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Friday 18 September 2026
CXMT eyes NAND amid global shortage, taking aim at YMTC

ChangXin Memory Technologies (CXMT) is preparing to expand beyond DRAM into NAND flash, a move that would push China's leading DRAM...

Friday 18 September 2026
Samsung deepens Euclyd ties as startup reportedly reaches test-chip stage

Samsung Electronics is deepening its relationship with Dutch chip startup Euclyd after the company reportedly reached the test-chip...

Friday 18 September 2026
King Charles tests AI's safety consensus as Nvidia keeps its foot on the accelerator

King Charles III has stepped into the intensifying debate over artificial intelligence, urging executives from Nvidia, Google DeepMind,...

Friday 18 September 2026
Mobile SoC battle for 2026 centers on NPUs

More technical details on 2026 mobile systems on a chip (SoCs) from major vendors are emerging, and the biggest changes in chips such...

Friday 18 September 2026
Resonac grows 300mm SiC crystal, marking a substrate milestone
Resonac has grown and processed a 300mm silicon carbide (SiC) single crystal. This development could shape the future of power electronics used worldwide in electric vehicles, renewable...
Friday 18 September 2026
Taiwan central bank warns market stability hinges on AI monetization
Taiwan's Central Bank said on the 17th that the success or failure of AI monetization will determine its long-term economic benefits and impact on financial markets. It urged Taiwanese...
Friday 18 September 2026
Samsung taps Japan for 3.xD chiplet push as packaging race heats up
Samsung Electronics is deepening its semiconductor ties with Japan as it develops large-area chiplet packaging technologies for high-performance computing and AI processors, tapping...
Friday 18 September 2026
DeepSeek engineer's warning suggests AI may reshape, not simply eliminate, technical work

A DeepSeek engineer's viral reflection on AI's rapid progress has reignited debate over whether artificial intelligence will replace...

Thursday 17 September 2026
Samsung expands SRAM, IP to speed chip development

Memory shortages and pricing pressures are reshaping Samsung Electronics' foundry intellectual property (IP) development, as faster...

Thursday 17 September 2026
20 of China's OSATs push into advanced packaging amid EUV curbs
China is broadening its advanced packaging base as restrictions on leading-edge semiconductor equipment complicate further process-node scaling. The effort now extends beyond the country's...
Thursday 17 September 2026
FIT ramps up optical interconnect push as AI race shifts to connectivity
At the FIT Tech Day 2026 on September 16, Foxconn Interconnect Technology (FIT) chairman Sidney Lu noted that as artificial intelligence (AI) advances rapidly, the industry's focus...
Thursday 17 September 2026
AI risk split among tech leaders set to play out at Trump-Xi White House dinner
Former Apple CEO Tim Cook and OpenAI CEO Sam Altman are set to attend a White House state dinner on Sept. 24, 2026, with Nvidia CEO Jensen Huang and other business leaders also expected...
Thursday 17 September 2026
Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV
China's advanced semiconductor research has reached another milestone. The Institute of Microelectronics of the Chinese Academy of Sciences has established a gate-all-around (GAA)...
Thursday 17 September 2026
Onsemi puts power density at the center of its next-decade strategy

Onsemi is seeking to capture more value from AI, electrification, and automation by expanding from individual semiconductors into integrated...

Thursday 17 September 2026
Applied Materials announces 10-year investment plan ahead of SEMICON India
US-based semiconductor equipment maker Applied Materials will invest INR36 billion (US$375 million)) in the Indian state of Karnataka over the next 10 years, Karnataka Industries Minister...