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    China silicon wafer makers expand 12-inch capacity and consolidate mature-node operations
    6h 27min ago
    Cambricon and Moore Threads post strong 1H26 growth as China AI chips move to deployment
    6h 27min ago
    Google readies Pixel 11 lineup, market breakthrough still under question
    6h 27min ago
    Interview: Nvidia says networking is the core of AI computing as AI factories scale
    6h 27min ago
    China auto brand slump pushes parts makers toward North America, Japan
    6h 27min ago
    Taiwan producer prices surge as non-China supply chains face rising pressure
    6h 27min ago
    NEWS TAGGED FAB
    Monday 10 August 2026
    SK Hynix weighs stake sale in US$3B Chongqing chip packaging plant

    SK Hynix is considering options for its semiconductor packaging and testing facility in Chongqing, China, including bringing in an...

    Friday 7 August 2026
    Analysis: TSMC expands Japan footprint with 3nm fab, advanced packaging push
    TSMC is expanding Japan's role in its global network as it prepares to add 3nm production in Kumamoto and deepens local capabilities in advanced packaging, chip design and next-generation...
    Friday 7 August 2026
    SK hynix Invests 54T Won in Y2 and M17 Fabs

    SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has decided to build new fabs in Yongin and Cheongju to respond to the continuously growing...

    Friday 7 August 2026
    SK Hynix commits US$39 billion to new Yongin and Cheongju fabs as AI memory demand builds
    SK Hynix has approved roughly KRW54 trillion (approx. US$39 billion) in new fab construction across two domestic sites, allocating KRW35.2 trillion to a second Yongin fab and KRW19.1...
    Friday 7 August 2026
    Nokia's NXP Arizona fab buy signals AI optical bottleneck shifting upstream

    Nokia is moving deeper into semiconductor manufacturing by acquiring NXP's Chandler fabrication campus in Arizona, signaling that the...

    Tuesday 4 August 2026
    Kumamoto semiconductor production recovers, TSMC's Japan subsidiary returns to normal operations

    TSMC has announced that Japan Advanced Semiconductor Manufacturing (JASM), its subsidiary in Kikuyo, Kumamoto Prefecture, has resumed...

    Tuesday 4 August 2026
    CXMT reportedly weighs second Beijing DRAM fab as Chinese cities compete for memory chip investment

    China's leading DRAM maker ChangXin Memory Technologies (CXMT) is considering building a second 12-inch memory chip fabrication plant in...

    Tuesday 4 August 2026
    Interview: Rising material costs and FOUP shortages threaten semiconductor supply chains
    AI-driven demand, new fab construction, and conflict-led raw material inflation are combining to squeeze semiconductor suppliers in 2026, according to Topco Scientific Co. senior CEO...
    Monday 3 August 2026
    Intel offers bonuses to speed up Ohio fab construction and reaches EMIB-T yields of 90%
    Intel is awarding bonuses for overtime work as it seeks to complete the construction of its Ohio fab complex by 2031. Meanwhile, the company has made progress on the development of...
    Monday 3 August 2026
    xLight bets on EUV light source, eyes ASML deal
    The semiconductor industry is grappling with a supply-demand imbalance as AI-driven demand for advanced-node chips outpaces global capacity by several times, pushing up fab utilization...
    Monday 3 August 2026
    TSMC Kumamoto fab faces first major quake test with chip-material supplies secured
    A magnitude 7.1 earthquake struck Kumamoto Prefecture in Japan's Kyushu region on July 28, drawing attention to the recovery of Taiwan Semiconductor Manufacturing Co's Kumamoto plant,...
    Saturday 1 August 2026
    Obituary: Powerchip chairman Frank Huang dies after reshaping Taiwan's DRAM and foundry industry

    Powerchip Semiconductor Manufacturing Corp. (PSMC) chairman Frank Huang died on July 31, 2026, at age 76, closing a career that spanned...

    Friday 31 July 2026
    Samsung boosts Hwaseong DRAM capacity as it converts older NAND lines
    Samsung Electronics completed the shutdown and equipment transfer of an older NAND flash wafer fab at its Hwaseong campus in South Korea and is expanding DRAM production at the site...
    Thursday 30 July 2026
    Lam Research raises WFE outlook as AI drives NAND, DRAM, advanced packaging demand
    Lam Research delivered record quarterly results and raised its outlook for global wafer fab equipment (WFE) spending, citing accelerating AI-driven demand across memory, advanced logic...
    Thursday 30 July 2026
    China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
    China's 28nm DUV lithography programme has entered a new phase after Shanghai Aishengna Electronic Technology delivered its first five immersion deep ultraviolet lithography system...
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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