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Saturday 19 September 2026
Interview: Advanced packaging shifts toward system-level co-design for AI

Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged...

Saturday 19 September 2026
Beyond Volkswagen, XPeng seeks to turn automotive R&D into a global tech enterprise
It has become increasingly evident that one of the factors undermining China's unparalleled competence in the global EV industry is manufacturing scale. But the continued development...
Friday 18 September 2026
SK hynix Launches 'SK hynix Ventures' in Silicon Valley

SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of its corporate venture capital (CVC) brand, "SK hynix Ventures," aimed at expanding strategic...

Friday 18 September 2026
China's memory push gains ground across LPDDR6, advanced NAND, with HBM still the test

AI is reshaping the global memory industry, tightening supply while creating an opening for China's domestic suppliers. With Samsung...

Friday 18 September 2026
King Charles tests AI's safety consensus as Nvidia keeps its foot on the accelerator

King Charles III has stepped into the intensifying debate over artificial intelligence, urging executives from Nvidia, Google DeepMind,...

Friday 18 September 2026
GlobalFoundries, Marvell expand SiGe capacity deal for AI optical connectivity

GlobalFoundries (GF) and Marvell Technology have expanded a multi-year agreement to increase production capacity for silicon germanium...

Friday 18 September 2026
NCSIST showcases military tech at Taiwan Innotech Expo 2026
As countries worldwide accelerate efforts to develop homegrown defense technology capabilities, Taiwan's National Chung-Shan Institute of Science and Technology (NCSIST) showcased...
Friday 18 September 2026
Samsung Display reportedly taps Sunic for KRW300 billion RGB OLEDoS push
Samsung Display (SDC) is reportedly preparing to invest about KRW 300 billion in a 12-inch RGB OLED-on-Silicon (OLEDoS) production line, moving the next-generation microdisplay technology...
Friday 18 September 2026
AI's next infrastructure squeeze is storage: Seagate sees demand accelerating
Seagate's 2026 Data Infrastructure Readiness Report finds that enterprise AI strategies are moving beyond early-stage adoption toward broader deployment, increasing the importance...
Friday 18 September 2026
FIT hedges its AI optics bets with Corning EBO, TSMC co-packaging talks

Foxconn Interconnect Technology (FIT) chairman Sidney Lu said AI demand remains strong, with overall capacity near full utilization...

Friday 18 September 2026
Taiwan's small businesses race into AI, raising the stakes for execution

Taiwan's small and medium-sized enterprises (SMEs) are making plans to adopt AI, according to a new survey that suggests the debate...

Thursday 17 September 2026
Trumpf eyes glass as AI demand drives packaging innovation
At the China International Optoelectronic Expo (CIOE), representatives from German laser and plasma generator maker Trumpf offered a glimpse into the company's push to extend its laser...
Thursday 17 September 2026
VLEO emerges as next orbital frontier as China warns of critical 2026–2030 window

Very low Earth orbit (VLEO) is moving from concept toward real-world deployment.

Thursday 17 September 2026
Taiwan readies ETS pilot as overseas expansion drives demand

Taiwan is developing an emissions trading scheme (ETS) alongside its carbon fee system, with the Ministry of Environment planning to...