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Monday 22 June 2026
Intel CEO doubles down on advanced packaging with former SK Hynix chief's return
Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies...
Monday 22 June 2026
China opens STAR Market pathway for AI model firms amid funding race
China's artificial intelligence (AI) industry has received another major policy boost. At the 2026 Lujiazui Forum in Shanghai, China Securities Regulatory Commission (CSRC) Chairman...
Monday 22 June 2026
Samsung sees ongoing SoC losses drag down System LSI's 2026 performance
In a rare public admission during an internal briefing, Park Yong-In, president of the System LSI Business of the Device Solutions (DS) Division at Samsung Electronics, expressed concern...
Monday 22 June 2026
Huawei expands Vietnam footprint through energy, AI, and 5G partnerships
China's Huawei Technologies is deepening its presence in Vietnam through a series of partnerships spanning digital energy, artificial intelligence (AI), telecommunications infrastructure,...
Monday 22 June 2026
Taiwan AI delegation pivots to end-to-end solutions at VivaTech to tap European demand
The National Science Council organized a Taiwan Tech Arena delegation of 95 companies to attend the VivaTech conference in France, presenting an "AI Taiwan" showcase to promote Taiwan’s...
Monday 22 June 2026
Google co-founder says AGI's missing piece is the physical world, not language

Two years after returning to Google, co-founder Sergey Brin recently made his first public appearance and participated in an open Q&A...

Saturday 20 June 2026
Google DeepMind maps four paths from AGI to ASI

Over the past decade, advances in artificial intelligence (AI) have repeatedly exceeded market expectations. Artificial general intelligence...

Friday 19 June 2026
Interview: Oppstar grows ASIC design ties with Japan, South Korea clientele, plans Taiwan office

Founded in 2014, Oppstar is one of the few Malaysian companies operating at the front end of the semiconductor value chain as an IC...

Thursday 18 June 2026
Elon Musk aims for record maximum usable compute per wafer for AI6 chip
Following the announcement in April 2026 that the AI5 chip design had been finalized, Tesla CEO Elon Musk introduced a new benchmark, stating that under yield considerations, the AI6...
Thursday 18 June 2026
Smart glasses race pulls Taiwan and China optical suppliers into waveguide battle
Smart glasses shipments are rising steadily, making the category one of the most closely watched consumer electronics growth drivers after notebooks and smartphones. Taiwanese optical...
Thursday 18 June 2026
Mirle Automation names CEO as chair

Mirle Automation announced that chairman Houng Sun will step down and hand the role to chief executive officer Shih-Tung Lin, as the...

Thursday 18 June 2026
FOPLP race heats up as Innolux reportedly teams with TSMC
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP...
Thursday 18 June 2026
SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has shipped samples of HBM4E, a next-generation DRAM for AI, to major customers.

Thursday 18 June 2026
Exclusive: Penang moves up value chain; Galatek flags deep-tech, IP hurdles
Penang has played a critical role in the global semiconductor back-end industry for decades, particularly in assembly, testing, and packaging (ATP). The region has built a highly competitive...
Thursday 18 June 2026
Exclusive: Galatek sees Penang facility driving semiconductor, life sciences ecosystem growth
Beyond its established role in assembly, testing and packaging (ATP), Penang's next stage of development will depend on its ability to deepen capabilities in precision engineering,...