中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    SMIC reenters advanced packaging with major team expansion in Shanghai
    Apr 23, 19:04
    Taiwan govt courts Foxconn to invest in AI computing centers with tax incentives
    Apr 23, 19:04
    Zhen Ding invests CNY40 billion in Huai'an to expand high-end PCB capacity for AI supply chain
    Apr 23, 19:04
    SK Hynix reinforced collab with TSMC at North America technology forum
    Apr 23, 19:04
    Google leads ASIC server growth with rising Taiwan foundry involvement
    Apr 23, 19:04
    Chip assembly and testing supply tightness drives major cost pressure for chipmakers
    Apr 23, 19:04
    NEWS TAGGED TECHNOLOGY
    Friday 24 April 2026
    Analysis: Energy costs drive shift towards hybrids and EVs
    Rising geopolitical tensions and the resulting surge in energy prices have pushed global crude oil costs higher, intensifying what some analysts describe as "green inflation" as higher...
    Friday 24 April 2026
    Global PMX drives smart driving transformation with three key engines
    Global PMX's shift from components maker to technology integrator could affect supply chains worldwide, as its push into electro-mechanical brakes, AI server cooling, and surgical...
    Friday 24 April 2026
    GMI pursues vertical integration amid surging AI leasing demand
    GMI Technology is transitioning from its role as an electronics distributor into an AI technology integration and application company, building vertically integrated capabilities from...
    Friday 24 April 2026
    Asia Optical and Frore Systems team up on AI data center cooling
    Asia Optical has signed a memorandum of understanding with Frore Systems to jointly develop liquid-cooling solutions for artificial intelligence data centers, as surging computing...
    Friday 24 April 2026
    Taiwan expands industry collaboration to advance unmanned vehicle R&D
    Taiwan's military-industrial sector, led by the National Chung-Shan Institute of Science & Technology (NCSIST), recently signed a memorandum of understanding (MOU) with Taiwan's...
    Thursday 23 April 2026
    SaiMemory wins NEDO backing for next-generation ZAM memory, partners with Intel

    SaiMemory, a next-generation memory developer established by SoftBank, said on April 22 that its development project has been selected...

    Thursday 23 April 2026
    Former Samsung Electronics researcher sentenced to 7-year prison term for leaking DRAM trade secrets
    A former researcher at Samsung Electronics was sentenced to seven years in prison on April 22 by a South Korean court for leaking core semiconductor trade secrets to a Chinese competitor...
    Thursday 23 April 2026
    LG Display approves KRW1.1 trillion OLED infrastructure investment
    LG Display approved an investment of KRW1.1 trillion (approx. US$740 million) to build OLED technology infrastructure. The move, running from April 22, 2026, to June 30, 2028, could...
    Thursday 23 April 2026
    Tesla tap Intel's advanced 14A chip for Terafab project
    Tesla plans to use advanced semiconductor manufacturing technology from Intel in its ambitious Terafab project, a development that could mark a significant milestone in Intel's efforts...
    Thursday 23 April 2026
    Japan's LSTC launches optoelectronic advanced packaging project around Rapidus cluster
    Research on optoelectronic integration — referring to the application of optical communication technology to computing — is gaining momentum. Its semiconductor packaging...
    Thursday 23 April 2026
    Apollo Power secures backing from SEEC, Phison, and Gigabyte for AI data center power solutions
    Apollo Power is targeting the behind-the-meter energy storage market in Taiwan through a partnership with Tesla to deploy the latter's Megapack enterprise-level energy storage systems...
    Thursday 23 April 2026
    TSMC targets 2029 production for A13 and A12 as next AI chip nodes
    At its North America Technology Symposium, TSMC showcased a range of innovations in advanced process technologies. Following the introduction of its A14 process in 2025, the company...
    Thursday 23 April 2026
    GUC Announces 3nm 12 Gbps HBM4 PHY and Controller

    Global Unichip Corp. (GUC), the advanced ASIC leader, today announced the successful demonstration of a 12 Gbps HBM4 IP platform implemented on TSMC's 3nm process technology...

    Thursday 23 April 2026
    Interview: Seiko Epson outlines engineered future vision for 2035 amid geopolitical challenges
    Amid volatile geopolitical tensions affecting Japan's components, manufacturing, and end-user sectors, Seiko Epson unveiled its Engineered Future 2035 long-term vision. The plan aims...
    Thursday 23 April 2026
    Pegatron chairman: Apple's leadership shift won't shake supply chain ties
    Apple has formally announced a leadership transition, naming its senior vice president of hardware engineering, John Ternus, as its next CEO. He is set to take over on September 1,...
    1/136 pages
    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook