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Wednesday 27 May 2026
China clears 9 domestic AI chips for state procurement
China has formally brought AI chips into its national security and reliability evaluation framework for the first time, marking a further expansion of the country's Information Technology...
Wednesday 27 May 2026
Qualcomm's ByteDance deal gives smartphone chipmaker entry into AI data center market
Qualcomm has reached a deal to supply AI data center chips to ByteDance, giving the US smartphone processor designer a potentially high-volume customer as it tries to expand into AI...
Wednesday 27 May 2026
Former Tencent AI lead says Chinese firms are trailing US on core LLM innovation
A former Tencent large-model technical chief warned that Chinese artificial intelligence companies lack independent paradigm-level breakthroughs and are trailing US rivals, according...
Wednesday 27 May 2026
Taiwan optoelectronics materials maker Wah Hong targets high-end PCB and chip packaging demand

AI, low-carbon sustainability, smart cities, and advanced displays are set to drive the global optoelectronics industry in 2026, shifting...

Wednesday 27 May 2026
SK Hynix seeks to embed cooling inside HBM to beat the heat
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into...
Wednesday 27 May 2026
Taiwan's quiet fix for GPS-denied drones and satellites
At the Plug and Play May Summit in Sunnyvale, a Taiwanese startup called Aegiverse quietly made its case to US defense and aerospace investors — not with flashy slides or moonshot...
Wednesday 27 May 2026
Thunder Tiger, Elan eye defense and commercial drone markets

Thunder Tiger said on May 26 that it has signed a memorandum of understanding (MoU) with Elan Microelectronics to jointly develop AI...

Tuesday 26 May 2026
LED maker Ennostar pivots to optical interconnects after high-value shift agin traction
Ennostar Holdings' transformation has begun to show clear results, with chairman Paul Peng saying the company's "3+1" strategy is taking shape, as higher-value applications now account...
Tuesday 26 May 2026
Nvidia and Marvell CEOs to share Computex stage— How US$2 billion turned rivals into partners
When Nvidia quietly wrote a US$2 billion check to Marvell Technology earlier this year, it was less a financial bet than a strategic maneuver — one that converted a potential...
Tuesday 26 May 2026
The US$16.5 Billion Bet: How Co-Packaged Optics Will Rewire AI's Backbone by 2030
As AI clusters continue to scale, traditional interconnect architectures are facing new limits in bandwidth, power efficiency, and system integration. Co-Packaged Optics is emerging...
Tuesday 26 May 2026
Samsung's reported 900-layer V-NAND prototype puts NAND race with YMTC in focus
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has...
Tuesday 26 May 2026
E Ink brings BMW-backed color-changing e-paper car tech to Computex 2026

E Ink will bring its BMW-backed color-changing e-paper vehicle technology to Computex 2026, showcasing the hood structure of the BMW iX3...

Tuesday 26 May 2026
Intel's Rio Rancho fab becomes test case for AI-era chip packaging
Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions...
Tuesday 26 May 2026
Huawei eyes AI storage breakthrough with DoB packaging, 245TB SSD roadmap
Huawei has released its Data Storage 2030 white paper, setting out a technology roadmap for the global storage industry over the next five to...
Tuesday 26 May 2026
Analysis: Huawei's Tau Law signals a new semiconductor framework — with implications beyond China
As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced...