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Monday 7 September 2026
How UC Santa Cruz's Silicon Valley lab is reverse-engineering the human brain to solve AI's chip power crisis
As the global race for artificial intelligence (AI) consumes vast oceans of electricity and pushes modern utility grids to the brink, a team of California researchers is looking to...
Monday 7 September 2026
Silicon Valley goes physical: how San Jose is building an energy-rich, tariff-mitigated capital for physical AI
As the artificial intelligence revolution outgrows the digital cloud and demands physical form, a major structural transition is quietly reshaping Silicon Valley. While the region...
Monday 7 September 2026
NEC reportedly ends quantum computer hardware development, shifts focus to annealing
Japan's NEC has halted development of gate-based quantum-computer hardware, marking a strategic retreat from a field the company helped pioneer, while continuing to invest in quantum...
Monday 7 September 2026
Foxconn revenue climbs on AI server demand, outlook improves
Foxconn said August sales rose sharply from a year earlier as demand for AI servers and related hardware continued to lift its cloud and networking business. The latest update suggests...
Monday 7 September 2026
SiliconAuto pushes AI chiplets as automotive SoC ties tighten
Taiwanese automotive microcontroller (MCU) maker SiliconAuto showcased its products at SEMICON Taiwan 2026, with CEO Gene Liu saying the company is now spotlighting AI chiplet architecture...
Monday 7 September 2026
Acer hedges memory price shock with local AI, diversification
Acer Chairman and CEO Jason Chen said Taiwan is not only a global hub for AI hardware manufacturing and technology, but also an important source of capital, as many firms issue bonds...
Saturday 5 September 2026
Google TPU splits training, inference as CPU becomes next focus
As AI model training, inference, and AI agent workloads continue to grow, AI accelerators are increasingly being optimized for different tasks. Amin Vahdat, Google's senior vice president...
Saturday 5 September 2026
Jmem Tek's PQC security chip nears mass production
Taiwanese IC design startup Jmem Tek showcased its in-house physical unclonable function (PUF) and post-quantum cryptography (PQC) hardware security technologies at SEMICON Taiwan...
Friday 4 September 2026
How agentic AI and 'AI physics' are reshaping chip design
As semiconductor designs advance toward trillion-transistor packages, the traditional engineering playbook of simply adding more personnel or running legacy software faster has hit...
Friday 4 September 2026
Fujitsu says useful quantum computers may need far fewer qubits than expected
For years the quantum industry has worked on a discouraging assumption: that a machine capable of doing anything commercially useful would need a million qubits or more. Fujitsu told...
Friday 4 September 2026
Nvidia sets an October launch for RTX Spark PCs, gives local AI a router
Nvidia used IFA 2026 to argue that serious AI work can run locally as well as in the cloud, pairing an October launch date for its RTX Spark Windows PCs with free software that distributes...
Friday 4 September 2026
Acer wowed IFA with AI, gaming hardware
As Acer marks its 50th anniversary in 2026, Chairman and CEO Jason Chen said at the company's next@acer global press event during IFA in Berlin, Germany, that the PC maker's four future...
Friday 4 September 2026
Taiwan to expand industrial land for AI hardware boom
Taiwan's government says it will expand industrial land development to meet surging demand for AI infrastructure hardware, as global suppliers race to add capacity through 2027. Premier...
Thursday 3 September 2026
Google to expand Taipei AI infrastructure center as Taiwan ties deepen
Google will expand its AI infrastructure research and development center in Taipei's Shilin district, adding 60% more office space, as it deepens work with Taiwan's supply chain on...
Wednesday 2 September 2026
Hardware isn't the problem — TSMC exec flags software, substrate gaps in 3D IC
Speaking at the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA) Global Summit on September 1, Jun He, TSMC Vice President of Advanced Packaging Technology and Service, noted that...