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NEWS TAGGED DIGITIMES
Monday 24 August 2026
Podcast highlights: TSMC Arizona's profit turnaround, US manufacturing viability pressures South Korean memory makers
DIGITIMES analyst Luke Lin noted on a recent podcast that when reviewing TSMC's semiannual and first-quarter 2026 financial reports, the operational health and profitability of its...
Monday 24 August 2026
Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design
Semiconductor supply chains, custom silicon, high-bandwidth memory (HBM), robotics, and India's chip buildout shaped this week's technology agenda, with major moves from Google, Marvell,...
Monday 24 August 2026
AI compute race heads toward space as MediaTek executive says 1 million H100s will be mid-tier by 2030
Speaking at DIGITIMES' "AI on Chips: Semiconductor Industry Outlook Forum," MediaTek senior director Bor-Sung Liang said AI development is shifting from individual large language models...
Monday 24 August 2026
Agentic AI opens new era for humanoid robots, shipments to jump fourfold by 2030

Humanoid robots have entered a clear new phase since agentic AI emerged in 2025, with DIGITIMES analyst Zouhao Shen saying the category...

Monday 24 August 2026
MediaTek wins Google TPU deal on three key strengths
Taiwan's IC design industry is set to keep growing strongly in 2026, with revenue expected to rise 10%, driven mainly by companies involved in AI and AI ASIC projects such as MediaTek,...
Monday 24 August 2026
CPO hurdles linger as 800G and 1.6T SiPh surge, says analyst
Challenges around co-packaged optics (CPO) remain unresolved, but they have not slowed the rapid rise of 800G and 1.6T silicon photonics, DIGITIMES analyst Kiwi Hsu said on August...
Friday 21 August 2026
Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge
The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES,...
Friday 21 August 2026
Power supply lags behind AI compute growth: chips, optical interconnects battle for energy efficiency

At the "AI on Chips: Semiconductor Industry Trends Forum" hosted by DIGITIMES in Taipei on August 20, semiconductor, investment, and...

Friday 21 August 2026
AI paid user conversion rate in US only 3% as rising token costs fuel edge AI server demand
At the "AI on Chips: Semiconductor Industry Trends Forum" hosted by DIGITIMES, industry experts highlighted that the massive volume of tokens consumed by AI services has become a growing...
Friday 21 August 2026
Research Insight: 2028 key year for optical interconnects in AI racks
Optical communications will likely enter AI server racks in 2028, DIGITIMES analyst Joyce Chen said on August 20 at a semiconductor industry forum in Taipei, as rising AI cluster scale...
Friday 21 August 2026
FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus...

Friday 21 August 2026
Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains
The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...
Friday 21 August 2026
DIGITIMES's Colley Hwang warns Taiwan AI data center capacity lags South Korea

The inference economy has arrived, and Taiwan's tech industry must transition from the "knowledge economy" to the "inference economy,"...

Monday 17 August 2026
Weekly news roundup: AI expansion fuels supernodes, post-HBM memory, liquid cooling and supply-chain shifts
This week's most-read stories traced the AI boom across the stack, from supernodes and next-generation memory to liquid cooling, solar power, telecom services and PCB demand. Below...