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Monday 21 September 2026
Wiwynn chair says AI hardware is being reshaped by power, cooling, interconnect demands

AI computing is changing how global hardware is designed, built, and deployed, with implications that extend well beyond Taiwan's tech...

Monday 21 September 2026
AMAX expands liquid-cooled data center in push beyond hardware

Amax is expanding its self-built liquid-cooled data center as the company moves beyond hardware into infrastructure and engineering...

Monday 21 September 2026
US-Mexico trade talks put AI servers in focus as Taiwan ODMs seek common ground

The US is reportedly pressuring Mexico to tighten rules of origin for AI hardware to limit the use of components produced outside North...

Friday 18 September 2026
ByteDance builds strong supply chain force to master emerging hardware ecosystems beyond core demand

The Chinese smart glasses sector is rapidly consolidating around the principle that "subtraction is king." Rather than rushing unproven...

Friday 18 September 2026
Apple and MediaTek's latest SoCs address overkill performance by reserving space for agentic AI
Apple unveiled its iPhone 18 Pro series featuring its inaugural 2nm smartphone silicon, the A20 Pro, which was followed by MediaTek's announcement of its own 2nm Dimensity 9600 Pro...
Friday 18 September 2026
Taoyuan to sign high-end IC substrate MOU with Unimicron, Kinsus as Aerotropolis zone takes shape

In response to rapid AI market growth, the Taoyuan City Government announced plans to establish a 40-hectare high-end integrated circuit...

Thursday 17 September 2026
Deloitte Taiwan seminar highlights system integration as Physical AI moves into industrial applications
Taiwan's next opportunity in Physical AI may depend less on individual robot components than on its ability to integrate hardware, software, sensing and control into deployable industrial...
Thursday 17 September 2026
Samsung Galaxy S27 series rumored to feature 4 models, reshaping flagship lineup with display and camera upgrades
Samsung Electronics is expected to launch its Galaxy S27 series in early 2027, marking what could be its most significant product lineup restructuring in years. Market reports indicate...
Thursday 17 September 2026
Huawei Connect 2026: Ascend 960 puts industry-first NPO supernode at heart of Huawei's AI scale-up bet
Huawei has unveiled its next-generation Ascend 960 supernode, positioning near-packaged optics (NPO) at the centre of its effort to scale AI computing beyond the limits of individual...
Thursday 17 September 2026
Apple's AI ambitions are outgrowing the Mac — Nvidia may hold the key
Apple is exploring a return to the enterprise server market with an AI inference system built around future M8 Ultra chips, potentially using Nvidia's NVLink Fusion interconnect te...
Thursday 17 September 2026
Apple's foldable phone puts thinness, weight in focus

Apple's first foldable phone has sharpened global attention on smartphone design trade-offs, with weight, thickness, and component miniaturization...

Wednesday 16 September 2026
DIGITIMES Insight: Google outlines AI compute expansion, speeds TPU cycle to 6 months

DIGITIMES Intelligence said Google used SEMICON Taiwan 2026 to outline the direction of its AI infrastructure strategy, focusing not...

Wednesday 16 September 2026
AI efficiency fuels Jevons Paradox debate over HBM demand
As artificial intelligence (AI) models move from answering questions to autonomously completing multi-step tasks, OpenAI's new model GPT-6 Astra, or Astra, is drawing fresh market...
Wednesday 16 September 2026
Beyond 2nm: Dimensity 9600 Pro gives MediaTek a bigger role in mobile AI
MediaTek has officially launched the Dimensity 9600 Pro, introducing a major architectural overhaul for its 2026 flagship mobile chip. Beyond the shift to a 2nm process, the new platform...