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Thursday 15 October 2026
TSMC CEO says profitability has no ceiling, plans High-NA EUV adoption in 2030
TSMC chairman and CEO C.C. Wei said on October 15 that the chipmaker sees no ceiling on its profitability as demand for AI accelerators continues to outpace supply. Wei also said AI-related...
Thursday 15 October 2026
Samsung reportedly completes 4F² DRAM development as China's CXMT targets year-end launch
Samsung Electronics has reportedly completed development of next-generation 4F² DRAM technology and is aligning commercialization with customer requirements, even as China's ChangXin...
Thursday 15 October 2026
Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints?
On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding...
Thursday 15 October 2026
Delta Electronics targets SOFC pilot production by year-end, partners with Great Taipei Gas on 550kW installation
Delta Electronics showcased its on-site solid oxide fuel cell (SOFC) power generation solution at Energy Taiwan 2026, alongside its first physical solid-state transformer (SST) pro...
Thursday 15 October 2026
Synopsys CEO says fully autonomous AI chip design remains out of reach
Synopsys CEO Sassine Ghazi said that fully autonomous chip development has not yet crossed the final hurdle to become reality, although the company has advanced from AI-assisted engineering...
Thursday 15 October 2026
Samsung, Applied Materials back startup targeting chip packaging warpage
Samsung Ventures and Applied Ventures, the venture capital arm of Applied Materials, have invested in US-based Flexcompute, backing simulation technology designed to predict semiconductor...
Thursday 15 October 2026
AUO-backed Star Shining Energy targets 2028 IPO with shift from solar assets to energy technology
Star Shining Energy Holdings (SSEH) acquired Star Shining Enetek Corporation (Enetek), a spin-off of AUO's energy business, on October 1, 2026, combining power generation assets with...
Thursday 15 October 2026
Taiwan Perovskite Solar Corp. deploys AI to optimize R&D, explore smart energy applications
Taiwan Perovskite Solar Corp. (TPSC) showcased its theme, "PEROVSKITE AI," at Energy Taiwan 2026, highlighting a two-way synergy between artificial intelligence and perovskite technology...
Thursday 15 October 2026
Genius Electronic Optical secures US$150 million 3M investment for optical communications
Genius Electronic Optical, a leading manufacturer of optical lenses and precision optical components, announced on October 15 that it had formed a strategic partnership with 3M, a...
Thursday 15 October 2026
Premium PC demand fuels tandem OLED race between Samsung Display, LG Display
Competition in the global PC market is shifting from a focus on shipment volumes of low-cost models towards premium, high-performance devices, intensifying the race in OLED display...
Thursday 15 October 2026
Vietnam's FPT courts Toyota Tsusho unit to sell its power chips in Southeast Asia, India
Vietnamese technology group FPT is lining up a second Japanese distribution channel for its in-house power chips, a move that would carry Vietnamese-designed semiconductors beyond...
Thursday 15 October 2026
IBM, MeitY Startup Hub sign pact to boost India's deep tech startups
IBM and MeitY Startup Hub, an initiative of India's Ministry of Electronics and Information Technology (MeitY), have signed a memorandum of understanding (MoU) to support India's deep...
Thursday 15 October 2026
Auden expects stronger growth in 2027, sees satellite industry taking another 2–3 years to gain momentum
RF antenna and communications technology company Auden Techno recently inaugurated its global headquarters and R&D center in Bade, Taoyuan. Chairman Chang Yu-Pin said the company's...
Thursday 15 October 2026
Nvidia pledges US$250M in AI safety research to UK, CEO defends industry's approach
Nvidia will provide the UK with US$250 million worth of computing resources over five years to support AI safety research, as CEO Jensen Huang defended the industry's ability to manage...
Thursday 15 October 2026
SEMI sees glass substrates entering market by 2028
The rapid expansion of AI and data center chip package sizes is accelerating the adoption of glass substrates, with SEMI's Beth Keser now forecasting market entry around 2028, two...