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Friday 21 August 2026
Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge
The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES,...
Friday 21 August 2026
Power supply lags behind AI compute growth: chips, optical interconnects battle for energy efficiency

At the "AI on Chips: Semiconductor Industry Trends Forum" hosted by DIGITIMES in Taipei on August 20, semiconductor, investment, and...

Friday 21 August 2026
AI paid user conversion rate in US only 3% as rising token costs fuel edge AI server demand
At the "AI on Chips: Semiconductor Industry Trends Forum" hosted by DIGITIMES, industry experts highlighted that the massive volume of tokens consumed by AI services has become a growing...
Friday 21 August 2026
Research Insight: 2028 key year for optical interconnects in AI racks
Optical communications will likely enter AI server racks in 2028, DIGITIMES analyst Joyce Chen said on August 20 at a semiconductor industry forum in Taipei, as rising AI cluster scale...
Friday 21 August 2026
FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus...

Friday 21 August 2026
Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains
The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...
Friday 21 August 2026
DIGITIMES's Colley Hwang warns Taiwan AI data center capacity lags South Korea

The inference economy has arrived, and Taiwan's tech industry must transition from the "knowledge economy" to the "inference economy,"...

Monday 17 August 2026
Weekly news roundup: AI expansion fuels supernodes, post-HBM memory, liquid cooling and supply-chain shifts
This week's most-read stories traced the AI boom across the stack, from supernodes and next-generation memory to liquid cooling, solar power, telecom services and PCB demand. Below...
Friday 14 August 2026
Insight: Intel raises US$20B, but its 14A ambitions may need twice as much

DIGITIMES analyst Luke Lin, speaking on a recent podcast, used Intel's latest equity fundraising plan to examine who is benefiting...

Friday 14 August 2026
Kioxia eyes customer trials for PCIe Gen6 optical SSD

Kioxia is developing a PCIe Gen6 optical SSD and hopes to work with customers on its next prototype, as the Japanese memory maker tackles...

Friday 14 August 2026
LEO satellite communications, space computing drive rising importance of GaN power amplifiers
DIGITIMES expects SpaceX to further accelerate Starlink satellite deployments in 2027, expanding network capacity and supporting faster rollout of its direct-to-cell (D2C) services...
Thursday 13 August 2026
Taiwan notebook industry, 2Q 2026

Introduction

Monday 10 August 2026
Weekly news roundup: AI infrastructure race spans HBM, DRAM, EMIB, optical transceivers and next-gen lithography
AI infrastructure, memory supply, advanced packaging and US-China tech restrictions led this week's industry agenda. Below are the most-read DIGITIMES stories from the week...