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Monday 15 December 2025
Weekly news roundup: TSMC pauses Japan fab plans, Tesla Powerwall demand rises in Taiwan, Huawei flags AI oversupply risks
These are the most-read DIGITIMES Asia stories in the week of December 8 to December 14, 2025.
Sunday 14 December 2025
Taiwan's WinWay partners with Technoprobe and MS SUN in 5-year MEMS probe card deal
Taiwanese semiconductor wafer probe card maker WinWay Technology has entered a long-term supply agreement with Italy's Technoprobe, a leading probe card manufacturer, and Greater...
Friday 12 December 2025
TSMC pauses work on second Kumamoto wafer fab amid potential shift to AI chip production
TSMC, through its Japanese subsidiary Japan Advanced Semiconductor Manufacturing (JASM), has halted construction on its second wafer fabrication facility in Kikuyo Town, Kumamoto...
Friday 12 December 2025
Phison sets 3 supply strategies amid NAND shortage and wafer price surge
Cloud giants' aggressive procurement of high-capacity enterprise SSDs has triggered a structural shortage and price surge in the NAND Flash market. In China, spot prices for 512Gb...
Thursday 11 December 2025
Wingtech seeks talks with Nexperia custodians as governance standoff deepens
Wingtech Technology has invited the court-appointed custodians of Nexperia for talks, marking the latest move in a protracted governance battle that has disrupted semiconductor supplies...
Wednesday 10 December 2025
Scientech posts over NT$10B revenue in 11 months, order visibility extends to 2H26
Advanced packaging equipment and wafer reclaim solutions provider Scientech reported consolidated revenue of NT$958 million (US$30.77 million) in November 2025, up 9% sequentially...
Tuesday 9 December 2025
Topco Scientific to showcase key semiconductor materials and equipment at SEMICON Japan
The SEMICON Japan 2025 exhibition is set to take place in Tokyo from December 17 to 19, 2025, with Topco Scientific (TSC) and its Japanese subsidiary Shunkawa participating alongside...
Tuesday 9 December 2025
SK Hynix adopts hybrid bonding for 300-layer NAND to challenge Samsung
South Korean memory giant SK Hynix is fast-tracking the development of its next-generation 300-layer V10 NAND flash memory, according to reports in Korean media outlets Hankyung...
Saturday 6 December 2025
Fabship takes chip manufacturing into orbit as industry eyes Space-based fabs

As artificial intelligence (AI) accelerates the global semiconductor race—and as commercial space activity heats up—the idea...

Thursday 4 December 2025
Commentary: Why Onsemi, STMicro, and Nvidia are all converging on Innoscience's GaN factory floor
Onsemi and Innoscience have signed a memorandum of understanding to expand mass production of GaN power devices using Innoscience's mature 8-inch GaN-on-silicon technology. Onsemi...
Wednesday 3 December 2025
Onsemi and Innoscience sign MoU to explore expanded GaN power device production
Onsemi and Innoscience have signed a memorandum of understanding to assess opportunities for expanding the manufacturing of gallium nitride (GaN) power devices, with a focus on accelerating...
Thursday 27 November 2025
Jtron joins Advantest and TSMC's outsourced test service chain
Jtron Technology, a semiconductor test equipment engineering and technical service provider that has joined the supply chains of Advantest and TSMC, is scheduled to list on the over-the-counter...
Wednesday 26 November 2025
Global wafer foundry industry, 2026 and beyond

Introduction

Tuesday 25 November 2025
Tesla to potentially manufacture AI5 chip at Samsung's Hwaseong foundry
Tesla CEO Elon Musk recently indicated that the design finalization of Tesla's AI5 chip is imminent, sparking speculation about Samsung Electronics' semiconductor foundry in South...
Monday 24 November 2025
Toshiba's China SiC turn triggers Japan's power-chip intervention
Toshiba's sudden move from its long-standing partnership with Rohm Semiconductor to a brief collaboration with China's Sicc unsettled Japan's power semiconductor sector. Toshiba reversed...