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Thursday 20 August 2026
SK Hynix's new HBM team lands in Nvidia and AMD's backyard — co-design is becoming the way to win HBM4 orders
SK Hynix is reported to be assembling a high-bandwidth memory (HBM) design team in Silicon Valley, a move that would deepen its co-design work with major US chip customers. Analysts...
Thursday 20 August 2026
PGC Helps Startups Accelerate ASIC Development with Turnkey Services

With more than 35 years of experience in ASIC design services, Progate Group Corporation (PGC, TPEx: 8227), a member of the TSMC Design Center Alliance (DCA) and a Synopsys...

Thursday 20 August 2026
Xiaomi's robotics ambitions reveal the next battleground for industrial AI

As artificial intelligence expands from digital environments into physical operations, embodied intelligence is emerging as a new frontier...

Thursday 20 August 2026
Xiaomi's AI strategy moves beyond models as MiMo becomes the intelligence layer across human-car-home ecosystem

As competition in artificial intelligence shifts from model development toward real-world deployment, Xiaomi is betting that its advantage...

Thursday 20 August 2026
CXMT planned to use Samsung process data to develop DRAM, ex-engineer says
A former Samsung Electronics researcher has testified that ChangXin Memory Technologies (CXMT) intended from its earliest days to develop DRAM using Samsung process data, an account...
Thursday 20 August 2026
LG targets 100,000 hours of robot training data ahead of 2027 humanoid debut
LG Electronics is scaling up its robot training infrastructure with Nvidia, targeting 100,000 hours of real and synthetic data by the end of 2026 as it pushes its physical AI strategy...
Thursday 20 August 2026
China dominates global robot shipments as World Robot Conference opens in Beijing

While robotics companies worldwide vie for business opportunities, Chinese vendors currently account for more than 90% of global humanoid...

Thursday 20 August 2026
Rising demand for CPO, SiPh reshapes semiconductor testing
As chip power consumption, transmission speed and architectural complexity increase, testing has shifted from being a final pre-shipment quality gate to an earlier stage in product...
Wednesday 19 August 2026
Manz Asia targets PLP demand with three lines and three sizes
Manz Asia is broadening its push into panel-level packaging (PLP) as interest in the technology continues to rise. General manager Robert Lin said the company has shipped more than...
Wednesday 19 August 2026
LG opens new Brazil appliance factory to deepen Latin America reach
LG Electronics has opened a major refrigerator plant in Paraná, Brazil. This move could improve supply, shorten delivery times, and bring more locally tailored appliances to...
Wednesday 19 August 2026
China-backed quantum standards proposals advance as industry shifts toward commercialization
Quantum technologies are moving closer to commercial use. China says new international proposals on quantum measurement, randomness testing, and computing have advanced, underscoring...
Wednesday 19 August 2026
DDR4 shortages slow Wi-Fi 6 replacement as Wi-Fi 7 ramp continues

Tight DDR4 supply and rising memory costs are reshaping the timing of home and enterprise networking upgrades worldwide. While equipment...

Wednesday 19 August 2026
Samsung moves ahead of SK Hynix in 1d DRAM development race

Samsung Electronics is reportedly on track to complete development of 10-nanometer-class seventh-generation DRAM, also known as 1d DRAM,...

Tuesday 18 August 2026
VeriSilicon revenue surges 91% as AI ASIC backlog swells to US$1.85B

VeriSilicon posted record first-half 2026 revenue of CNY1.86 billion (US$276 million), up 91.37% year-on-year, as AI computing demand...