News tagged wafer at DIGITIMES

NEWS TAGGED WAFER

Tuesday 1 September 2026

Taiwan chip equipment maker Skytech opens advanced process lab with TSMC backing

Skytech and TSMC have opened an Advanced Process Laboratory focused on next-generation semiconductor manufacturing, highlighting TSMC's continued efforts to support Taiwan's domestic...

Tuesday 1 September 2026

ASML says High NA EUV has reached its first high-volume logic product

ASML told a SEMICON Taiwan audience that its High NA EUV platform has been used for a high-volume logic product for the first time, a threshold the company frames as the point at which...

Tuesday 1 September 2026

Trymax lands multi-year AOI order as InP laser capacity race tightens

Applied Optoelectronics (AOI) has placed a multi-year purchase order with Dutch equipment maker Trymax Semiconductor Equipment for plasma ashers and UV curing systems destined for...

Tuesday 1 September 2026

SEMI lifts 2028 wafer fab equipment forecast to US$220 billion

SEMI has raised its forecast for global wafer fab equipment (WFE) sales in 2028 to US$220 billion, up from about US$200 billion projected in July, as stronger investment in advanced...

Monday 31 August 2026

China silicon wafers enter AI-led upcycle: prices rise, 12-inch capacity expands

Hangzhou Lion Microelectronics plans to invest about CNY3 billion (approx. US$446 million) in a new 12-inch silicon wafer project in Jiaxing,...

Monday 31 August 2026

China's silicon wafer makers report profit gains of varying quality

Seven Chinese silicon wafer producers reported first-half 2026 results in the second half of August, indicating an uneven sector recovery. Several semiconductor-grade wafer makers...

Friday 28 August 2026

AI packaging race heats up: Taiwan OSATs plan US$14.6 billion capex

The AI investment cycle is spreading from leading-edge wafer fabrication into semiconductor packaging and testing, with Taiwan's largest...

Friday 28 August 2026

YMTC builds China chip supply chain around Wuhan fabs with 'Wutong Tree' Plan

Competition in China's memory sector is extending beyond wafer capacity and process technology into semiconductor equipment, materials and components. YMTC is expanding its domestic...

Thursday 27 August 2026

HTSI targets AI chip demand with SiPh, CPO, packaging push

Hermes Testing Solutions (HTSI) said revenue for the first seven months of 2026 reached NT$2.7 billion (US$83.8 million), up 128.2% year-over-year and already exceeding its full-year...

Wednesday 26 August 2026

TSMC packaging shift could boost AMD CoWoS share and trim Nvidia's allocation

Morgan Stanley said TSMC's advanced packaging allocation is expected to shift in 2027, as processor demand tied to agentic AI lifts AMD's CoWoS usage and reduces Nvidia's share. The...

Wednesday 26 August 2026

China has plenty of indium but not enough InP wafers for AI data centers

China accounts for more than 70% of the world's primary indium output but only about 10% of finished indium phosphide substrates, leaving a gap between its strength in raw materials...

Tuesday 25 August 2026

Insight: One Nexperia, two supply chains? China-Europe split tests automotive chip model

Nexperia China is accelerating its separation from the Dutch chipmaker's traditional European manufacturing network, raising the prospect that one of the world's largest suppliers...

Tuesday 25 August 2026

Nexperia China rebuilds 12-inch local supply chain after 330 days

Nexperia China said it has rebuilt a domestic 12-inch wafer supply chain after 330 days of overseas wafer supply disruptions, unveiling the new platform at a press conference outlining...

Tuesday 25 August 2026

Samsung Foundry sees higher 4nm volumes as Nvidia ramps Groq 3

Nvidia's Groq 3 ramp is adding meaningful 4nm volume to Samsung Electronics' foundry business, with monthly wafer input estimated at about 10,000 and expected to rise above 15,000...

Tuesday 25 August 2026

Samsung, SK Hynix step up China NAND upgrades as US tool risks grow

Samsung Electronics and SK Hynix are stepping up equipment spending at their NAND flash plants in China through 2027, upgrading existing...

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Sep 1, 08:00

Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing

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