Arm has brought on Rami Sinno, the former Amazon Web Services (AWS) executive who helped lead development of the Trainium and Inferentia processors, along with senior engineers from...
Below are the top DIGITIMES Asia stories from Aug 4 to Aug 10, 2025. The top three topics include 'China for China' drives Western chipmakers' strategy, Xiaomi releases open-source...
Micron Technology has launched three data center SSDs aimed at the AI application market, featuring 232-layer stacked G9 NAND technology and introducing the world's first PCIe Gen6...
Despite Nvidia's absence at the 2025 OCP APAC Summit, rival factions within the anti-NVLink camp clashed over competing interconnect strategies for next-generation AI infrastructure...
Broadcom has begun shipping its new Jericho4 Ethernet fabric router, a high-performance platform designed to meet the growing demands of distributed artificial intelligence (AI) in...
Broadcom has introduced its next-gen Ethernet switch chip, Jericho4, at the 2025 OCP APAC Summit, marking a key move toward scaling AI data center connectivity across regions. The...
Broadcom has unveiled Jericho4, its latest AI fabric router chip designed to connect geographically dispersed data centers, reinforcing the company's belief that Ethernet—not...
The Open Compute Project APAC Summit (OCP APAC) will officially open in Taipei in early August 2025. American IC design giant Broadcom, which holds a critical position in cloud AI...
The long-rumored Nvidia Taiwan headquarters was finalized at the end of May 2025, with CEO Jensen Huang personally announcing its location in the Beitou-Shilin Technology Park (BSTP),...
MediaTek and Broadcom continue to compete for Meta's new application-specific integrated circuit (ASIC) projects, with industry insiders stressing that both companies are performing...
As major US-based cloud service providers (CSPs) prepare to announce their latest earnings, investors are closely monitoring their investment strategies in cloud infrastructure and...
Broadcom has launched its latest Tomahawk Ultra Ethernet switch chip, fabricated using TSMC's 5nm process, targeting high-performance AI infrastructure with a design aimed squarely...
Malaysia has steadily developed its outsourced semiconductor assembly and testing (OSAT) industry, with Penang — often called the "Silicon Valley of the East" — at its...
Broadcom has reportedly scrapped its plan to invest US$1 billion in an assembly, test, and packaging (ATP) facility in Spain. Reuters and Europa Press cited insiders...
