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NEWS TAGGED FAB
Wednesday 20 October 2021
Holtek secures more fab capacity for 2022 orders
Holtek Semiconductor has secured more available fab capacity to fulfill customer orders in 2022, according to the Taiwan-based MCU supplier.
Friday 15 October 2021
TSMC sees fab capacity stay tight, mulls new fab in Japan
TSMC will see its 12- and 8-inch fab capacities stay tight in 2021 and throughout 2022, and is gearing up for its next stage of growth, said company CEO CC Wei at an earnings earnings...
Thursday 14 October 2021
Chip delivery times reportedly reach nearly 22 weeks
The impact of government-led power restrictions on China's local industry supply chains is threatening to prolong delivery lead times for ICs, according to industry sources in Chin...
Thursday 14 October 2021
Power and compound fab capacity to top 10 million wafers monthly in 2023, says SEMI
Fueled by pent-up demand for automotive electronics caused by semiconductor supply chain disruptions, worldwide installed capacity for power and compound semiconductor fabs is projected...
Wednesday 13 October 2021
Taiwan DDI suppliers poised to generate significant revenue increases in 2021
Despite uncertainty emerging over the demand outlook for the fourth quarter, Taiwan-based display driver IC (DDI) specialists are all poised to generate signifiant revenue increases...
Wednesday 13 October 2021
Taiwan backend houses gain shifted orders for MOSFETs from Southeast Asia
Taiwan-based backend houses continue to land shifted orders for MOSFET and other power ICs from Southeast Asia, where operations at fabs run by international IDMs are being disrupted...
Friday 8 October 2021
MCU firm Padauk posts record 3Q21 revenue
Padauk Technology saw its third-quarter revenue hit a record high of NT$264 million (US$9.43 million), with revenue for the first three quarters of 2021 already exceeding the level...
Wednesday 6 October 2021
Kunshan plants hit by power cuts, but Nan Ya ABF substrate fab unaffected
Taiwan-based makers with factory operations in Kunshan of China's Jiangsu provinces were notified on October 5 by the local government about immediate power cuts, and have expressed...
Wednesday 6 October 2021
TSMC to expand 7nm and 28nm fab capacities
TSMC is poised to comprehensively expand production capacities for both its 7nm and 28nm process technologies, in addition to its planned 5nm process expansion, which may prompt the...
Tuesday 5 October 2021
Chipmakers striving to cope with uneven inventories across different chips
Chipmakers have experienced a worsening shortage of power management ICs and other mature chips, while having relatively high inventories of handset application processors and other...
Friday 1 October 2021
Etron strikes deal for foundry capacity through 2023
Specialty DRAM design specialist Etron Technology has signed an agreement with Powerchip Semiconductor Manufacturing (PSMC) under which the foundry will provide it sufficient fab...
Thursday 30 September 2021
Micron 1α DRAM, 176-layer NAND process yields reach maturity
Micron Technology has seen manufacturing yield rates for its 1α (1-alpha) DRAM and 176-layer NAND process nodes reach mature levels.
Wednesday 29 September 2021
Chip M&A deals reach US$22 billion in first 8 months of 2021
After a record-high start in the first quarter of 2021, semiconductor merger and acquisition announcements cool off a bit without the "megadeals" seen in 2020, according to IC Insi...
Tuesday 28 September 2021
TSMC soon to start equipment move-in at new advanced packaging fab in Taiwan, says report
TSMC is expected to kick off equipment move-in at its new advanced packaging fab in Chunan, northern Taiwan later in the second half of this year, according to a report by Taiwan's...
Thursday 23 September 2021
Intel to hold groundbreaking ceremony for new fabs on September 24
Intel is scheduled to hold a groundbreaking ceremony for the construction of two new fabs in Arizona on September 24. Company CEO Pat Gelsinger and local government officials will...