185 news items tagged Broadcom
ABF substrate suppliers see clear order visibility stretch into 2H21
Tuesday 26 January 2021Taiwan-based IC substrate providers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have seen the visibility of orders for ABF substrates extend to second-half...
TSMC, UMC to see full capacity utilization for 28nm node through 3Q21
Monday 18 January 2021Both TSMC and UMC are expected to sustain full capacity utilization for 28nm manufacturing process at their 8-inch and 12-inch fabs throughout third-quarter 2021, with gross margins...
III-V IC players enjoy high capacity utilization for 5G, Wi-Fi 6 applications
Wednesday 13 January 2021Taiwan's III-V IC firms including GaAs foundries Win Semiconductors and Advanced Wireless Semiconductor (AWSC) as well as epi-wafer suppliers Visual Photonics Epitaxy (VPEC) and Intelligent...
Development of 3nm process challenging TSMC, Samsung
Thursday 31 December 2020TSMC and Samsung Electronics have both encountered different but critical bottlenecks in the development of their respective 3nm process technologies, according to industry sources...
Components demand for iPhone 12 Pro series gaining momentum
Tuesday 17 November 2020Component shipment momentum for iPhone 12 series continues to strengthen, with order visibility for VCM (voice coil motor) components for iPhone 12 Pro and Pro Max models clear through...
TSMC sees 28nm process capacity utilization ramp up
Wednesday 4 November 2020TSMC has seen capacity utilization rates for 28nm process technology surge and come to nearly 100% in the fourth quarter of 2020, thanks to the bulk of orders transferred by Qualcomm...
TSMC may move 6th-gen CoWoS to production in 2023
Monday 26 October 2020TSMC continues to advance in CoWoS-S packaging adopting silicon interposer, with the prospect of entering volume production in 2023 for the sixth-generation of the technology that...
TSMC to ramp up 3nm chip production starting 2H22
Friday 25 September 2020TSMC is on track to enter 3nm chip production with monthly output set to reach 55,000 wafers in the second half of 2022, according to sources familiar with the matter. The 3nm process...
TSMC to open new packaging fabs in 2021-22 using 3D Fabric platform
Thursday 24 September 2020TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly...
OSAT providers to enjoy impressive SiP sales growth in 2020
Wednesday 9 September 2020Leading OSAT providers, such as ASE Technology, are expected to see revenues generated from their SiP businesses climb about 30% in 2020, driven by demand for 5G, AI and HPC device...
SiP demand to boom in 2021
Friday 4 September 2020System-in-package (SiP) demand will grow further on a wide range of applications enabled by the emerging 5G, AI and HPC technologies in 2021, according to industry sources.
USI obtains new SiP orders for Wi-Fi 6E modules
Tuesday 1 September 2020Taiwan-based Universal Scientific Industrial (USI), a subsidiary of ASE Technology, has reportedly grabbed major system-in-package (SiP) orders for Wi-Fi 6E chip modules for 5G 6GHz...
Nan Ya delivers sample SiP substrates for 5nm chips
Friday 21 August 2020Nan Ya PCB has delivered samples of SiP substrates for processing 5nm chips for validations by clients and expects to kick off shipments of such substrates by the end of 2020 at the...
HiSilicon team in Taiwan shrinking
Wednesday 19 August 2020Huawei's chipmaking subsidiary HiSilicon has seen many of its staff in Taiwan leaving amid increasingly tough trade sanctions from the US on the Chinese tech group, according to industry...
Kioxia SSD gain compatibility approval with Broadcom tri-mode adapters
Wednesday 22 July 2020Kioxia has announced that its lineup of NVMe, SAS and SATA SSDs have been successfully tested for compatibility and interoperability with Broadcom's 9400 series of host bus adapters...
Synaptics announces DisplayLink acquisition
Tuesday 21 July 2020Synaptics has announced a deal to acquire DisplayLink, which provides high-performance video interface technology. This comes on the heels of the acquisition of Broadcom's WiFI and...
Taiwan GaAs supply chain to log robust 5G PA shipments in 2H20
Monday 20 July 2020Taiwan's GaAs foundry houses Win Semiconductors and Advanced Wireless Semiconductor (AWSC) and epi-wafer supplier Visual Photonics Epitaxy (VPEC) are set to enjoy robust PA (power...
Synaptics to acquire rights to Broadcom wireless IoT connectivity biz
Wednesday 8 July 2020Synaptics has announced the signing of definitive agreements under which Synaptics will acquire certain assets and manufacturing rights associated with the wireless IoT business of...
Nan Ya PCB looks to ABF, SiP substrates for profit growth in 2020
Thursday 18 June 2020Nan Ya PCB will be striving to boost its profits in 2020 by focusing more on shipments of high-value products such as ABF and SiP substrates, according to company chairman CC Wu.
Kioxia launches 24G SAS SSD for servers, storage
Wednesday 17 June 2020Kioxia America has launched what it claims is the industry's first 24G SAS SSDs for server and storage applications.
No peak season for consumer chips in 2H20: Q&A with WT chairman Eric Cheng
Tuesday 16 June 2020Renesas Electronics has announced a decision to delegate IC distribution rights to only a few partners, with Taiwan's WT Microelectronics among them. WT is now also a main sales agent...
IC substrate makers shifting focus to US clients from Huawei
Friday 5 June 2020Taiwan-based IC substrate makers including Unimicron Technology and Na Ya PCB are gearing up to strengthen business ties with US clients seeking to offset expected losses of orders...
Networking to drive ABF substrate market growth in 2H20
Tuesday 2 June 2020Networking devices, in addition to servers, will be driving the ABF substrate market growth in the second half of 2020 bolstered by growing demand to support remote activities, according...
Pandemic-triggered robust demand for networking chips, notebook chip solutions, healthcare sensors and MCUs is expected to last into October, with networking ASICs, in particular,...
Wi-Fi 6 ecosystem fast taking shape
Monday 1 June 2020As network connectivity is growingly necceary for users of notebooks and other electronics devices in their remote work and learning activities, a new ecosystem associated with the...

Computex 2009: Broadcom unveils Bluetooth+Wi-Fi module for netbooks
Photo: Meiling Chen, Tuesday 9 June 2009