CONNECT WITH US
NEWS TAGGED DEVELOPMENT
Tuesday 21 July 2026
BOE expands into glass-core packaging, solar cells and optical interconnects
BOE Technology Group said on July 20 that it is pushing beyond display panels into glass-core substrate packaging, perovskite solar cells and Micro LED optical interconnects. The Chinese...
Tuesday 21 July 2026
Taiwan lawmakers stall on drone procurement bill as localization debate intensifies

Taiwan's Legislative Yuan reviewed four versions of a special bill for drone procurement on the 16th but reached no conclusion, leaving...

Tuesday 21 July 2026
Advanced Echem Materials to invest NT$4.52 billion in Longtan plant
Advanced Echem Materials (AEMC), a semiconductor specialty chemicals materials maker, plans to invest roughly NT$4.52 billion (approx. US$139.66 million) in Taiwan's Longtan Science...
Monday 20 July 2026
Rapidus taps Cadence AI agents to speed 2nm chip design
Japanese foundry Rapidus is integrating Cadence's AI-agent technology into its chip design platform as it seeks to shorten development cycles and attract customers for its planned...
Monday 20 July 2026
3GPP sets 6G Release 21 timeline as industry begins preparing for next-gen networks

The global race toward 6G has entered a new phase after the 3rd Generation Partnership Project (3GPP) finalized the development timeline...

Monday 20 July 2026
China pushes AI agent interoperability and space computing at WAIC 2026

China unveiled two major AI initiatives at the 2026 World AI Conference (WAIC) in Shanghai, highlighting efforts to standardize AI agent...

Monday 20 July 2026
CXMT's US$4B IPO fuels DRAM capacity race toward 350,000 wafers a month

Chinese DRAM maker ChangXin Memory Technologies (CXMT) is accelerating construction and technology upgrades across its manufacturing...

Monday 20 July 2026
PGC Boosts COT Model, Integrates TSMC Ecosystem for ASIC Growth

As artificial intelligence (AI), high-performance computing (HPC), high-speed networking, and edge computing applications continue to expand rapidly, global demand for...

Sunday 19 July 2026
SmartSens forecasts stronger first-half 2026 results on AI-related demand
SmartSens is signaling stronger first-half 2026 growth, a development that may matter to investors tracking global demand for image sensors used in security cameras, smartphones, and...
Sunday 19 July 2026
Memory must adopt foundry model to fix AI inference bottleneck, says Korean scholar

AI development is driving larger data transfers and higher GPU efficiency demands, pushing memory toward customization and prompting...

Saturday 18 July 2026
Anthropic: AI's edge now lies in delivery, not just model strength

AI development is moving so quickly that companies and regulators worldwide have far less time to adapt, Anthropic said at the 2026...

Friday 17 July 2026
Taiwan's 2027 tech budget rises 6.2% to NT$176.8 billion, targeting AI and space

Taiwan plans to increase its technology budget by 6.2% in 2027 to accelerate investment in artificial intelligence (AI), space technology...

Friday 17 July 2026
China unveils first official commercial space roster, backing established players and the NTN ecosystem

An organization under China's State Administration of Science, Technology and Industry for National Defense (SASTIND) released the...

Friday 17 July 2026
Japan steps up sovereign AI ambitions as Noetra launches multimodal AI project, plans infrastructure of 27,500 Nvidia Rubin GPUs
Noetra has launched full-scale R&D for a Japan-developed multimodal foundation model, a move that could shape the future of AI robots, industrial automation, and so-called physical...
Friday 17 July 2026
South Korean suppliers ramp up hybrid bonding R&D beyond HBM5
As high-bandwidth memory (HBM) stacks add more layers, requirements for chip-to-chip bonding accuracy and signal transmission efficiency are becoming more demanding.