The rapid expansion of AI applications is redefining what device makers need from display technology.
BOE, China's leading display panel maker, is accelerating its move into next-generation packaging technologies for the AI era. The company...
TSMC has accelerated efforts to localize its supply chain in recent years, using joint development, joint validation, and long-term...
China's AI chip sector has a heavyweight new entrant: veteran semiconductor figure Shaojun Wei has formally unveiled Shanghai Orient...
Huawei is reportedly preparing to launch its AI chips in South Korea for the first time in the fourth quarter of 2026, as rising demand...
Supermicro has pushed back against media characterizations of this week's events in Taiwan, saying the company is a cooperating party...
Socionext announced that it would develop a high-performance compute chiplet using TSMC's A14 process technology, positioning the project...
