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    Exclusive: China 6-inch SiC substrate supply tightens, suppliers brace for another price hike
    8h 29min ago
    Intel’s EMIB-T emerges as a backup option as CoWoS capacity tightens
    8h 29min ago
    AUO unit plans to ride synergy gains momentum into entering TSMC ecosystem
    8h 30min ago
    AI buildout lifts demand for China high-speed optical module makers
    8h 30min ago
    SJSemi expands 2.5D packaging to 3.3-reticle size for AI and HPC chips
    8h 30min ago
    NEWS TAGGED PANEL
    Wednesday 2 September 2026
    Meta reportedly taps SeeYA for Phoenix OLEDoS panels as BOE fails to qualify

    Meta has reportedly tapped Chinese microdisplay maker SeeYA Technology to supply OLED-on-silicon (OLEDoS) panels for its next-generation...

    Wednesday 2 September 2026
    Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates

    Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how to supply 1,000 Watts, 1 Volt and 1,000 Amperes...

    Monday 31 August 2026
    China optical display investment shrinks 80% in 1H26
    China's optical display industry is cooling after years of aggressive panel fab construction that has reshaped the global display landscape. Investments in China's optical display...
    Saturday 29 August 2026
    Exclusive Interview: Turning scale into value — AUO chair's post-LCD ambition
    Price wars. Capacity races. Years of losses steep enough to earn a lasting nickname.
    Friday 28 August 2026
    Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production
    Samsung Electronics' packaging technology lead, Lee Hee-seok, outlined the company's advanced semiconductor packaging roadmap at Advanced Semiconductor Packaging & Chiplet Show...
    Thursday 27 August 2026
    Tri-fold, rollable foldables intensify materials supply chain battle
    Samsung Electronics' first tri-fold handset of 2025, the Galaxy Z TriFold, has repeatedly sold out, but with global shipments of only about 30,000 units, it functioned more as a technology...
    Thursday 27 August 2026
    China OLED buildout lifts Korean equipment sales as backlogs grow
    Chinese panel makers' investment in next-generation OLED production is beginning to translate into reported sales at South Korean equipment suppliers, with several vendors posting...
    Thursday 27 August 2026
    Apple pressure on OLED prices squeezes South Korean panel profits
    Apple is reportedly negotiating lower unit prices with South Korean OLED panel suppliers as surging prices for high-performance mobile DRAM, NAND flash, and other memory chips threaten...
    Wednesday 26 August 2026
    TCL, Asus drop China OLED as LGD gains edge
    TCL has reportedly stopped using OLED panels from its own TCL CSOT unit as it expands its monitor lineup, instead turning again to LG Display (LGD), while Asus is said to have halted...
    Wednesday 26 August 2026
    BOE, 3M expand materials partnership as foldable OLED competition intensifies
    BOE Technology Group and 3M have opened a joint research laboratory in Beijing that covers optical films, optically clear adhesives, structural adhesives and advanced materials development...
    Wednesday 26 August 2026
    Samsung Display boosts OLED sales as Galaxy Z panel orders triple
    The global small-size OLED market was flat in the second quarter of 2026 as seasonal weakness and cautious inventory management by Chinese device makers slowed demand. Samsung Display,...
    Wednesday 26 August 2026
    TSMC's 310mm push threatens Samsung's PLP lead
    Samsung Electronics commercialized fan-out panel-level packaging (FOPLP) before rivals, using the technology in mobile and wearable chips and now preparing to extend it into AI and...
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026

    Interested in solving microcrack issues in through-glass via (TGV) fabrication? Want to learn how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor...

    Saturday 22 August 2026
    Manz Asia says yield is key to glass core mass production
    As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...
    Thursday 20 August 2026
    China tightens grip on global LCD market as TV panel share tops 70%
    The global LCD panel industry continues to consolidate around Chinese manufacturers, whose share of the LCD TV panel market has remained firmly above 70% and is gradually approaching...
    1/17 pages
    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
    Wednesday 2 September 2026
    Take Control of Your Process: Onto Innovation at SEMICON Taiwan 2026
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