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Tuesday 26 May 2026
China pushes homegrown AI stack with local chips, LLMs

Following the conclusion of the Trump-Xi meeting and amid continued delays in China approving imports of Nvidia H20 GPUs, China's National...

Tuesday 26 May 2026
Micron expands US DDR4 output as AI keeps global supply tight
As Micron Technology's decision to restart large-scale DDR4 production in the US grabs global attention, memory-chip executives and analysts say the move is less a revival of aging...
Tuesday 26 May 2026
Lightmatter joins TSMC on COUPE for 3D optical engines
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter...
Tuesday 26 May 2026
Samsung unveils industry-first 6K Odyssey gaming monitor as China ramps panel competition
Samsung Electronics announced a new 2026 gaming monitor lineup that includes the industry's first 6K (6,144×3,456) gaming display, positioning the company to defend high-end...
Tuesday 26 May 2026
SK hynix unveils 'iHBM' thermal solution to boost AI performance

SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs) within the high-bandwidth...

Tuesday 26 May 2026
Samsung's silicon photonics push adds new layer to Korea-Dutch chip ties

South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon...

Tuesday 26 May 2026
Kioxia targets 2027 BiCS 10 NAND production as Samsung, SK Hynix hold back investment
Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK...
Tuesday 26 May 2026
TSMC promises faster bonus growth in 2026 after employees threaten Samsung-style strike
Taiwan Semiconductor Manufacturing Company (TSMC) will reportedly cut employee bonuses by 15%, prompting some employees to voice dissatisfaction on social media. They argued that while...
Monday 25 May 2026
Micron maps out HBM roadmap with 2027 HBM4E debut and custom AI memory designs
Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products...
Monday 25 May 2026
CATL weighs stake in AI startup deepSeek

According to several people familiar with the matter, Contemporary Amperex Technology Limited (CATL), the world's largest maker of electric-vehicle...

Monday 25 May 2026
Kawasaki opens Silicon Valley physical AI center, deepening Nvidia ties
Kawasaki Heavy Industries has opened the Kawasaki Physical AI Center in San Jose to accelerate real-world deployment of physical AI and strengthen Japan–US collaboration in AI...
Monday 25 May 2026
Huawei bypasses 3D NAND limits with 122TB AI SSD packaging breakthrough

Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies...

Monday 25 May 2026
Exclusive: G2 Lithium battery rivalry heats up—US taps 4th-gen LFP to crack China's patent wall
The US is shifting from ternary batteries used in electric vehicles (EVs) toward lithium iron phosphate (LFP) batteries for both energy storage and automotive applications. This is...
Monday 25 May 2026
Analysis: Lisa Su moves on China — and Nvidia's CUDA moat
For AMD CEO Lisa Su, the current moment presents an opening that Nvidia does not have. Nvidia's high-end chips have repeatedly faced scrutiny and export restrictions in China, and...
Monday 25 May 2026
Stellantis and Qualcomm expand Snapdragon Digital Chassis deployment across global vehicle lines
Stellantis and Qualcomm expanded their multi-year collaboration to deploy Snapdragon Digital Chassis system-on-chip (SoC) solutions across Stellantis' global vehicle portfolio, affecting...