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Friday 11 September 2026
AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle
Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...
Friday 11 September 2026
DAS Expands in Taiwan and Unveils World First at SEMICON

DAS Environmental Experts continues to expand its capabilities in Taiwan and is presenting another new product at SEMICON Taiwan. Against the backdrop of ongoing investments...

Friday 11 September 2026
Academia Sinica to open 8-inch quantum chip platform in September 2026

Academia Sinica's Quantum Chip Fabrication Space (QC-Fab) in Tainan will open to external users at the end of September 2026, marking...

Friday 11 September 2026
Nuvoton sees robots driving MCU demand over next decade

Nuvoton Technology sees robots and other physical AI applications becoming an important source of demand for microcontrollers (MCUs)...

Friday 11 September 2026
Quantum computer development is more about national security than profits, says expert

Japanese electronics giant NEC stopped development of gate-based superconducting quantum computer hardware at the end of March 2026...

Thursday 10 September 2026
DeepSeek reportedly advances Shanghai IPO plans as it cuts Flash model API prices
Chinese AI startup DeepSeek has taken a concrete step toward a domestic stock-market debut while continuing to adjust its commercial strategy, including another reduction in API prices...
Thursday 10 September 2026
DeepSeek's next AI test is not the model; it's everything around it

DeepSeek has opened roughly 150 positions in a new hiring round focused almost entirely on engineering and infrastructure, pointing to...

Thursday 10 September 2026
DB HiTek completes reliability qualification for 8-inch SiC MOSFET process
DB HiTek said it has completed reliability qualification for its 1,200 V silicon carbide (SiC) MOSFET process on 8-inch wafers. The development could expand foundry capacity for next-generation...
Thursday 10 September 2026
Samsung SDS broadens AI push from software to factory robots
Samsung SDS is using its enterprise AI strategy to move beyond office automation and into factory robotics, betting that its systems-integration experience can turn fragmented robot...
Thursday 10 September 2026
Loongson raises funds to expand CPU and GPU development as AI inference boosts domestic chip plans
Chinese CPU maker Loongson recently announced a CNY2.3 billion (approx. US$342.7 million) capital increase, with the funds mainly going into information technology chips and core CPU...
Thursday 10 September 2026
Taiwan IC design firms seek government subsidies for advanced chip development
Taiwan's Ministry of Economic Affairs (MOEA) and National Science and Technology Council (NSTC) will hold a joint ministerial meeting in September to discuss subsidy applications submitted...
Wednesday 9 September 2026
Cambricon wins PyTorch Foundation board seat in bid to strengthen China AI chip software ecosystem
Chinese AI chip developer Cambricon said on September 8 that it has formally joined the PyTorch Foundation as a platinum member, the organisation's highest membership tier, securing...
Wednesday 9 September 2026
Samsung turns to Japan for packaging edge, narrows HBM gap with SK Hynix

Samsung Electronics has opened an advanced packaging research center in Yokohama, bringing development work closer to Japanese suppliers...

Wednesday 9 September 2026
Realtek expands cloud AI push with ASIC and SSD chips
Realtek chairman Sun-Chien Chiu, who received an honorary fellowship from Taiwan's Industrial Technology Research Institute (ITRI) this week, said in a public interview that the company...