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    Resonac develops 12-inch SiC substrate to target AI and EV demand
    8h 31min ago
    High-end GPUs may be slowing China’s AI compute expansion
    8h 31min ago
    2026 smartphone SoC battle centers on NPU as vendors boost cores and memory for agentic AI
    8h 31min ago
    LGES and Samsung SDI ESS orders reportedly fill two years of North America capacity
    8h 31min ago
    Analysis: China's 15th five-year plan spotlights diamond materials for AI cooling
    8h 31min ago
    NEWS TAGGED DEVELOPMENT
    Friday 18 September 2026
    DeepSeek engineer's warning suggests AI may reshape, not simply eliminate, technical work

    A DeepSeek engineer's viral reflection on AI's rapid progress has reignited debate over whether artificial intelligence will replace...

    Thursday 17 September 2026
    Samsung expands SRAM, IP to speed chip development

    Memory shortages and pricing pressures are reshaping Samsung Electronics' foundry intellectual property (IP) development, as faster...

    Thursday 17 September 2026
    20 of China's OSATs push into advanced packaging amid EUV curbs
    China is broadening its advanced packaging base as restrictions on leading-edge semiconductor equipment complicate further process-node scaling. The effort now extends beyond the country's...
    Thursday 17 September 2026
    FIT ramps up optical interconnect push as AI race shifts to connectivity
    At the FIT Tech Day 2026 on September 16, Foxconn Interconnect Technology (FIT) chairman Sidney Lu noted that as artificial intelligence (AI) advances rapidly, the industry's focus...
    Thursday 17 September 2026
    AI risk split among tech leaders set to play out at Trump-Xi White House dinner
    Former Apple CEO Tim Cook and OpenAI CEO Sam Altman are set to attend a White House state dinner on Sept. 24, 2026, with Nvidia CEO Jensen Huang and other business leaders also expected...
    Thursday 17 September 2026
    Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV
    China's advanced semiconductor research has reached another milestone. The Institute of Microelectronics of the Chinese Academy of Sciences has established a gate-all-around (GAA)...
    Thursday 17 September 2026
    Onsemi puts power density at the center of its next-decade strategy

    Onsemi is seeking to capture more value from AI, electrification, and automation by expanding from individual semiconductors into integrated...

    Thursday 17 September 2026
    Applied Materials announces 10-year investment plan ahead of SEMICON India
    US-based semiconductor equipment maker Applied Materials will invest INR36 billion (US$375 million)) in the Indian state of Karnataka over the next 10 years, Karnataka Industries Minister...
    Thursday 17 September 2026
    Lam Research plans US$1 billion India manufacturing expansion
    Lam Research plans to invest INR100 billion (approx. US$1.04 billion) in India over the next several years, adding its first silicon component manufacturing facility in the country...
    Wednesday 16 September 2026
    India's Eastern state clears SiCSem's SiC unit in SEZ
    The Falta Special Economic Zone unit approval committee has cleared a proposal from SiCSem Private Limited to build an integrated silicon carbide (SiC) device plant near Bhubaneswar,...
    Wednesday 16 September 2026
    AI slowdown calls expose the financial strain of the frontier race
    Calls to moderate frontier AI development are exposing a financial dilemma alongside the safety debate: AI labs must fund successive research cycles while securing infrastructure to...
    Wednesday 16 September 2026
    EV batteries cannot simply power humanoid robots, with energy density and costs posing key hurdles
    Power battery technology has reached maturity in the new energy vehicle (NEV) market, but transferring it to humanoid robots presents two major barriers: the need for significant technological...
    Wednesday 16 September 2026
    TSMC's overseas expansion faces talent management gap, says co-COO Y.J. Mii
    Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei and co-chief operating officer (co-COO) Y.J. Mii participated in the "Cross-Generational Dialogue: Questions and...
    Wednesday 16 September 2026
    Samsung backs Dutch AI chip startup Euclyd in US$230M funding round
    Samsung Electronics is investing in Dutch AI chip startup Euclyd as part of a more than EUR200 million (about US$230.9 million) Series A funding round, highlighting growing efforts...
    Wednesday 16 September 2026
    Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec
    The global surge in AI demand is accelerating change across the semiconductor industry, and as Moore's Law scaling faces physical limits, chipmaking is no longer only about shrinking...
    1/102 pages
    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
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