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Friday 16 October 2026
Linde LienHwa tackles hydrogen transport dilemma with HaaS
As hydrogen development and applications take center stage at Energy Taiwan 2026, industrial gas giant Linde LienHwa Group is introducing an end-to-end "Hydrogen-as-a-Service" (HaaS)...
Friday 16 October 2026
China's 90%-localized EUV light source debuts at 15W, exposing the gap to commercial chipmaking
Chinese semiconductor technology start-up Langdao Silex (Shanghai) Technology has publicly unveiled an extreme ultraviolet (EUV) light source prototype with a claimed 90% localization...
Friday 16 October 2026
China's YMTC targets 9,600 MT/s with 4F² DRAM design
China's Yangtze Memory Technologies (YMTC) is developing a next-generation 4F² DRAM design targeting data transfer speeds of 9,600 megatransfers per second (MT/s), expanding beyond...
Thursday 15 October 2026
China's AMEC targets 60% of high-end chip equipment market with US$1.94 billion R&D plan
Chinese semiconductor equipment maker AMEC plans to develop 102 new equipment models over the next three to five years, backed by nearly CNY13 billion (≈ US$1.94 billion) in...
Thursday 15 October 2026
Samsung reportedly completes 4F² DRAM development as China's CXMT targets year-end launch
Samsung Electronics has reportedly completed development of next-generation 4F² DRAM technology and is aligning commercialization with customer requirements, even as China's ChangXin...
Thursday 15 October 2026
SK Hynix targets January 2027 for HBF standard, eyes DRAM stacked on AI chips
SK Hynix aims to finalize the technical specifications for high-bandwidth flash (HBF) in January 2027 as it develops new memory technologies to address growing bottlenecks in AI inference...
Thursday 15 October 2026
Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints?
On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding...
Thursday 15 October 2026
Column: 3D memory could redraw chip competition, weaken US sanctions on China
In October 2022, the US Bureau of Industry and Security (BIS) imposed a package of export restrictions on China, including controls on equipment and components for manufacturing 3D...
Thursday 15 October 2026
Synopsys CEO says fully autonomous AI chip design remains out of reach
Synopsys CEO Sassine Ghazi said that fully autonomous chip development has not yet crossed the final hurdle to become reality, although the company has advanced from AI-assisted engineering...
Thursday 15 October 2026
Samsung, Applied Materials back startup targeting chip packaging warpage
Samsung Ventures and Applied Ventures, the venture capital arm of Applied Materials, have invested in US-based Flexcompute, backing simulation technology designed to predict semiconductor...
Thursday 15 October 2026
Taiwan Perovskite Solar Corp. deploys AI to optimize R&D, explore smart energy applications
Taiwan Perovskite Solar Corp. (TPSC) showcased its theme, "PEROVSKITE AI," at Energy Taiwan 2026, highlighting a two-way synergy between artificial intelligence and perovskite technology...
Thursday 15 October 2026
Genius Electronic Optical secures US$150 million 3M investment for optical communications
Genius Electronic Optical, a leading manufacturer of optical lenses and precision optical components, announced on October 15 that it had formed a strategic partnership with 3M, a...
Thursday 15 October 2026
LX Semicon puts SiC patents up for sale as Novatek gains ground
South Korea's LX Semicon is seeking buyers for more than 60 silicon carbide (SiC) power semiconductor patents, winding down a business it entered five years ago to reduce its reliance...
Thursday 15 October 2026
Analysis: Elon Musk's Terafab chases 10 chip iterations a year — can it rival TSMC?
Speaking to more than 2,000 Tesla owners and investors at the X Takeover event held at Tesla's Gigafactory in Austin, Texas, on October 11, Elon Musk made a candid admission: "To be...
Thursday 15 October 2026
Taiwanese chipmaker TASC targets 2027 growth with InP optical chips, glucose sensors nearing mass production
Taiwan-Asia Semiconductor Corporation (TASC) is benefiting from seasonal demand for sensing chips and new wearable launches by major US and European brands. AI server expansion has...