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Thursday 17 September 2026
Deloitte Taiwan seminar highlights system integration as Physical AI moves into industrial applications
Taiwan's next opportunity in Physical AI may depend less on individual robot components than on its ability to integrate hardware, software, sensing and control into deployable industrial...
Thursday 17 September 2026
Samsung Galaxy S27 series rumored to feature 4 models, reshaping flagship lineup with display and camera upgrades
Samsung Electronics is expected to launch its Galaxy S27 series in early 2027, marking what could be its most significant product lineup restructuring in years. Market reports indicate...
Thursday 17 September 2026
Huawei Connect 2026: Ascend 960 puts industry-first NPO supernode at heart of Huawei's AI scale-up bet
Huawei has unveiled its next-generation Ascend 960 supernode, positioning near-packaged optics (NPO) at the centre of its effort to scale AI computing beyond the limits of individual...
Thursday 17 September 2026
Apple's AI ambitions are outgrowing the Mac — Nvidia may hold the key
Apple is exploring a return to the enterprise server market with an AI inference system built around future M8 Ultra chips, potentially using Nvidia's NVLink Fusion interconnect te...
Thursday 17 September 2026
Apple's foldable phone puts thinness, weight in focus

Apple's first foldable phone has sharpened global attention on smartphone design trade-offs, with weight, thickness, and component miniaturization...

Wednesday 16 September 2026
DIGITIMES Insight: Google outlines AI compute expansion, speeds TPU cycle to 6 months

DIGITIMES Intelligence said Google used SEMICON Taiwan 2026 to outline the direction of its AI infrastructure strategy, focusing not...

Wednesday 16 September 2026
AI efficiency fuels Jevons Paradox debate over HBM demand
As artificial intelligence (AI) models move from answering questions to autonomously completing multi-step tasks, OpenAI's new model GPT-6 Astra, or Astra, is drawing fresh market...
Wednesday 16 September 2026
Beyond 2nm: Dimensity 9600 Pro gives MediaTek a bigger role in mobile AI
MediaTek has officially launched the Dimensity 9600 Pro, introducing a major architectural overhaul for its 2026 flagship mobile chip. Beyond the shift to a 2nm process, the new platform...
Tuesday 15 September 2026
China optical transceivers avoid US FCC curbs as NPO, CPO battle for high-speed interconnect supremacy

The US Federal Communications Commission (FCC) recently updated its equipment authorization rules, prohibiting authorization of devices...

Tuesday 15 September 2026
Minebea Mitsumi pauses M&A to chase AI hardware demand
Minebea Mitsumi has halted its push for new acquisitions and is shifting resources toward producing ball bearings, motors and actuators for AI hardware, as demand tied to data centers,...
Tuesday 15 September 2026
OpenAI reportedly acquires AI camera startup Glass Imaging for more than US$300M

OpenAI has acquired Glass Imaging, a startup developing artificial-intelligence (AI) technology designed to improve smartphone camera performance,...

Tuesday 15 September 2026
Hyundai Motor Group bets on data, Nvidia, and in-house AI to speed autonomous driving rollout
Hyundai Motor Group is moving to standardize its autonomous driving hardware, deepen its data pipeline, and accelerate in-house AI development as it prepares a staggered rollout of...
Saturday 12 September 2026
Exclusive: ASUS xHIS aims to become digital backbone for AI-ready healthcare

Asustek Computer (Asus) has been accelerating the integration of AI, hardware, software, and cloud technologies into healthcare as it...

Saturday 12 September 2026
Commentary: Apple sends off Cook with a foldable flourish, but Ternus's trial is still ahead
Apple has finally unveiled the long-anticipated foldable iPhone Duo, with former CEO Tim Cook making a brief appearance at the start of the launch video. The moment suggested the device...