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Friday 31 July 2026
WAIC 2026 unveils AIDV shift as physical AI gains ground
DIGITIMES Intelligence said its observations at the 2026 World Artificial Intelligence Conference (WAIC) show the automotive industry's transformation moving from software-defined...
Friday 31 July 2026
ams OSRAM's Micro LED links trade speed for scale in AI data centres

ams OSRAM is developing Micro LED-based optical data links for AI data centres, positioning the technology as a high-density, scalable...

Friday 31 July 2026
TAIONE foundation launches with NT$300 million to build Taiwan's open source AI push
The TAIONE Open Source Foundation was officially launched on the 30th and said it will deploy NT$300 million in private-sector resources over the next three years to advance open-source...
Friday 31 July 2026
Automakers shift to larger in-car displays as smaller center screens decline
Global automakers are moving toward larger, more integrated cockpit displays as in-car screens become the main interface between drivers, passengers, and vehicles. According to Counterpoint...
Thursday 30 July 2026
South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand

Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth...

Thursday 30 July 2026
China's DUV shock: the secretive Aishengna rattles ASML with US$1B state backing

China's immersion DUV lithography programme has brought a little-known state-backed company into focus. Shanghai Aishengna Electronic...

Thursday 30 July 2026
GlobalFoundries lands US$300M CHIPS backing for AI silicon photonics

GlobalFoundries has signed a letter of intent with the US Department of Commerce for a potential US$300 million award to accelerate...

Thursday 30 July 2026
China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
China's 28nm DUV lithography programme has entered a new phase after Shanghai Aishengna Electronic Technology delivered its first five immersion deep ultraviolet lithography system...
Thursday 30 July 2026
US rallies global partners on 6G as competition with China intensifies

The US government has launched a multinational initiative to coordinate 6G development, signaling a new phase in the global race to shape...

Thursday 30 July 2026
Ennoconn deepens Singapore push with SMF pact and AI forum

Ennoconn Technologies held its 2026 Semiconductor x AI Applications Forum at Google's Asia-Pacific headquarters in Singapore on July...

Thursday 30 July 2026
Qualcomm's push into data centers and cars signals a broader shift in chip strategy

Qualcomm is moving more aggressively into data centers and automotive technology, aiming to reduce its dependence on smartphones and...

Thursday 30 July 2026
Marvell plans US$250 million India investment to expand semiconductor R&D
Marvell Technology said its planned US$250 million investment in India over three years will deepen semiconductor research, hiring, and infrastructure, with implications for global...
Thursday 30 July 2026
India launches homegrown silicon photonics tools to widen access for researchers and industry

India has launched two indigenously developed silicon photonics solutions to strengthen local chip design and testing capabilities...

Thursday 30 July 2026
Roborock sees Taiwan as a test market for smart cleaning devices

A once-mocked robot vacuum category has become central to smart home cleaning as busy lifestyles, health concerns, and climate conditions...

Thursday 30 July 2026
Kinko says Taiwan optics can cut AR glasses weight and cost for mainstream adoption
AR smart glasses are shaping up as the next revolutionary device after PCs, smartphones, and smartwatches, but the global optics supply chain still faces a major hurdle: making them...