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Thursday 17 September 2026
Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV
China's advanced semiconductor research has reached another milestone. The Institute of Microelectronics of the Chinese Academy of Sciences has established a gate-all-around (GAA)...
Thursday 17 September 2026
Onsemi puts power density at the center of its next-decade strategy

Onsemi is seeking to capture more value from AI, electrification, and automation by expanding from individual semiconductors into integrated...

Thursday 17 September 2026
Applied Materials announces 10-year investment plan ahead of SEMICON India
US-based semiconductor equipment maker Applied Materials will invest INR36 billion (US$375 million)) in the Indian state of Karnataka over the next 10 years, Karnataka Industries Minister...
Thursday 17 September 2026
Lam Research plans US$1 billion India manufacturing expansion
Lam Research plans to invest INR100 billion (approx. US$1.04 billion) in India over the next several years, adding its first silicon component manufacturing facility in the country...
Wednesday 16 September 2026
India's Eastern state clears SiCSem's SiC unit in SEZ
The Falta Special Economic Zone unit approval committee has cleared a proposal from SiCSem Private Limited to build an integrated silicon carbide (SiC) device plant near Bhubaneswar,...
Wednesday 16 September 2026
AI slowdown calls expose the financial strain of the frontier race
Calls to moderate frontier AI development are exposing a financial dilemma alongside the safety debate: AI labs must fund successive research cycles while securing infrastructure to...
Wednesday 16 September 2026
EV batteries cannot simply power humanoid robots, with energy density and costs posing key hurdles
Power battery technology has reached maturity in the new energy vehicle (NEV) market, but transferring it to humanoid robots presents two major barriers: the need for significant technological...
Wednesday 16 September 2026
TSMC's overseas expansion faces talent management gap, says co-COO Y.J. Mii
Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei and co-chief operating officer (co-COO) Y.J. Mii participated in the "Cross-Generational Dialogue: Questions and...
Wednesday 16 September 2026
Samsung backs Dutch AI chip startup Euclyd in US$230M funding round
Samsung Electronics is investing in Dutch AI chip startup Euclyd as part of a more than EUR200 million (about US$230.9 million) Series A funding round, highlighting growing efforts...
Wednesday 16 September 2026
Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec
The global surge in AI demand is accelerating change across the semiconductor industry, and as Moore's Law scaling faces physical limits, chipmaking is no longer only about shrinking...
Wednesday 16 September 2026
South Korean NPU startups face validation hurdle in push for global sales

South Korea's neural processing unit (NPU) startups are moving from chip development toward commercial deployment, but limited experience...

Wednesday 16 September 2026
ITRI showcases AI robots, drones to push commercialization in southern Taiwan

The Industrial Technology Research Institute (ITRI) held its ITRI Innovation Day on September 15 in Tainan, Taiwan, bringing together...

Wednesday 16 September 2026
Amodei's AI slowdown call is unlikely to dent chip demand, industry sources say

Anthropic CEO Dario Amodei's call to slow frontier AI development has stirred debate over safety, but chip industry sources say global...

Tuesday 15 September 2026
The Boring lands US$3 billion from UAE investors, fueling Musk's underground transit dream
Even as he leads SpaceX through the largest IPO in history and rolls out Tesla's Cybercab robotaxi fleet in Austin, Texas, Elon Musk has not let go of his ambitions for underground...
Tuesday 15 September 2026
Interview: Corning sees CPO, glass core as new semiconductor battlegrounds

As artificial intelligence applications accelerate, surging global semiconductor demand is pushing advanced packaging, co-packaged optics...