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Wednesday 26 August 2026
BOE, 3M expand materials partnership as foldable OLED competition intensifies
BOE Technology Group and 3M have opened a joint research laboratory in Beijing that covers optical films, optically clear adhesives, structural adhesives and advanced materials development...
Wednesday 26 August 2026
OpenAI says Jalapeño cuts latency up to 3.6x, targeting the bottleneck that slows agents
OpenAI said its first custom inference chip, Jalapeño, delivered faster responses and better power efficiency than competing systems in tests across several large language models...
Tuesday 25 August 2026
Tesla senior chip engineer joins DensityAI as in-house plans face more strain
Tesla's senior director of AI hardware design, Shishuang Sun, joined DensityAI in July 2026, taking charge of packaging and system hardware development. The move came as Tesla continued...
Tuesday 25 August 2026
Russia's reusable Amur SPG rocket slips to 2031

Russia's space agency Roscosmos has again delayed development of its first reusable rocket, Amur SPG, with its first launch now reportedly...

Tuesday 25 August 2026
Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise

As the power demands for AI servers and racks continue to rise, data center power architectures are moving toward higher voltages and greater power densities. Ryan Chiu,...

Monday 24 August 2026
AI energy bottleneck is driving semiconductor materials innovation, says Applied Materials
Rising demand for artificial intelligence (AI) computing is driving a new wave of technological transformation in the semiconductor industry, while energy is emerging as the next bottleneck...
Monday 24 August 2026
MediaTek, GUC, Alchip escalate funding war as global ASIC race demands deep capital
Custom Application-Specific Integrated Circuit (ASIC) chips backed by hyperscalers are set for a mass-production boom starting late 2026, with next-generation projects already in full...
Monday 24 August 2026
AI chip roadmaps force faster changes in data-center design, Cadence says
Rapid changes in the power and thermal requirements of AI accelerators are forcing data-center designers to incorporate chip-level information earlier in the planning process, according...
Monday 24 August 2026
Taiwan speeds chip materials push with consumables, ITRI says

Taiwan is accelerating its drive for semiconductor materials self-reliance by starting with consumables and building toward higher-value...

Monday 24 August 2026
Agentic AI opens new era for humanoid robots, shipments to jump fourfold by 2030

Humanoid robots have entered a clear new phase since agentic AI emerged in 2025, with DIGITIMES analyst Zouhao Shen saying the category...

Friday 21 August 2026
Cambricon advances sixth-gen AI silicon, broadens support for DeepSeek, Qwen and GLM
Cambricon Technologies chairman and president Chen Tian-shi said the company's sixth-generation AI processor and instruction set remain under development, with the next-generation...
Friday 21 August 2026
Chinese robots pivot to AI models as Unitree, UBTECH shift hardware focus to 'brains'

The battlefield for Chinese humanoid robotics is shifting from motors, joints, and mechanical structures toward AI large models. As embodied...

Friday 21 August 2026
Unitree chief says humanoid robots are not yet ready for mass real-world work
Unitree Technology's soaring debut underscored investor enthusiasm for humanoid robots, but the company's founder said the industry still faces key limits before machines can perform...