Toshiba's semiconductor and electronic components subsidiary, Toshiba Electronic Devices & Storage, has reached a basic agreement with China's silicon carbide (SiC) wafer manufacturer...

Taiwan Semiconductor Manufacturing Co. (TSMC) has decided to operate its upcoming 2nm wafer fabs entirely without Chinese-made equipment. The new lines are scheduled to begin operations...

As NAND leaders recalibrate production allocation, Taiwan's Winbond Electronics and Macronix International are doubling down on specialized segments. Both are expanding their presence...

As the US government seriously considers taking a stake in Intel, the company faces more than just a simple transaction; it has become a strategic industry bet. Once the semiconductor...

China has unveiled its first domestically developed commercial electron-beam lithography (EBL) tool, marking a symbolic step forward in efforts to reduce reliance on foreign semiconductor...

As China's semiconductor juggernaut gathers pace, a fierce contest for dominance in the silicon wafer market is becoming inevitable for global suppliers.

Chinese semiconductor equipment makers are increasingly taking the offensive in protecting their technology and intellectual property. Beijing E-Town Semiconductor Technology has...

Xintec Inc., TSMC's backend packaging and testing unit, posted a strong second-quarter 2025 rebound in wafer probe revenue, driven by increased outsourcing from TSMC and the accelerated...