News tagged Broadcom at DIGITIMES

NEWS TAGGED BROADCOM

Thursday 5 March 2026

Broadcom says move into rack shipments won't dent margins, signals deeper customer deals, and supply confidence

Broadcom's pivot to shipping complete AI racks — not just chips — will be a meaningful operational shift but one the company says is already priced into its margins and...

Thursday 5 March 2026

Broadcom-TSMC 3.5D AI chips give ASIC leader an early edge over Nvidia

In the AI era, technological competition among leading chip design companies continues to intensify. Broadcom announced in 2024 that it...

Thursday 5 March 2026

Broadcom says Tomahawk switches are driving market share as AI networking demand accelerates

On March 4, Broadcom told investors its Tomahawk family is a key competitive advantage as customers build larger AI clusters. Management highlighted Tomahawk 6 — which it described...

Thursday 5 March 2026

Broadcom targets $100bn AI chip revenue by 2027 as hyperscaler demand scales

On March 4, Broadcom told investors on its fiscal first quarter 2026 earnings call that its projection of “significantly in excess of US$100 billion” in 2027 refers specifically...

Thursday 5 March 2026

Broadcom says five AI chip partners are ramping, OpenAI slated for 2027

Broadcom on Monday detailed progress across its custom AI XPU roadmap, saying deployments with five major customers are advancing and that a sixth — OpenAI — is set to...

Thursday 5 March 2026

Broadcom posts $19.3B quarter as AI surge drives $22B revenue outlook

Broadcom's first-quarter results and stronger-than-expected guidance underscore accelerating AI-driven demand in the data-center market, with implications for chip supply chains and...

Monday 2 March 2026

Insight: Broadcom delivers 2nm 3.5D AI processor, expanding custom chip push against Nvidia

Broadcom has begun shipping the industry's first 2nm custom compute SoC built on its 3.5D eXtreme Dimension System in Package (XDSiP) platform...

Friday 20 February 2026

SK Group chairman Chey meets US tech leaders to secure core AI chip supply chain

SK Group Chairman Chey Tae-won recently traveled to the US for a series of high-level meetings with CEOs from Nvidia, Broadcom, Microsoft, Meta, and Google. The strategic focus extends...

Tuesday 3 February 2026

AMD and Broadcom back Powertech's FOPLP; monthly revenue to hit NT$3 billion

Memory packaging giant Powertech Technology is aggressively expanding into fan-out panel-level packaging (FOPLP), with chairman Duh-Kung Tsai optimistic about the AI industry. Amid...

Friday 30 January 2026

MediaTek, Alchip, Marvell clash for ASIC runner-up spot

The competition among cloud service providers (CSPs) and AI companies for application-specific integrated circuits (ASICs) has entered a new phase with Microsoft officially launching...

Thursday 22 January 2026

Cloud ASIC shipments set to surge in 2026; memory capacity remains key risk

2026 is shaping up as a breakout year for cloud application-specific integrated circuit (ASIC) shipments. Not only has Broadcom secured mass production projects with multiple major...

Saturday 17 January 2026

Research Insight: System-level design, energy efficiency, and TCO drive AI hardware competition

AMD introduced its Helios system platform at CES 2026, marking a significant move in cloud AI computing competition from traditional single-chip performance to full rack-scale solutions...

Friday 2 January 2026

Samsung gains edge in AI memory race after reportedly leading Broadcom system-level tests

Samsung Electronics' sixth-generation high-bandwidth memory, HBM4, has reportedly posted the fastest operating speeds in a key technology test run by Broadcom. The results strengthen...

Monday 29 December 2025

Silicon photonics set to make commercial breakthrough in 2026

Data centers are entering a new phase of infrastructure upgrades in 2026, feeding off generative AI under Nvidia's leadership. While silicon photonics (SiPh) and co-packaged optics...

Tuesday 16 December 2025

Samsung steadies 12-Layer HBM3E, eyes larger Google TPU orders

Samsung Electronics has reportedly stabilized the performance of its 12-layer high-bandwidth memory, a development that could allow the company to expand shipments to Google's artificial...

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