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Thursday 18 June 2026
Mirle Automation names CEO as chair

Mirle Automation announced that chairman Houng Sun will step down and hand the role to chief executive officer Shih-Tung Lin, as the...

Thursday 18 June 2026
FOPLP race heats up as Innolux reportedly teams with TSMC
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP...
Thursday 18 June 2026
SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has shipped samples of HBM4E, a next-generation DRAM for AI, to major customers.

Thursday 18 June 2026
Exclusive: Penang moves up value chain; Galatek flags deep-tech, IP hurdles
Penang has played a critical role in the global semiconductor back-end industry for decades, particularly in assembly, testing, and packaging (ATP). The region has built a highly competitive...
Thursday 18 June 2026
Exclusive: Galatek sees Penang facility driving semiconductor, life sciences ecosystem growth
Beyond its established role in assembly, testing and packaging (ATP), Penang's next stage of development will depend on its ability to deepen capabilities in precision engineering,...
Wednesday 17 June 2026
Tong Yang sees steadier auto parts demand as tariff and conflict risks ease
Tong Yang Group said global auto parts demand could stabilize in the second half of 2026 as tariff uncertainty eases and Middle East tensions cool, a shift that may help restore order...
Wednesday 17 June 2026
Li Auto's new automotive chip and what it says about China's EV market

Li Auto announced details of its new Mach M100 chip, a self-developed 5nm chip focused on autonomous driving, on June 15. This development...

Wednesday 17 June 2026
EssilorLuxottica, Applied Materials team up on smart eyewear technology
EssilorLuxottica and Applied Materials have agreed to a long-term partnership to speed development of intelligent optical systems for augmented reality and AI-powered smart eyewear,...
Wednesday 17 June 2026
Hiwin unit Matrix Precision deepens Japan cooperation as demand for high-precision gears rises
Matrix Precision, a unit of Hiwin Technologies, said it deepened cooperation with Japan after a delegation from the Japan Gear Manufacturers Association visited its facilities as gear...
Tuesday 16 June 2026
Samsung reportedly moves closer to 5nm-class MRAM as TSMC advances its roadmap

Samsung Electronics has secured key technology for a 5nm-class magnetoresistive random-access memory cell, according to Korean financial...

Tuesday 16 June 2026
Exclusive: Synopsys CEO eyes subscription-plus-token model in AI Agentic era

Synopsys celebrated the 35th anniversary of its Taiwan operations and the opening of its new Hsinchu office on June 15. During the...

Tuesday 16 June 2026
China mass produces silicon-28 amid quantum computing race with US

China has achieved mass production of ultra-pure silicon, according to the state-owned China National Nuclear Corporation (CNNC) —...

Tuesday 16 June 2026
Ubiqconn returns to YoY revenue growth in May as unmanned systems business expands
Ubiqconn Technology reported consolidated revenue of NT$121 million (approx. US$3.84 million) for May 2026, down 7% from the previous month but up 2% year-over-year, marking a return...
Tuesday 16 June 2026
Kioxia surpasses Toyota, eyes M&A push in face of AI boom
NAND flash memory supplier Kioxia Holdings has surpassed Toyota Motor in market capitalisation, becoming Japan's most valuable company. The development highlights how the global artificial...
Tuesday 16 June 2026
South Korea launches ultra-innovation economy push with major investment in next-generation power semiconductors
South Korea has begun planning a large-scale research and development program for next-generation power semiconductors as part of its broader "Ultra-Innovation Economy Project," according...