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Tuesday 2 June 2026
Samsung signals broader AI memory deployment with HBM5 roadmap and thermal tech
Samsung Electronics has used Computex 2026 to outline a broader AI memory strategy, highlighting HBM5, thermal management, and advanced packaging as it prepares for next-generation...
Tuesday 2 June 2026
Qisda deepens AI push as it eyes rebound in 2026
Qisda Corporation is accelerating its AI strategy across its core businesses, with chairman Peter Chen saying the technology is still in its early stages but is already reshaping daily...
Tuesday 2 June 2026
Ennoconn expects AI business to surpass NT$10 billion in 2026
Ennoconn, a Taiwan-based industrial PC (IPC) vendor, said on June 1 at a forum in Taipei that its physical AI business is expected to exceed NT$10 billion (US$318.93 million) in 2026,...
Tuesday 2 June 2026
TSMC races to expand AI chip capacity while CPO and CoWoS move to center stage
Nvidia GTC Taipei opened on June 1 with a packed keynote by CEO Jensen Huang, who kicked off the event by unveiling the widely watched Taiwan supply chain board.
Tuesday 2 June 2026
Marvell CEO says copper wall is moving inside the rack, and co-packaged optics is the only way through
On the first day of Computex 2026 in Taipei, Marvell Technology CEO Matt Murphy made a pointed argument to an audience of industry insiders: the next major bottleneck in AI infrastructure...
Tuesday 2 June 2026
ASE CEO says Taiwan's semiconductor ecosystem took 40 years to build — and will take years to replicate
When Marvell CEO Matt Murphy asked ASE Group CEO Tien Wu what makes Taiwan's technology ecosystem unique — and why it is so hard to replicate elsewhere — the answer was...
Tuesday 2 June 2026
Jensen Huang joins Marvell CEO on Computex stage, hails it as 'the next trillion-dollar company'
Nvidia CEO Jensen Huang made a surprise guest appearance during Marvell Technology CEO Matt Murphy's keynote at Computex 2026 in Taipei on June 2, joining Murphy on stage for about...
Tuesday 2 June 2026
SK Hynix reportedly preparing Dalian fab for 200-layer FG NAND to capture AI storage demand
SK Hynix is reportedly preparing to mass-produce a new generation of 200-layer-class NAND flash memory based on floating-gate (FG) architecture at its Dalian Phase 2 facility in China,...
Tuesday 2 June 2026
OpenAI expands robotics ambitions, recruiting engineers for hardware and AI development
OpenAI is expanding its robotics efforts and recruiting engineers across hardware, operations, systems, and machine learning to develop robots capable of performing useful tasks in...
Tuesday 2 June 2026
Phison and Intel roll out aiDAPTIV to boost local AI on Intel AI PC platforms
Phison Electronics announced a collaboration with Intel to bring aiDAPTIV memory extension technology to Intel AI PC platforms running Intel Core Ultra processors, aiming to enable...
Tuesday 2 June 2026
GCS Shenzhen connects Chinese brands with global markets
Global Connect Show Shenzhen 2026 (GCS SZ 2026) was successfully held on June 1 in Shenzhen, China's innovation hub. Under the theme "Where Global Innovation Meets Market Opportunity,"...
Tuesday 2 June 2026
Zhen Ding joins Nvidia MGX ecosystem to supply cable-free PCB technology for AI factories
PCB manufacturer Zhen Ding announced it had joined Nvidia's MGX ecosystem to support the deployment of the chipmaker's third-generation MGX modular architecture, which uses a PCB-based...
Tuesday 2 June 2026
Enterprise AI spending slows as token costs outpace measurable returns
Corporate adoption of artificial intelligence tools has cooled as firms across technology and consumer sectors flagged soaring token costs and uncertain returns, according to recent...
Tuesday 2 June 2026
DeepSeek's pricing move could redistribute value across AI hardware market
Chinese AI startup DeepSeek said it will permanently cut the API price of its flagship model by 75% from June 1, prompting debate across the global AI industry. Amazon AWS said the...