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Friday 5 June 2026
HBM is too expensive, DRAM can't scale — Kioxia tells Computex SSDs are the answer for agentic AI
Koichi Fukuda, technology executive for applied SSD technology at Kioxia, used a Computex 2026 forum session on June 4 to argue that as enterprise AI shifts toward agentic systems,...
Friday 5 June 2026
Marvell says SerDes and packaging are key hurdles in switch chip development
Marvell says the next gains in switch chip performance will depend on faster SerDes and better packaging — issues that affect network capacity, signal quality, and cost across...
Friday 5 June 2026
AI cooling demand is pushing server pumps into sharper focus
As AI pushes liquid cooling into mainstream server thermal design, suppliers are widening their focus beyond Nvidia's benchmark thermal designs. Industry players say pumps are emerging...
Friday 5 June 2026
CXMT's South Korean hiring spree puts Samsung, SK Hynix memory lead on alert
More than 200 South Korean engineers are conservatively estimated to be working at CXMT, China's leading DRAM maker, according to industry sources. Chinese semiconductor companies...
Friday 5 June 2026
Commentary: EU tariff barrier may weaken as Japanese automakers lean on China's EV tech
Japanese automakers' growing reliance on Chinese EV technology could weaken the EU's tariff strategy and reshape global car trade. As Mazda, Nissan, Honda, and Toyota adjust their...
Friday 5 June 2026
PEGATRON COMPUTEX AI from Cloud Infrastructure to the Physical World

PEGATRON Corporation (PEGATRON) officially opened its booth at COMPUTEX 2026, presenting its AI Tech Maker strategy and its role in helping move AI from infrastructure...

Friday 5 June 2026
Hiwin targets logistics automation with Dexterity dual-arm robot
Motion control component maker Hiwin made its first cross-sector appearance at COMPUTEX 2026, showcasing a full technology stack spanning precision transmission, actuator modules,...
Friday 5 June 2026
AI energy demand drives a shift to vertical power delivery and smaller modules
As the global demand for AI accelerates, a new industrial challenge has emerged: the sheer scale of energy required to power the "AI factories" of the future. This concern was the...
Thursday 4 June 2026
Anduril and Taiwan sign drone cooperation MOU to deepen AI-autonomy and localize supply chains
Anduril Industries and Taiwan's Metal Industries Research and Development Center signed a memorandum of understanding to deepen collaboration on unmanned aerial vehicle key technologies,...
Thursday 4 June 2026
LG Innotek targets Intel EMIB substrate chain with SK Hynix samples

LG Innotek is seeking to enter the supply chain for substrates used in Intel's EMIB advanced-packaging technology, supplying early samples...

Thursday 4 June 2026
Commentary: Wired or wireless, connectivity steals the spotlight at Computex 2026
Computex 2026 was again dominated by the latest computing chips, with Nvidia's RTX Spark drawing heavy attention and debate. Yet another theme is moving closer to the centre of the...
Thursday 4 June 2026
HBM4 supply in focus as SK's Chey meets TSMC's Wei
SK Group chairman Chey Tae-won met TSMC chairman C.C. Wei in Taiwan on June 3, as SK Hynix and TSMC map out future cooperation in HBM4 base dies, advanced logic processes, and custom...
Thursday 4 June 2026
TSMC chair says CoPoS could scale within years while downplaying risk from Terafab
Taiwan Semiconductor Manufacturing Co. (TSMC) told shareholders on June 4 that the AI surge is creating major opportunities, but also leaving TSMC with the bulk of the investment and...
Thursday 4 June 2026
BYD joins race to build humanoid robots
BYD is quietly developing humanoid robots, according to people familiar with the matter, signaling that China's largest electric vehicle (EV) maker is preparing to extend its ambitions...
Thursday 4 June 2026
TSMC sees no sign of capex slowdown as demand stays strong
TSMC chairman C.C. Wei told shareholders on June 4 that the company sees no reason to cut capital spending, citing strong demand for advanced chips, continuing expansion in the US,...