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NEWS TAGGED TECHNOLOGY
Friday 28 August 2026
Foxconn eyes higher margins with push beyond contract manufacturing
AI adoption continues to expand, but putting the technology to work and integrating it into everyday operations remain key hurdles. Speaking at the 2026 Taiwan Sustainability Summit,...
Friday 28 August 2026
Apple's M6 marks a transitional step before wider 2nm adoption
Apple on August 25 unveiled the M6 and M5 Ultra chips without holding a launch event, with the M6 becoming the company's first processor built on TSMC's 2nm process and debuting in...
Friday 28 August 2026
Anthropic wins key ruling as judge voids Pentagon blacklist
A federal judge in San Francisco has blocked the US Department of Defense from placing Anthropic on a supply-chain risk blacklist and ordered the Trump administration to lift restrictions...
Friday 28 August 2026
China memory catch-up broadens: YMTC closes in on SK Hynix NAND share, CXMT advances DRAM tech
China's memory-chip industry is narrowing parts of the technology gap with global leaders on two fronts. YMTC is approaching SK Hynix in NAND revenue share while running a more advanced...
Friday 28 August 2026
Taiwan Mobile acquisition of Systex moves forward as review committee deems terms fair, reasonable
Taiwan Mobile's acquisition of Systex has moved forward, with Systex's tender offer review committee completing its review on August 27, concluding that the terms of the tender offer...
Friday 28 August 2026
Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production
Samsung Electronics' packaging technology lead, Lee Hee-seok, outlined the company's advanced semiconductor packaging roadmap at Advanced Semiconductor Packaging & Chiplet Show...
Friday 28 August 2026
Kioxia, Sandisk plan more than US$31 billion in Japan investments
A major chipmaking investment in Japan could ripple through global supply chains as demand for artificial intelligence infrastructure accelerates. Kioxia and Sandisk say the spending...
Thursday 27 August 2026
Doosan thins memory-package CCL insulation to 13µm
Doosan Corporation's Electro-Materials BG has developed copper-clad laminate (CCL) technology that reduces the prepreg (PPG) insulating layer used in memory semiconductor package substrates...
Thursday 27 August 2026
Washington's silicon-anode bet tests whether battery innovation can break China's graphite grip
The years-long tug-of-war between the US and China has witnessed a head-on showdown over technological might, as stringent export controls and tightening restrictions continue to push...
Thursday 27 August 2026
Tri-fold, rollable foldables intensify materials supply chain battle
Samsung Electronics' first tri-fold handset of 2025, the Galaxy Z TriFold, has repeatedly sold out, but with global shipments of only about 30,000 units, it functioned more as a technology...
Thursday 27 August 2026
AMD, Broadcom book most of Powertech's FOPLP capacity ahead of 2027 ramp
Powertech Technology (PTI) is preparing to move its fan-out panel-level packaging (FOPLP) technology into mass production by mid-2027. AMD and Broadcom are backing demand, and most...
Thursday 27 August 2026
Google, MediaTek embrace advanced packaging diversification
Google and MediaTek are moving toward advanced packaging diversification, as Intel's embedded multi-die interconnect bridge (EMIB) gains traction after Google's TPU was confirmed to...
Thursday 27 August 2026
Proton sales jump 39% as Malaysian automaker expands EV push
Proton said its vehicle sales rose 38.7% in the first seven months of 2026, as the Malaysian automaker highlighted new electrification and connected mobility technologies at GATE 2026...
Thursday 27 August 2026
5G-A low-latency breakthrough paves way for Physical AI, XR
Advances in low-latency and zero-latency wireless communications are seen as a critical foundation for physical AI, remote control, virtual reality (VR), augmented reality (AR), and...
Thursday 27 August 2026
ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026

Global technology and innovation leader ASMPT will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, taking place from September 2 to 4 in Taipei. At...