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Tuesday 22 September 2026
Hanmi Semiconductor ships first FC Bonder 75 for 2.5D packaging
Hanmi Semiconductor said on September 22 that it has shipped its first FC Bonder 75 to a customer, expanding the South Korean equipment maker's reach beyond high-bandwidth memory (HBM)...
Tuesday 22 September 2026
BOE looks beyond displays with glass substrates for AI packaging
Chinese display maker BOE Technology is expanding beyond its core panel business. Chairman Chen Yanshun said at the BOE Global Innovation Partner Conference 2026 on September 22 that...
Tuesday 22 September 2026
YMTC's capital arm enters FD-SOI — China's 12-inch SOI build-out gathers pace

China's FD-SOI supply chain is taking shape through a new round of investment. Changcun Capital, the investment platform backed by YMTC,...

Tuesday 22 September 2026
China's memory race turns inward — CXMT, YMTC head toward patent showdown

Global memory shortages remain severe, with AI and cloud applications intensifying demand for scarce supply. Prices for both DRAM and...

Tuesday 22 September 2026
Xpeng plans to license tech to more foreign automakers

Chinese EV maker Xpeng is planning to offer its technology to foreign automakers beyond Volkswagen, according to people familiar with...

Tuesday 22 September 2026
GUC Announces 2nm 16 Gbps HBM4E IP

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs....

Tuesday 22 September 2026
Acer founder urges talent, trust, and innovation in AI era
As the global order is being reshaped and AI is rapidly transforming economic and governance systems, Acer founder and StanShih Foundation chairman Stan Shih said leadership competitiveness...
Tuesday 22 September 2026
DIGITIMES Insight: Full-color Micro LED set to exceed 30% of AR glasses shipments in 2027

The industry has converged on a single precondition for consumer adoption of augmented reality (AR) glasses: the product must look like...

Monday 21 September 2026
SDC president declares foldable leadership, urges Korea to defend OLED advantage

Facing aggressive expansion by Chinese competitors, Samsung Display (SDC) president and Korea Display Industry Association (KDIA) chairman...

Monday 21 September 2026
Qisda leverages ICT foundation to build one-stop AI healthcare platform

Qisda is accelerating the integration of information and communications technology (ICT) with healthcare, turning its network of hospitals...

Monday 21 September 2026
Europe's hydrogen trucks chase commercialization
Major European truck makers and suppliers are accelerating alliances to push hydrogen vehicles and refueling infrastructure, as Europe tightens emissions rules and automakers race...
Monday 21 September 2026
Leading Interconnect Semiconductor starts Shenzhen advanced packaging substrate plant

Leading Interconnect Semiconductor, a Zhen Ding Technology subsidiary, has broken ground on an AI advanced packaging substrate project...

Monday 21 September 2026
Microsoft AI chief says regulation is not a bad thing
Silicon Valley's AI safety debate is increasingly splitting into two camps; Microsoft AI chief Mustafa Suleyman says science and technology should serve humanity, that companies should...
Monday 21 September 2026
First Solar withdraws 337 case, shifts TOPCon patent fight

US-based First Solar, best known for thin-film solar production, plans to withdraw its Section 337 complaint under the Tariff Act of...

Monday 21 September 2026
Acer founder says slowing AI development will be hard, amid call for AI slowdown

Acer founder Stan Shih stated that slowing artificial intelligence (AI) growth is not easy, as semiconductor capacity is still insufficient...