Taiwan Semiconductor Manufacturing Company's heavy investments in advanced wafer-fab technology are set to pay off significantly for the world's largest silicon foundry as it continues...

United Microelectronics (UMC) has satisfied all closing conditions, including final approval from all relevant government agencies, for the full acquisition of Mie Fujitsu Semiconductor...

DRAM chipmaker Nanya Technology, specialty DRAM and flash memory specialist Winbond Electronics and mask ROM and flash chipmaker Macronix International are expected to post substantial...

Investments in new fab projects starting construction in 2020 are expected to reach nearly US$50 billion, up about US$12 billion from 2019, according to SEMI.

China's move to improve self-sufficiency for semiconductors is gaining momentum - in line with the country's national policy and in the wake of the trade war with the US - with DRAM...

China-based DRAM chipmaker ChangXin Memory Technologies (CXMT, formerly Innotron) has kicked off 12-inch fab equipment move-in in the third quarter, aiming to start commercial runs...

Macronix International and Winbond Electronics have reported sequential increases in August consolidated revenues of 24.9% and 3.1%, respectively.

Spending on 300mm fab equipment will slowly recover in 2020 after the 2019 downturn and take off in 2021 to log a new record high topping US$60 billion, only to lag again in 2022...

Both Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) saw losses from their 12-inch wafer fabs in China during the first half of 2019, while fellow...

Eight-inch IC foundries have seen their fabless customers engaged in the fingerprint sensor, touchscreen IC, analog chip and LCD driver IC sectors step up their pace of orders recently,...

Micron Technology is already engaged in risk production of DRAM chips built using 1z-nanometer process technology at its Hiroshima fab in Japan, according to the US memory chip vendor...

Eight-inch fab utilization rates continue to fall on weak demand for automotive and consumer ICs and are unlikely to rebound until the first half of 2020, according to industry sou...

China's second-tier TV brands are ramping up shipments of over 60-inch TVs globally as the availability of less expensive panels from BOE Technology has helped improve their competitiveness,...

Foundry chipmaker Powerchip Technology has reported net losses of NT$2.69 billion (US$85.7 million) in the first half of 2019. EPS was negative NT$0.85 for the six-month period.

Micron Technology has unveiled a new NAND flash fab in Singapore with commerical run to start later this year focusing on 96-layer and beyond 3D processes, as it seeks to rely on...

Micron Technology has unveiled a new 12-inch fab at its manufacturing site for NAND flash memory in Singapore, and expects the facility to ramp up production in the second half of...

China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to have its more-advanced 14nm FinFET process ready for volume production by the end of 2019.

Toppan Photomasks and Globalfoundries have entered into a multi-year supply agreement in which Toppan will provide GF with photomasks and related services currently supported by GF's...

The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of about US$6.5 billion for the construction of new fab facilities, installation,...

Taiwan Semiconductor Manufacturing Company (TSMC) has reported July consolidated revenues slipped 1.3% sequentially but grew 14% on year to NT$84.76 billion (US$2.7 billion).

China-based flat panel maker Chongqing HKC Optoelectronics has held a topping-out ceremony for its new 8.6G fab being built in Mianyang, Sichuan, paving the way for the new fab to...

Specialty DRAM and flash memory maker Winbond Electronics has seen its 12-inch fab run at full capacity starting July, thanks to the arrival of new orders and seasonal factors.

SK Hynix saw its operating profits fall 89% from a year earlier to KRW638 billion (US$540.8 million) in the second quarter of 2019, when consolidated revenues slid 38% on year to...

Pure-play foundry United Microelectronics (UMC) expects to post a 2-4% shipment increase sequentially in the third quarter of 2019, with a 1% rise in wafer ASPs.

Specialty DRAM and flash memory chipmaker Winbond Electronics on July 22 held a beam-raising ceremony for its new 12-inch wafer plant in Kaohsiung, southern Taiwan. The new facility...