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Tuesday 14 July 2026
China quantum research wins UNESCO, IEEE honors
China's quantum technology research has drawn renewed international academic recognition. The University of Science and Technology of China (USTC) said Chinese Academy of Sciences...
Tuesday 14 July 2026
China launches first 8-inch 2D chip line to bypass EUV limits

Shanghai AtomIC Technology has launched what it describes as the world's first 8-inch pilot line for two-dimensional semiconductors, marking...

Tuesday 14 July 2026
Samsung brings HBM, logic, and optics together in packaging push
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising...
Tuesday 14 July 2026
Column: Physical AI's rivalry shifts from companies to states

At the Humanoids Summit in Tokyo at the end of May 2026, a conference that had originally focused on technology and commercialization...

Tuesday 14 July 2026
Commentary: Forget AI chips — China's top science awards reveal what Beijing is actually building
China has nine years left to meet its goal of becoming a global science and technology powerhouse by 2035.
Tuesday 14 July 2026
Interview: UK's AI sovereignty pitch — research at home, scale with Taiwan

As the world enters an AI-centric era, the global race for technological leadership is no longer defined only by who can build the...

Monday 13 July 2026
SK Hynix shares plunge after blockbuster Nasdaq ADR debut

SK hynix shares suffered their steepest-ever decline on Monday, just one trading day after the memory chipmaker made a strong debut...

Monday 13 July 2026
Intel eyes dual-side power in 1.4nm push against TSMC

Intel is reportedly preparing a new technology roadmap for its next-generation 1.4nm process, 14A2, as it evaluates a hybrid architecture...

Monday 13 July 2026
TSMC June 2026 revenue surges 68% as AI demand continues to fuel growth
TSMC reported another month of strong revenue growth, underscoring continued demand for advanced chips used in AI applications. According to the company's June revenue report, consolidated...
Monday 13 July 2026
Tencent seeks control of Manus after China blocks Meta's US$2 billion AI deal

Tencent is in talks to become the largest shareholder in Manus, leading a proposed buyback of the AI agent startup after Chinese regulators...

Monday 13 July 2026
CPO mass production accelerates new four-stage test equipment market
AI-driven demand is accelerating the shift of co-packaged optics (CPO) from technology validation to mass production, triggering a new wave of equipment demand. Companies including...
Monday 13 July 2026
India opens first CMP pad technology hub in Hyderabad
India's first Chemical Mechanical Polishing pad technology hub could help reshape semiconductor supply chains far beyond the country. The new Hyderabad facility aims to build local...
Monday 13 July 2026
Taiwan's Jiin Ming joins Japan-Ukraine Drone Cluster talks on drone systems
Taiwanese drone manufacturer Jiin Ming Industry attended the launch press conference for the Japan-Ukraine Drone Cluster (JUDC) at the Foreign Correspondents' Club of Japan (FCCJ)...
Monday 13 July 2026
Europe, UK, and US financial sectors respond differently as advanced AI reshapes industry and regulation
Advanced artificial intelligence (AI) is becoming a growing focus for financial regulators and technology companies across Europe, the UK, and the US, with authorities placing increasing...
Monday 13 July 2026
SK Hynix hybrid bonding push signals next phase of HBM packaging race
SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging...