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    YMTC expands local supply chain
    5h 2min ago
    Insight: Z.ai tests GLM-5.3-Flash anonymously, underscoring shift in benchmarking
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    MCE expands auto electronics capacity to defend Malaysia's domestic market
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    China took more than 70% of global battery market in 1H26
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    Taiwan legislature passes drone bill, tightening oversight after supplier scandals
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    NEWS TAGGED PANEL
    Thursday 27 August 2026
    Tri-fold, rollable foldables intensify materials supply chain battle
    Samsung Electronics' first tri-fold handset of 2025, the Galaxy Z TriFold, has repeatedly sold out, but with global shipments of only about 30,000 units, it functioned more as a technology...
    Thursday 27 August 2026
    China OLED buildout lifts Korean equipment sales as backlogs grow
    Chinese panel makers' investment in next-generation OLED production is beginning to translate into reported sales at South Korean equipment suppliers, with several vendors posting...
    Thursday 27 August 2026
    Apple pressure on OLED prices squeezes South Korean panel profits
    Apple is reportedly negotiating lower unit prices with South Korean OLED panel suppliers as surging prices for high-performance mobile DRAM, NAND flash, and other memory chips threaten...
    Wednesday 26 August 2026
    TCL, Asus drop China OLED as LGD gains edge
    TCL has reportedly stopped using OLED panels from its own TCL CSOT unit as it expands its monitor lineup, instead turning again to LG Display (LGD), while Asus is said to have halted...
    Wednesday 26 August 2026
    BOE, 3M expand materials partnership as foldable OLED competition intensifies
    BOE Technology Group and 3M have opened a joint research laboratory in Beijing that covers optical films, optically clear adhesives, structural adhesives and advanced materials development...
    Wednesday 26 August 2026
    Samsung Display boosts OLED sales as Galaxy Z panel orders triple
    The global small-size OLED market was flat in the second quarter of 2026 as seasonal weakness and cautious inventory management by Chinese device makers slowed demand. Samsung Display,...
    Wednesday 26 August 2026
    TSMC's 310mm push threatens Samsung's PLP lead
    Samsung Electronics commercialized fan-out panel-level packaging (FOPLP) before rivals, using the technology in mobile and wearable chips and now preparing to extend it into AI and...
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026

    Interested in solving microcrack issues in through-glass via (TGV) fabrication? Want to learn how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor...

    Saturday 22 August 2026
    Manz Asia says yield is key to glass core mass production
    As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...
    Thursday 20 August 2026
    China tightens grip on global LCD market as TV panel share tops 70%
    The global LCD panel industry continues to consolidate around Chinese manufacturers, whose share of the LCD TV panel market has remained firmly above 70% and is gradually approaching...
    Thursday 20 August 2026
    Commentary: How iPad Air became a catalyst for IT OLED expansion
    Apple kicked off the tablet OLED era in 2024, introducing Tandem OLED in the iPad Pro to overcome bottlenecks in display lifespan and brightness. The iPad mini followed, set to adopt...
    Thursday 20 August 2026
    Innolux turns panel fabs into FOPLP capacity, banking on sticky advanced packaging ties

    Innolux is accelerating its dual-track transformation and asset-light strategy, with second-quarter 2026 earnings per share rising 185%...

    Wednesday 19 August 2026
    Manz Asia targets PLP demand with three lines and three sizes
    Manz Asia is broadening its push into panel-level packaging (PLP) as interest in the technology continues to rise. General manager Robert Lin said the company has shipped more than...
    Wednesday 19 August 2026
    PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips
    As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and...
    Tuesday 18 August 2026
    Innolux posts 4th straight profit, sees consumer display slip in 3Q26
    Innolux said net profit after tax reached NT$4.65 billion (US$146.3 million) in the second quarter of 2026, marking a fourth consecutive quarter in the black. The panel maker warned...
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    BIZ FOCUS
    Aug 27, 08:00
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
    Tuesday 25 August 2026
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Monday 24 August 2026
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
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