South Korea's Future Innovation Tech Expo (FIX 2026) will open in Daegu on October 21, with HD Hyundai Robotics and Doosan Robotics among the industrial robot makers exhibiting. The...
The 2026 OCP Global Summit, held from October 12 to 15 in San Jose, California, highlighted a shift from open server hardware to open AI infrastructure. Rack-scale standardization...
Samsung Electronics is developing the Exynos 2700 for broader use across its Galaxy S27 lineup in 2027, while Huawei has moved its next-generation Kirin chips into testing. The competing...
Chenming Hu co-invented the FinFET transistor with colleagues at the University of California, Berkeley, in the 1990s and became TSMC's first chief technology officer in 2001. Decades...
Tesla CEO Elon Musk has predicted a surge in Chinese memory chip production by 2028, raising questions over Samsung Electronics and SK Hynix's pricing power during an AI-driven dynamic...
ACM Research is expanding beyond China as its panel-level packaging equipment advances through customer evaluations in Taiwan, while the US semiconductor equipment maker invests in...
Canon Marketing Taiwan President Hu Da-gang said the global camera market performed well in 2026, with demand rebounding after the pandemic and smartphone photography helping cultivate...
The foundations of TSMC's modern-day success can be traced back to a public call from the US Defense Advanced Research Projects Agency (DARPA) for innovative designs that could break...
German equipment maker Von Ardenne is entering the semiconductor industry with coating technology aimed at panel-level packaging, a segment where the choice among competing panel dimensions...
Spanish semiconductor metrology startup Wooptix, whose technology originated in astronomical observation, is accelerating efforts to enter the supply chains of leading semiconductor...
Toyota Motor will introduce its proprietary gigacasting technology in China to produce premium vehicles, while it has not disclosed whether it will use equipment from local Chinese...
Surging AI-driven chip demand has extended order visibility for Zeiss, a key supplier of extreme ultraviolet (EUV) lithography optics. Christoph Hensche, president of Zeiss Semiconductor...
SK Hynix is strengthening its metrology and inspection (MI) capabilities as the transition toward 3D DRAM architectures and increasingly complex NAND stacking creates new challenges...
AUO chairman Paul Peng said Micro LED remains a potential option for optical communications, despite Largan Technology's doubts about pairing it with multimode fiber in co-packaged...
China is moving to tighten oversight of technology transfers that support its companies' overseas expansion, proposing export bans and licensing requirements for artificial intelligence...
