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Friday 2 October 2026
Hitachi and Fanuc launch Physical AI partnership for factory automation
Hitachi and Fanuc announced on September 30, 2026, that they have formed a strategic partnership on Physical AI, with internal testing beginning immediately and customer promotion...
Friday 2 October 2026
Inside Volantis's photonic bid to break AI's memory wall after US$88 million raise
Semiconductor startup Volantis has raised US$88 million in Series A funding to develop an AI inference architecture that uses photonic interconnect technology to address memory bottlenecks...
Friday 2 October 2026
Amazon weighs US$8B chip sale-leaseback to support credit rating
Amazon is considering moving about US$8 billion worth of high-end Nvidia chips off its balance sheet through a sale-leaseback structure, according to the Financial Times and...
Friday 2 October 2026
California tech exec arrested in US$300M Nvidia AI server smuggling case
US federal prosecutors on October 1 arrested a 38-year-old California man accused of violating US export controls by smuggling computer servers containing US$300 million worth of Nvidia...
Friday 2 October 2026
Micron eyes NVHBM profits with TSMC custom HBM push
Micron is using an externally manufactured base die in NVHBM, a custom high-bandwidth memory (HBM) product it is co-developing with Nvidia, as the company bets that customization can...
Friday 2 October 2026
China chip talent tensions surface in Cambricon's US$4.15 billion ex-CTO dispute

Cambricon Technologies' equity dispute with former deputy general manager and chief technology officer Liang Jun has escalated sharply, with Liang...

Friday 2 October 2026
TSMC, NTU deepen R&D ties through nearly 50 projects a year
National Taiwan University's Graduate School of Advanced Technology (GSAT) has expanded its semiconductor research capabilities with new process and measurement equipment, strengthening...
Friday 2 October 2026
Climax Technology sets up AI center, targets 3Q27 sampling
Wireless communications company Climax Technology is accelerating its AI push by launching an "AI and Advanced Technology Center," with its first project a next-generation AI sensing...
Friday 2 October 2026
Onsemi revises Synaptics takeover deal after rival bid
Onsemi has amended its agreement to buy Synaptics in an all-cash deal, a move that could reshape semiconductor competition and affect global technology supply chains. The revised cash...
Friday 2 October 2026
Samsung SDI's new LFP battery shows how AI is reshaping battery markets beyond EVs
The aggressive rollout of large-scale infrastructure projects has brought increasingly visible changes across global economies and major technology supply chains, with much of that...
Friday 2 October 2026
CSPs embrace multi-vendor co-design for custom ASICs, ending single-supplier era
Hyperscale cloud service providers (CSPs) are expanding their custom ASIC partner networks, accelerating a shift toward multi-vendor technology integration. Industry insiders note...
Friday 2 October 2026
A look at the startup winning Nvidia, Intel backing for AI scale-up optics
Silicon Valley data center optical interconnect startup CScale emerged from stealth on September 30 after raising US$145 million in a Series C funding round backed by Nvidia and Intel...
Thursday 1 October 2026
ASE expands smart OSAT push with six university research partnerships
Advanced Semiconductor Engineering (ASE) held its 11th Automation Industry-Academia Project Results Presentation on September 30, unveiling 12 technology projects developed with six...
Thursday 1 October 2026
ProLogium advances Dunkirk superfactory, deepens Europe battery autonomy
ProLogium, a maker of inorganic lithium ceramic batteries, said construction and infrastructure work at its Dunkirk superfactory in France has started in phases, including power infrastructure...
Thursday 1 October 2026
DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration
TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems...