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    Kaynes' Japan push signals India's bid to become an alternative chip packaging hub
    13min ago
    InnoScience wins GaN patent battle against Infineon in China
    24min ago
    Nvidia’s hold on AI inference chips strengthened as in-house rivals failed to bite
    Jun 16, 19:04
    NEWS TAGGED WAFER
    Wednesday 17 June 2026
    Nexchip reportedly broadens semiconductor ambitions with new design and materials subsidiary

    Chinese foundry Nexchip is expanding beyond wafer manufacturing with the establishment of a new wholly owned subsidiary, marking its...

    Wednesday 17 June 2026
    PSMC buys NT$1.04 billion in Lam Research equipment to support capacity growth
    Powerchip Semiconductor Manufacturing (PSMC) announced on June 16 that, effective from May 22, 2026, it purchased semiconductor production facilities and machinery from Lam Research...
    Tuesday 16 June 2026
    ASML, TSMC, and imec move 2D transistors closer to manufacturing reality
    ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor...
    Monday 15 June 2026
    Google's TPU diversification challenges MediaTek and other ASIC partners
    Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports...
    Monday 15 June 2026
    SK Hynix readies HBM4 packaging push as Nvidia demand grows

    SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for...

    Tuesday 9 June 2026
    TSMC capacity crunch pushes Google, Nvidia closer to Intel
    TSMC's AI capacity crunch is giving Intel its clearest opening in years to re-enter the most advanced chipmaking race, with Google and Nvidia exploring Intel as a potential backup...
    Monday 8 June 2026
    India roundup: India state targets chip packaging hub as India courts Taiwanese electronics investment

    Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry...

    Friday 5 June 2026
    Hiwin and Qualcomm bring edge AI to PLP equipment with Load Port tie-up at Computex
    Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge...
    Friday 5 June 2026
    Nexchip carves out BGBM assets to back Wuhu wafer project, refocuses on 12-inch foundry business
    Nexchip Semiconductor plans to carve out its BGBM business by contributing specialised equipment assets to Anhui Ruijing Semiconductor, a newly established power device wafer-processing...
    Thursday 4 June 2026
    Formosa Chemicals moves into AI data center materials and DUV photoresist precursors
    Formosa Chemicals & Fibre Corp. announced plans to expand into high-value semiconductor and AI data center materials and will debut these businesses at COMPUTEX TAIPEI 2026. The...
    Thursday 4 June 2026
    Exclusive: China tightens its grip on Silicon Carbide as the industry shifts to 8-inch wafers
    At Computex 2026, much of the spotlight fell on the rapid evolution of AI data center infrastructure. Among the technologies drawing renewed attention was silicon carbide (SiC), a...
    Wednesday 3 June 2026
    MediaTek denies rumored EMIB adoption timeline
    MediaTek denied a foreign report about a timeline for adopting Intel Corp.'s embedded multi-die interconnect bridge packaging at a recent investor event and said its supply-chain strategy...
    Wednesday 3 June 2026
    SK Group weighs pausing SK Siltron sale as AI chip demand lifts wafer strategy
    SK Group is reportedly placing AI and semiconductors at the center of its next round of business restructuring, prompting a fresh internal review of the strategic value of SK Siltron,...
    Monday 1 June 2026
    AuthenX targets CPO bottlenecks with detachable metalens FAU
    AuthenX is preparing to showcase a detachable 2D fiber-array unit at COMPUTEX 2026, as the Taiwanese optical-communications company seeks to address packaging and alignment challenges...
    Thursday 28 May 2026
    CXMT cleared for IPO listing; could boost China's memory supply chain
    ChangXin Memory Technologies (CXMT), China's top DRAM maker, has been cleared by China's securities regulator for its highly anticipated IPO, which could raise funds worth CNY29.5...
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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook