The Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) released its first industry white paper in 78 years on November 11, proposing a "Taiwan+N" global expansion...
The award ceremony for the fourth K. T. Li Award was held in Taipei on November 10, with this year's awards presented by former President Ing-wen Tsai to Kinpo-Compal Group president...
TECO Electric & Machinery is expanding into global AI computing infrastructure, announcing on the November 11 that it will partner with AI cloud service provider GMI Cloud and...
Samsung Electronics is testing electronic skin on the hands of its humanoid robots with South Korean startup Midas H&T, seeking to overcome a key commercialization barrier: combining...
The US midterm election results, which delivered a major Democratic victory, and national security concerns surrounding an affair between an alleged Chinese spy and Nvidia CEO Jensen...
Taiwan is stepping up efforts to develop next-generation semiconductor research equipment, as conventional commercial tools increasingly fall short of emerging R&D requirements...
Samsung Electronics aims to complete its first 3D Cube-H design kit, a hybrid copper bonding technology for vertically stacked logic chips, in early 2027, with prospective customer...
Asia Electronic Materials is developing high-frequency, high-speed substrate materials based on polytetrafluoroethylene (PTFE) through a Hybrid Coreless solution and continues to submit...
South Korean memory chipmaker SK Hynix has named former development chief Hyun Ahn to lead a new Americas unit as competition for custom high-bandwidth memory (HBM) pushes suppliers...
SynPower has signed a strategic cooperation agreement with AblePrint Technology (APT) to jointly develop substrate equipment with warpage suppression annealing system (WSAS) functions,...
SK Hynix is using Nvidia's AI technology and GPU acceleration to speed up memory chip simulations, with improvements in etching-process development and tests of thermal and elastic...
ASMedia Technology reported consolidated revenue of NT$2.66 billion (approx. US$80.9 million) in the third quarter of 2026, with a gross margin of 51.6%, as rising substrate, outsourced...
Grab and SoftBank Group plan to invest a combined US$1.85 billion in two AI infrastructure projects, including data centers, in Malaysia, as they seek to capitalize on growing demand...
Sysgration returned to profitability in the third quarter of 2026 as shipments of new rugged industrial PC (IPC) projects ramped up, while gross margin rose to 22.73% from 22.23% in...
Japan's state-backed chipmaker Rapidus is facing mounting technological challenges that could delay its plan to begin mass-producing 2nm semiconductors by March 2028, potentially undermining...
