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Friday 21 August 2026
FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus...

Friday 21 August 2026
Analyst: CPO gains momentum as AI interconnect demands outpace chip gains
The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...
Friday 21 August 2026
Micron launches long-horizon research hub to push memory and AI development
Micron's new US research hub could influence how future AI systems are built, stored, and scaled, with implications that extend well beyond America. The planned US$10 billion effort...
Friday 21 August 2026
US ban on robot dogs clears the way for Taiwan's Swancor
To safeguard national security and the development of the AI supply chain, the US has banned imports of advanced humanoid robots. Against that backdrop, Taiwan-based Swancor unveiled...
Friday 21 August 2026
JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging
JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities...
Friday 21 August 2026
Korean display makers step up OLED patent push as China narrows technology gap
Korean display makers are stepping up patent licensing and cross-border enforcement as Chinese rivals have sharply narrowed the technology and market-share gap in OLED since 2020,...
Friday 21 August 2026
Samsung holds off on High-NA EUV until 1nm production
Samsung Electronics does not expect to move High-NA EUV lithography into volume production until its 1nm-class generation, a timeline that points to around 2030, after it had earlier...
Friday 21 August 2026
Column: Is 800V really 'high voltage'? —AI data centers revive an old power debate
High-voltage direct current (HVDC) is currently one of the hottest areas of technology and product development for AI data centers. It is not only the first layer of what Nvidia CEO...
Thursday 20 August 2026
Unitree post-IPO: Chairman Wang weighs profit, scale and 80% home-robot threshold

Unitree Robotics' August 19 listing on China's STAR Market brought the humanoid robot maker into the public-market spotlight, but attention...

Thursday 20 August 2026
Nexcom brings together dozens of partners to build open AI robotics ecosystem
Industrial computer (IPC) maker Nexcom International on August 19 officially unveiled its RoboWIZ AI Robotics Open Platform concept at the 2026 Automation Taipei exhibition, bringing...
Thursday 20 August 2026
Commentary: How iPad Air became a catalyst for IT OLED expansion
Apple kicked off the tablet OLED era in 2024, introducing Tandem OLED in the iPad Pro to overcome bottlenecks in display lifespan and brightness. The iPad mini followed, set to adopt...
Thursday 20 August 2026
OpenAI signals IPO could wait until 2027 as Anthropic weighs listing

OpenAI told employees it could go public in 2027, though an earlier listing remains possible if operating conditions improve. According...

Thursday 20 August 2026
Corning-IRICO Trade Secret Case Enters New Phase

The intellectual property dispute between Corning and China-based IRICO has entered a new phase at the U.S. International Trade Commission (ITC), with the focus shifting...

Thursday 20 August 2026
Xiaomi's robotics ambitions reveal the next battleground for industrial AI

As artificial intelligence expands from digital environments into physical operations, embodied intelligence is emerging as a new frontier...

Thursday 20 August 2026
Xiaomi's AI strategy moves beyond models as MiMo becomes the intelligence layer across human-car-home ecosystem

As competition in artificial intelligence shifts from model development toward real-world deployment, Xiaomi is betting that its advantage...