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    Samsung could lead HBM market in 2027 as HBM4 prices may rise 2.5 times
    9h 30min ago
    Johor data centers could consume 40% of power by 2035
    9h 30min ago
    China’s 15th five-year energy plan targets AI power demand
    9h 30min ago
    Winbond says memory has become a strategic material as AI reshapes the market
    9h 30min ago
    Analysis: Why Onsemi acquires Synaptics in all-stock deal
    9h 30min ago
    NEWS TAGGED TECHNOLOGY
    Saturday 27 June 2026
    MediaTek frames orbit compute and NTN as next strategic R&D priorities
    MediaTek hosted MARC Workshop 2026 on June 24 through the MediaTek Advanced Research Center (MARC), recognizing the year's university-industry collaboration outcomes while outlining...
    Friday 26 June 2026
    Qualcomm HBC takes aim at HBM costs in AI data centers

    Qualcomm has unveiled its latest AI data center platform, Dragonfly, at its annual investor day, highlighting a new technology it calls...

    Friday 26 June 2026
    Agility Robotics IPO strengthens Foxconn's long-term robotics ambitions

    Humanoid robotics and physical AI pioneer Agility Robotics has announced plans to pursue a public listing, drawing significant attention from global capital markets...

    Friday 26 June 2026
    AIDC showcases advanced composite materials for next-gen aircraft, drones
    To meet the aerospace industry's push for lighter, more environmentally sustainable next-generation aircraft, Taiwan's Aerospace Industrial Development Corporation (AIDC) has stepped...
    Friday 26 June 2026
    Academia Sinica readies Taiwan-made quantum chip for engineering push
    Academia Sinica has built a 20-qubit quantum chip from scratch, and the team now says the next phase is less about lab breakthroughs and more about engineering a scalable, reproducible...
    Friday 26 June 2026
    IBM breaks sub-1nm barrier with 3D nanostack transistor platform
    On June 25, IBM unveiled what it calls the world's first sub-1nm chip technology: a 0.7nm — or 7 angstrom — transistor architecture built on an entirely new 3D platform...
    Friday 26 June 2026
    Alibaba chip unit T-Head triples registered capital amid AI push
    Alibaba Group's semiconductor design arm T-Head has more than tripled its registered capital, underscoring the Chinese technology giant's growing focus on artificial intelligence infrastructure...
    Friday 26 June 2026
    GlobalFoundries expands Singapore role as it targets physical AI hardware wave
    GlobalFoundries (GF) is positioning its Singapore operations as a core hub for the emerging era of physical AI, as the chipmaker expands investment in manufacturing capacity and next-generation...
    Friday 26 June 2026
    Europe aggressively pursues non-red supply chains; Thunder Tiger showcases unmanned combat systems in Poland
    Unmanned aerial vehicle (UAV) manufacturer Thunder Tiger recently participated in the Taiwan Expo in Europe 2026 in Warsaw, Poland, showcasing its combat solutions. It said European...
    Friday 26 June 2026
    Apple and Google consider adopting Chinese memory chips: three obstacles remain
    As AI demand prolongs shortages in memory chip supply, global technology companies are increasingly turning to Chinese-made semiconductors. However, industry analysts believe that...
    Thursday 25 June 2026
    Samsung chairman reviews HBM4 supply as revenue tops US$1 billion

    Samsung Electronics chairman Lee Jae-yong visited the company's Cheonan plant on June 23 to review high-bandwidth memory production operations,...

    Thursday 25 June 2026
    China specialty foundry Hua Hong Grace rides 40nm low-power process and Wuxi 12-inch ramp
    Hua Hong Grace Semiconductor (HHGrace) is seeing gains from both process technology and capacity expansion, with industry research showing its 40nm ultra-low-power specialty process...
    Thursday 25 June 2026
    China tightens export controls on strategic minerals with new whistleblower system
    China's Commerce Ministry has expanded oversight of strategic minerals and dual-use goods, adding whistleblower channels, reporting rules, and penalties for evasion. The move could...
    Thursday 25 June 2026
    Chinese chip packaging giant JCET plans US$1.1b AI chip packaging plant
    JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening...
    Thursday 25 June 2026
    MediaTek, Google reportedly deepen ASIC ties as SerDes race hits 448G
    MediaTek is reportedly strengthening its partnership with Google in ASICs, a move that could increase the scale of future orders and carry implications for AI infrastructure worldwide...
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    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook