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Thursday 30 July 2026
Commentary: How AMD and Anthropic plan to build an AI factory not dependent on CUDA

Nvidia's power in AI has never rested on GPU performance alone — it has also depended on the CUDA software ecosystem. That moat...

Thursday 30 July 2026
China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
China's 28nm DUV lithography programme has entered a new phase after Shanghai Aishengna Electronic Technology delivered its first five immersion deep ultraviolet lithography system...
Thursday 30 July 2026
US rallies global partners on 6G as competition with China intensifies

The US government has launched a multinational initiative to coordinate 6G development, signaling a new phase in the global race to shape...

Thursday 30 July 2026
China rejects 'overcapacity' claims in new policy paper, defends industrial strategy
China's Ministry of Commerce (MOFCOM) has released a policy paper rejecting allegations that the country's manufacturing sector suffers from "overcapacity," arguing that the concept...
Thursday 30 July 2026
Marvell opens expanded Bengaluru R&D hub, doubling India headcount

Marvell Technology has opened 100,000 square feet of additional semiconductor R&D space in Bengaluru and plans to double its India...

Thursday 30 July 2026
Marvell plans US$250 million India investment to expand semiconductor R&D
Marvell Technology said its planned US$250 million investment in India over three years will deepen semiconductor research, hiring, and infrastructure, with implications for global...
Thursday 30 July 2026
India launches homegrown silicon photonics tools to widen access for researchers and industry

India has launched two indigenously developed silicon photonics solutions to strengthen local chip design and testing capabilities...

Thursday 30 July 2026
Robotics makers race to commercialize dexterous hands for Physical AI

The robotics industry is moving from AI demonstrations to commercial deployments as vendors push Physical AI into factories, logistics,...

Wednesday 29 July 2026
China's glass substrate supply chain takes shape for AI chip packaging
Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the...
Wednesday 29 July 2026
SK Hynix keeps US and Japan expansion options open despite KRW40T capex plan
SK Hynix is advancing a high-KRW40s trillion capital expenditure plan for 2026 to expand AI memory capacity, but has stopped short of committing to new production investments in the...
Wednesday 29 July 2026
China's first home-grown immersion DUV production reveals real test beyond prototypes
China has begun producing domestically developed immersion deep-ultraviolet (DUV) lithography machines, moving a critical semiconductor-equipment programme beyond prototypes and towards...
Wednesday 29 July 2026
AI researchers urge international safeguards as industry pushes for mechanisms to slow frontier AI
More than 1,100 employees and executives from leading artificial intelligence companies have called for an international framework that could deliberately slow frontier AI development...
Wednesday 29 July 2026
TDK and LG Innotek form partnership on physical AI sensors
TDK and LG Innotek are joining forces to develop sensors for Physical AI, a move that could shape future robotics and automation products used worldwide. The collaboration combines...
Wednesday 29 July 2026
Compal launches Employee Stock Ownership Trust to boost talent retention
Compal Electronics announced it officially launched its Welfare Employee Stock Ownership Trust (ESOT) plan in July 2026 to deepen its talent strategy amid intensifying global competition...
Wednesday 29 July 2026
Tier IV lists in Tokyo to fund open autonomous driving platform

Japanese autonomous driving startup Tier IV listed on the Tokyo Stock Exchange on July 22 and said it planned to raise capital to expand...