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Tuesday 23 June 2026
China's Starlink challenger Qianfan seeks US$740M backers for LEO satellite expansion

Shanghai Spacecom Satellite Technology (SSST, also known as Ambandha), operator of China's Qianfan low Earth orbit (LEO) satellite...

Tuesday 23 June 2026
AI data center buildout fuels optical interconnect race, but 6-inch InP wafers hit supply wall

Technology giants are continuing to expand AI computing infrastructure, driving demand for high-performance optical interconnect components...

Tuesday 23 June 2026
South Korea takes physical AI push from policy to practice

South Korea has moved its Physical AI Alliance from a policy-setting body into an operational platform, as the government and companies...

Tuesday 23 June 2026
Nearfield Instruments raises US$380M in record Dutch deep-tech funding round

Dutch semiconductor metrology specialist Nearfield Instruments has secured US$380 million in Series D funding, marking the largest...

Tuesday 23 June 2026
Trump signs executive order to accelerate US quantum tech leadership

US President Donald Trump has signed Executive Order 14411, titled "Ushering in the Next Frontier of Quantum Innovation," launching...

Tuesday 23 June 2026
Thailand approves semiconductor strategy, targets investment and talent growth
Thailand's newly established National Semiconductor and Advanced Electronics Policy Committee has approved the framework for a national semiconductor strategy and a workforce development...
Tuesday 23 June 2026
LTO Batteries power up industrial electrification: Taiwan and South Korea players widen global deployments
Lithium titanate oxide (LTO) batteries are emerging as a promising solution for industrial electrification and critical energy infrastructure, where safety, rapid charging and long...
Tuesday 23 June 2026
LG Magna turns profitable in 1Q26 on EV motor push
LG Magna e-Powertrain returned to profit in the first quarter of 2026 as higher utilization at its Mexico plant lifted performance. Facing the rapid rise of China's electric vehicle...
Monday 22 June 2026
Intel CEO doubles down on advanced packaging with former SK Hynix chief's return
Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies...
Monday 22 June 2026
MW-level flash charging competition escalates as BYD, Geely, CATL compete for industry influence
In China's new energy vehicle (NEV) market, industry leader BYD introduced megawatt-level (MW) flash charging technology more than a year ago and further enhanced its fast-charging...
Monday 22 June 2026
TSMC glass substrate rollout unlikely before 2030

The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving...

Monday 22 June 2026
Google loses Gemini co-lead as engineering VP joins OpenAI to research model building
Google Vice President of Engineering and Gemini model co-lead Noam Shazeer has left the company to join OpenAI, where he will focus on research into model-building methods, executives...
Monday 22 June 2026
The car that changes color: Behind BMW's five-year journey from prototype to production

Among the highlights of COMPUTEX 2026 was a color-changing e-paper concept car jointly developed by BMW and E Ink Holdings. With its...

Monday 22 June 2026
YMTC NAND share rises to 13%, alarming South Korean rivals
China's memory makers are moving from technology catch-up to capital-market expansion, with ChangXin Memory Technologies' (CXMT) parent and Yangtze Memory Technology (YMTC) both preparing...
Monday 22 June 2026
Jio Platforms files draft paper for IPO
Jio Platforms Limited (JPL), the technology and digital services arm of Reliance Industries Limited, has formally initiated its public listing process by filing a Draft Red Herring...