elevated Materials names Jay Wang as chief revenue officer
    Elevated Materials has appointed Jay Wang as chief revenue officer as the battery materials company seeks to speed commercialization and widen its global reach. The move could matter...
    Sunday 2 August 2026
    Xiaomi adds SkyNomad N90 and N70 with 370,000 deliveries still needed for 2026 target

    Xiaomi has entered China's range-extended electric vehicle market with two large intelligent SUVs, expanding beyond battery-only models...

    Sunday 2 August 2026
    TASA opens space startup base to push Taiwan toward satellite ODM
    The Taiwan Space Agency (TASA) opened its new space startup accelerator, TASA iSPARK, on July 31 at National Yang Ming Chiao Tung University's Boai campus in Hsinchu. The center said...
    Sunday 2 August 2026
    Pittsburgh, Switzerland experts challenge Taiwan to move beyond robotics hardware
    As AI shifts toward agentic and physical applications, industry observers say competition will no longer hinge on hardware manufacturing alone, but on the ability to integrate hardware...
    Saturday 1 August 2026
    Obituary: Powerchip chairman Frank Huang dies after reshaping Taiwan's DRAM and foundry industry

    Powerchip Semiconductor Manufacturing Corp. (PSMC) chairman Frank Huang died on July 31, 2026, at age 76, closing a career that spanned...

    Saturday 1 August 2026
    Tandem OLED clears key automotive qualification hurdle, wider adoption expected after 2030

    LCD panels still account for more than 90% of automotive display shipments, but OLED has now crossed a critical qualification threshold...

    Saturday 1 August 2026
    Thintronics wins proposed US CHIPS incentives for advanced substrate technology
    Thintronics, a semiconductor interconnect company, said in a press release on July 29 that it had signed a letter of intent with the US Department of Commerce and the CHIPS Research...
    Saturday 1 August 2026
    Lite-On expands InP optical push with US$34.3 million stake in Singapore's DenseLight
    Lite-On Technology is extending its optical core competencies into system-level optical communications for AI data centers, announcing a US$34.3 million investment for a 21% stake...
    Friday 31 July 2026
    MJ Taiwan names Maverick Shih chair, prioritizes AI, cybersecurity and space technologies

    The Monte Jade Science and Technology Association of Taiwan (MJ Taiwan) elected Maverick Shih, chairman of Acer Cyber Security (ACSI),...

    Friday 31 July 2026
    Elon Musk denies rumored Tesla China contingency plans; discussions on supply chain localization shifts persist
    Tesla CEO Elon Musk has denied a Wall Street Journal report on an internal plan within Tesla to prepare for a possible separation of its China operations. Despite his rebuttal,...
    Friday 31 July 2026
    Research Insight: CXMT reaches 7.67% DRAM share with US$4.4B IPO, 2028 tech roadmap
    CXMT's IPO marks a shift in China's DRAM strategy from capacity building towards mainstream products, process upgrades, and global competition, according to DIGITIMES Intelligence.
    Friday 31 July 2026
    Kioxia begins sampling 1TB 3D flash memory for AI devices
    Kioxia has begun shipping samples of 1TB triple-level cell memory devices built with its 9th-generation BiCS FLASH 3D flash memory technology. The move signals faster, lower-cost storage...
    Friday 31 July 2026
    TSMC reportedly develops EMIB-like packaging to counter Intel

    TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB),...

    1/159 pages
    Research Report Database
    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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