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Sunday 6 September 2026
TEL sees AI-driven packaging, memory demand reshaping Taiwan strategy
Tokyo Electron's Taiwan president said AI is pushing semiconductor demand into new areas, with advanced packaging, DRAM, high-bandwidth memory, and NAND flash all gaining momentum...
Sunday 6 September 2026
K-Safety Expo 2026: Safety gets smarter as six innovators win foreign media honors
The BEST OF K-SAFETY EXPO Global Media Awards on September 3 offered a revealing snapshot of where safety technology is heading: away from passive protection and toward systems that...
Sunday 6 September 2026
Taiwan thermal supplier I-Chiun launches AI chip cooling venture targeting US$19.2B liquid-cooling market
I-Chiun Precision Industry and Taiwan's Industrial Technology Research Institute (ITRI) have established Huizhi Advanced, the country's first startup focused on AI chip thermal design,...
Sunday 6 September 2026
G20 AI agenda: US champions light-touch regulation while data center backlash, China rivalry intensify
The G20 Innovation Ministerial was held in North Carolina, US, from September 1 to 2, with artificial intelligence (AI) taking center stage. The US urged governments to pursue a light-touch...
Sunday 6 September 2026
Trumpf CTO says advanced packaging reshapes semiconductor equipment race
AI and high-performance computing (HPC) demand is changing the semiconductor industry's technology and investment priorities. As chip power consumption, computing density, and data...
Saturday 5 September 2026
Exclusive: South Korea's safety AI boom is being built from the top down, BEXCO says
South Korea's safety-tech sector may be increasingly filled with AI cameras, robots, drones, and predictive systems, but BEXCO general manager Tom Choi argues that the force pushing...
Saturday 5 September 2026
Topco targets optical comms, cooling as copper gives way
System integration remains a key hurdle as the AI chip industry pushes for higher power efficiency and faster transmission speeds, drawing intense attention to when short-reach optical...
Saturday 5 September 2026
TSMC's 3D packaging roadmap: engineering AI chips to think like the human brain
TSMC is steering the future of artificial intelligence toward high-density three-dimensional advanced packaging designed to mimic the architectural connectivity of the human brain,...
Saturday 5 September 2026
Commentary: China builds three-pronged memory strategy around CXMT, YMTC, XMC
China's memory industry is shifting from a single-champion model towards a three-pronged structure. ChangXin Memory Technologies (CXMT) is building its position in DRAM, Yangtze Memory...
Saturday 5 September 2026
Jmem Tek's PQC security chip nears mass production
Taiwanese IC design startup Jmem Tek showcased its in-house physical unclonable function (PUF) and post-quantum cryptography (PQC) hardware security technologies at SEMICON Taiwan...
Friday 4 September 2026
South Korea taps chip windfall for next tech push
South Korea is turning a semiconductor-driven tax windfall into a broader technology investment push, directing record fiscal firepower toward chips, Nvidia's Vera Rubin computing...
Friday 4 September 2026
Samsung turns to chips, OLED for next phase of Vietnam expansion
Samsung is expanding its Vietnam footprint beyond smartphones, with semiconductor testing, high-end chip substrates, OLED displays and R&D emerging as the next pillars of its presence...
Friday 4 September 2026
Taiwan to expand AI compute capacity as supercomputer at research institute hits full load
Taiwan is racing to expand its AI compute capacity as demand for AI chips, GPUs and AI servers surges, with compute infrastructure now central to national competitiveness. According...
Friday 4 September 2026
China's EUV gap may stretch 10–15 years, but DUV gains test Western export controls
China may remain 10–15 years away from developing domestic extreme ultraviolet (EUV) lithography, according to assessments from UBS and Zeiss, highlighting the technological...
Friday 4 September 2026
Moonshot AI reportedly files for Hong Kong IPO, targets US$3B
Chinese AI startup Moonshot AI has reportedly filed confidentially for an initial public offering in Hong Kong, potentially setting up one of the city's most closely watched technology...