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Tuesday 1 September 2026
Taoyuan eyes northern AIDC hub, touts Tatan and LNG cooling edge
Taiwan's limited land and heavy dependence on imported energy have made power a scarce and strategic resource in the compute era, putting AI data center (AIDC) site selection on the...
Tuesday 1 September 2026
Taiwan chip equipment maker Skytech opens advanced process lab with TSMC backing
Skytech and TSMC have opened an Advanced Process Laboratory focused on next-generation semiconductor manufacturing, highlighting TSMC's continued efforts to support Taiwan's domestic...
Tuesday 1 September 2026
India expands chip ambitions with full Semicon 2.0 notification
India has unveiled the next phase of its semiconductor policy, a move that could reshape global chip supply chains, investment flows, and talent markets. The expanded program aims...
Tuesday 1 September 2026
Taiwan clears Lam Research's NT$9.8 billion subsidiary injection as etch leader scales R&D worldwide
Taiwan's Ministry of Economic Affairs has approved a NT$9.835 billion (approx. US$310 million) capital injection by Lam Research into its Taiwanese subsidiary, Lam Research Taiwan,...
Tuesday 1 September 2026
OpenAI compresses Jalapeno design to 9 months
OpenAI unveiled performance results for its in-house AI chip Jalapeno at Hot Chips 2026 ahead of Nvidia's latest earnings report, underscoring not whether it can beat GB200 or GB300,...
Tuesday 1 September 2026
Samsung is said to develop 8-layer HBM4E for Nvidia's NVHBM push
Samsung Electronics is reportedly developing an 8-layer version of seventh-generation high-bandwidth memory for Nvidia, matching the chipmaker's requirements for its customized NVHBM...
Monday 31 August 2026
Gudeng sees double-digit advanced packaging growth from 2027
Demand for AI and high-performance computing (HPC) continues to drive semiconductor process development, with advanced nodes and advanced packaging entering a new cycle of capacity...
Monday 31 August 2026
U-Best races to launch PFAS-free coatings by 1Q27
U-Best Innovative Technology, a unit of Sun Yad Group, is accelerating development of fluorine-free coatings to capture replacement demand driven by EU and US state-level regulations...
Monday 31 August 2026
ASE: CPO scale-out demands deeper supply-chain coordination for mass production
SEMICON Taiwan 2026 kicked off its pre-show program with the Silicon Photonics Global Summit.
Monday 31 August 2026
OpenAI to pull its models from Cursor, highlighting tension with SpaceX's Elon Musk
OpenAI announced that it will end its contract allowing its models to be used on Cursor due to the latter's acquisition by SpaceX. The development indicates the tense personal relationship...
Monday 31 August 2026
Shanghai's 15th Five-Year Plan bets on chips, AI, advanced packaging
On August 26, the Shanghai municipal government released its 15th Five-Year Plan for the Development of Strategic Emerging Industries, setting a target for added value in strategic...
Monday 31 August 2026
South Korea risks 'HBM 2.0' trap in emerging CPO market
Co-packaged optics (CPO) is emerging as a critical next-generation technology for AI infrastructure, but unless South Korea strengthens its integration and validation capabilities,...
Monday 31 August 2026
SiFive BigSky brings RISC-V into data centers with CUDA, Nvidia links and enterprise Linux
SiFive has introduced its BigSky SF-2U870 development server, positioning the 2U rack system as a platform for hyperscalers, software vendors and SoC developers to port server workloads...
Monday 31 August 2026
Interview: Taiwan's National Atomic Research Institute eyes SMRs for AI power shift
As global net-zero efforts intensify, governments and major technology companies are investing in emerging nuclear technologies to meet the huge electricity demand from AI data centers...
Saturday 29 August 2026
Research Insight: Humanoid robots near mass production as suppliers face precision, ramp-up test
Research Insight: Humanoid robots near mass production as suppliers face precision and ramp-up test