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Monday 31 August 2026
Gudeng sees double-digit advanced packaging growth from 2027
Demand for AI and high-performance computing (HPC) continues to drive semiconductor process development, with advanced nodes and advanced packaging entering a new cycle of capacity...
Monday 31 August 2026
U-Best races to launch PFAS-free coatings by 1Q27
U-Best Innovative Technology, a unit of Sun Yad Group, is accelerating development of fluorine-free coatings to capture replacement demand driven by EU and US state-level regulations...
Monday 31 August 2026
ASE: CPO scale-out demands deeper supply-chain coordination for mass production
SEMICON Taiwan 2026 kicked off its pre-show program with the Silicon Photonics Global Summit.
Monday 31 August 2026
OpenAI to pull its models from Cursor, highlighting tension with SpaceX's Elon Musk
OpenAI announced that it will end its contract allowing its models to be used on Cursor due to the latter's acquisition by SpaceX. The development indicates the tense personal relationship...
Monday 31 August 2026
Shanghai's 15th Five-Year Plan bets on chips, AI, advanced packaging
On August 26, the Shanghai municipal government released its 15th Five-Year Plan for the Development of Strategic Emerging Industries, setting a target for added value in strategic...
Monday 31 August 2026
South Korea risks 'HBM 2.0' trap in emerging CPO market
Co-packaged optics (CPO) is emerging as a critical next-generation technology for AI infrastructure, but unless South Korea strengthens its integration and validation capabilities,...
Monday 31 August 2026
SiFive BigSky brings RISC-V into data centers with CUDA, Nvidia links and enterprise Linux
SiFive has introduced its BigSky SF-2U870 development server, positioning the 2U rack system as a platform for hyperscalers, software vendors and SoC developers to port server workloads...
Monday 31 August 2026
Interview: Taiwan's National Atomic Research Institute eyes SMRs for AI power shift
As global net-zero efforts intensify, governments and major technology companies are investing in emerging nuclear technologies to meet the huge electricity demand from AI data centers...
Saturday 29 August 2026
Research Insight: Humanoid robots near mass production as suppliers face precision, ramp-up test
Research Insight: Humanoid robots near mass production as suppliers face precision and ramp-up test
Friday 28 August 2026
Huawei targets 100 million HarmonyOS 6 devices, paving way for global expansion next
Huawei rotating chairman Eric Xu said at the HarmonyOS Ecosystem Conference 2026 in Shenzhen on August 28 that the HarmonyOS ecosystem now has more than 100,000 native applications,...
Friday 28 August 2026
Samsung eyes zHBM products from 2029 as heat remains key hurdle
Samsung Electronics expects products based on its first-generation zHBM specifications to appear in 2029 or later, giving the 3D memory concept unveiled earlier this month an initial...
Friday 28 August 2026
SK Hynix weighs closer ties with Kioxia in NAND
SK Hynix is weighing closer cooperation with Japan's Kioxia Holdings in NAND flash, extending the strategic message from its newly launched US HBM expansion into a memory segment where...
Friday 28 August 2026
Lam Research breaks ground on Oregon lab expansion for AI chip development
Lam Research has begun work on a new Oregon research lab as part of a more than US$3 billion global investment aimed at speeding development of advanced AI chips. The expansion could...
Friday 28 August 2026
Renesas opens physical AI, robotics lab in Beijing
Renesas Electronics has opened a physical AI and robotics lab in Beijing, a move that could speed the development of safer, smarter machines for factories, logistics, and homes worldwide...
Friday 28 August 2026
Taiwan's next biotech prescription: AI drug discovery, smart devices, biomedical chips
Taiwan is charting a new direction for its biomedical industry, drawing on its strengths in semiconductors, AI hardware, precision manufacturing and healthcare. AI-powered drug discovery,...