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Tuesday 26 May 2026
LED maker Ennostar pivots to optical interconnects after high-value shift agin traction
Ennostar Holdings' transformation has begun to show clear results, with chairman Paul Peng saying the company's "3+1" strategy is taking shape, as higher-value applications now account...
Tuesday 26 May 2026
Nvidia and Marvell CEOs to share Computex stage— How US$2 billion turned rivals into partners
When Nvidia quietly wrote a US$2 billion check to Marvell Technology earlier this year, it was less a financial bet than a strategic maneuver — one that converted a potential...
Tuesday 26 May 2026
The US$16.5 Billion Bet: How Co-Packaged Optics Will Rewire AI's Backbone by 2030
As AI clusters continue to scale, traditional interconnect architectures are facing new limits in bandwidth, power efficiency, and system integration. Co-Packaged Optics is emerging...
Tuesday 26 May 2026
Samsung's reported 900-layer V-NAND prototype puts NAND race with YMTC in focus
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has...
Tuesday 26 May 2026
E Ink brings BMW-backed color-changing e-paper car tech to Computex 2026

E Ink will bring its BMW-backed color-changing e-paper vehicle technology to Computex 2026, showcasing the hood structure of the BMW iX3...

Tuesday 26 May 2026
Intel's Rio Rancho fab becomes test case for AI-era chip packaging
Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions...
Tuesday 26 May 2026
Huawei eyes AI storage breakthrough with DoB packaging, 245TB SSD roadmap
Huawei has released its Data Storage 2030 white paper, setting out a technology roadmap for the global storage industry over the next five to...
Tuesday 26 May 2026
Analysis: Huawei's Tau Law signals a new semiconductor framework — with implications beyond China
As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced...
Tuesday 26 May 2026
China pushes homegrown AI stack with local chips, LLMs

Following the conclusion of the Trump-Xi meeting and amid continued delays in China approving imports of Nvidia H20 GPUs, China's National...

Tuesday 26 May 2026
Micron expands US DDR4 output as AI keeps global supply tight
As Micron Technology's decision to restart large-scale DDR4 production in the US grabs global attention, memory-chip executives and analysts say the move is less a revival of aging...
Tuesday 26 May 2026
Lightmatter joins TSMC on COUPE for 3D optical engines
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter...
Tuesday 26 May 2026
Samsung unveils industry-first 6K Odyssey gaming monitor as China ramps panel competition
Samsung Electronics announced a new 2026 gaming monitor lineup that includes the industry's first 6K (6,144×3,456) gaming display, positioning the company to defend high-end...
Tuesday 26 May 2026
SK hynix unveils 'iHBM' thermal solution to boost AI performance

SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs) within the high-bandwidth...

Tuesday 26 May 2026
Samsung's silicon photonics push adds new layer to Korea-Dutch chip ties

South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon...

Tuesday 26 May 2026
Kioxia targets 2027 BiCS 10 NAND production as Samsung, SK Hynix hold back investment
Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK...