Fujifilm Electronic Materials is expanding its advanced semiconductor materials footprint in South Korea by increasing extreme ultraviolet (EUV) photoresist capacity in Pyeongtaek...
Malaysia has approved its first export of unprocessed rare earths under a new regulatory framework, with the shipment intended for research and development, although officials did...
Vietnam's first wafer fab may miss its 2027 trial-production target, Reuters reported on October 26, citing concerns about project execution and equipment procurement. Developer...
Fine M-Tec has rejected claims that components it supplied contributed to reported display damage in Apple's first foldable iPhone, saying the issue involves multiple components and...
HCLTech and Japan's Rapidus have inaugurated development centers in Bengaluru and Hubli, India, expanding their semiconductor engineering collaboration across Asia. The facilities...
Intel has entered into a definitive agreement to acquire Classiq, a quantum computing software company, in a move aimed at combining Classiq's quantum algorithm synthesis platform...
Samsung Electronics Executive Chairman Lee Jae-Yong is reportedly set to visit the company's Robotics eXperience (RX) business unit in Seoul's Umyeon-dong by the end of October to...
Nvidia has unveiled a prototype of its next-generation co-packaged optics (CPO) technology, Optics-on-Interposer (OOI), at SEMICON West 2026. The design moves the optical engine from...
Bosch Group plans to establish Bosch Mobility as a wholly owned, legally independent subsidiary in August 2027, separating the business that generated about 60% of group revenue. The...
Doosan Robotics is focusing its sales efforts on large automotive and semiconductor manufacturers as it develops AI-powered systems capable of handling more complex factory tasks,...
Apple has reportedly asked BOE Technology and other panel makers for technical information on LCD panels for a future iMac, raising questions about the pace of its OLED transition...
TSMC's Longtan Science Park Phase 3 in Taoyuan is restarting after nearly three years of delays, with Taiwan's National Development Council approving its development plan on September...
The US Department of Commerce has signed letters of intent with four companies to provide up to US$389 million in federal research and development awards under the CHIPS and Science...
Tech Mahindra has announced a collaboration with AI coding platform SpaceXSI to help global enterprises modernize legacy applications, accelerate software delivery, and improve developer...
AI-driven growth will push the semiconductor industry past the US$1.6 trillion mark in 2026, while accelerating chip development cycles to one new product every nine months, Etron...
