596 news items tagged fab
Samsung starts production of 7LPP with EUVThursday 18 October 2018
Samsung Electronics has started wafer production of its 7nm LPP with extreme ultraviolet (EUV) lithography technology, according to the company.
Wafer shipments forecast to set new highs through 2021, says SEMIThursday 18 October 2018
Worldwide shipments of polished and epitaxial silicon wafers are forecast to total 12.445 billion square inches in 2018, exceeding the market high set in 2017, according to SEMI....
Tsinghua Unigroup new fab construction kicks offThursday 18 October 2018
China's state-owned Tsinghua Unigroup has already begun to implement its new fab projects in Nanjing and Chengdu as part of its memory business expansion. The new manufacturing sites...
Global foundry industry to grow at 6% CAGR in next 5 years, says Digitimes ResearchMonday 8 October 2018
The production value of the global foundry industry is expected to grow by a CAGR of 6.2% to reach US$81.94 billion in 2023, the final year of a five-year forecast period, driven...
DRAM market braces for slower growth, says IC InsightsWednesday 3 October 2018
The DRAM market is known for being very cyclical and after experiencing strong gains for two years, historical precedence now strongly suggests that the DRAM ASP will soon begin trending...
Winbond starts constructing new 12-inch fabWednesday 3 October 2018
Winbond Electronics will hold a groundbreaking ceremony for its new 12-inch wafer fab in southern Taiwan on October 3, according to the Kaohsiung city government.
HDD demand for enterprise data centers remains robust, says WD executiveMonday 1 October 2018
HDD demand for enterprise data centers continues to be strong, according to Christopher Bergey, executive VP at Western Digital (WD).
TSMC to set up new fab for advanced packagingTuesday 25 September 2018
Taiwan's Environmental Protection Administration (EPA) has started its environmental impact assessment on land designated for construction of a new plant by Taiwan Semiconductor Manufacturing...
Toshiba Memory, Western Digital open new 3D NAND flash fabFriday 21 September 2018
Toshiba Memory and Western Digital have announced jointly the opening of Fab 6 and a new R&D center at Toshiba's Yokkaichi operations in Mie, Japan.
YMTC set to volume produce 64-layer 3D NAND chips in 2019Thursday 20 September 2018
Yangtze Memory Technologies (YMTC) is set to enter volume production of 64-layer 3D NAND flash memory in the fourth quarter of 2019, according to company CEO Simon Yang.
Fab equipment spending to hit all-time high in 2019, says SEMITuesday 18 September 2018
Global fab equipment spending will increase 14% this year to US$62.8 billion and is expected to rise 7.5% to US$67.5 billion in 2019, marking the fourth consecutive year of spending...
Specialty IC foundry VIS cuts outlook following power blackoutFriday 14 September 2018
Eight-inch IC foundry Vanguard International Semiconductor (VIS) has trimmed its financial guidance for the third quarter following a power blackout that hit one of its wafer fabs.
KLA-Tencor seeing robust fab tool demand from ChinaWednesday 12 September 2018
Demand from China's semiconductor industry is set to witness robust growth, according to fab toolmaker KLA-Tencor, which expects China to become its largest market in 2019.
Powerchip to undertake restructuringWednesday 5 September 2018
Powerchip Technology has disclosed plans to implement a corporate restructuring project under which the company will transfer all its 12-inch fab operations to subsidiary Maxchip...
China semiconductor fab capacity to reach 20% worldwide share in 2020, says SEMIWednesday 5 September 2018
Front-end fab capacity in China will grow to account for 16% of the world's semiconductor fab capacity in 2018, according to SEMI. The share will increase to 20% by the end of 2020...
Eight-inch fab capacity remains tight, says UMC presidentTuesday 4 September 2018
Eight-inch fab capacity remains tight, whereas there is an excess of 12-inch fab capacity, according to SC Chien, co-president for pure-play foundry United Microelectronics (UMC).
X-Fab to double 6-inch SiC foundry capacityFriday 31 August 2018
X-Fab has announced plans to double their 6-inch silicon carbide (SiC) process capacity at its fab in Lubbock, Texas in response to increased customer demand for high-efficiency power...
Memory IC to account for 53% of total 2018 semi capex, says IC InsightsFriday 31 August 2018
Total semiconductor capital expenditures are forecast to rise to US$102.0 billion in 2018, the first time that the industry spends more than US$100 billion on capex in one year, according...
Powerchip to build 2 new 12-inch fabs in TaiwanTuesday 28 August 2018
Pure-play foundry Powerchip Technology has disclosed plans to construct two new 12-inch wafer fabs in Taiwan with total investment estimated at NT$278 billion (US$9.05 billion).
Eight-inch foundries seeing orders slow downThursday 23 August 2018
Eight-inch foundries have seen their fab utilization rates remain high in the third quarter of 2018, but orders from customers have shown signs of a slowdown amid concerns about end...
Winbond board approves NT$20 billion for new 12-inch plant establishmentMonday 20 August 2018
Taiwan-based Winbond Electronics, a manufacturer of specialty DRAM and NOR flash memory, expects to start constructing its new 12-inch wafer plant at the Kaohsiung Science Park (KSP),...
DRAM prices to weaken in 4Q18, says DRAMeXchangeFriday 17 August 2018
DRAM suppliers have begun to negotiate with their clients contract prices for the fourth quarter since the middle of August, according to DRAMeXchange, which expects prices to weaken...
Cadence to open subsidiary in NanjingThursday 16 August 2018
EDA vendor Cadence Design Systems is scheduled to start operating a new subsidiary in Nanjing, China in September, according to industry sources.
UMC, VIS to enforce 8-inch foundry capacity expansionsWednesday 8 August 2018
As 8-inch wafer foundry capacity supply is expected to fall short of demand through at least 2020, Taiwan foundry houses including United Microelectronics (UMC) and Vanguard International...
Virus incident to affect less than 2% of 3Q18 revenues, says TSMC CEOTuesday 7 August 2018
TSMC has made its full recovery after being hit by a computer virus, said company CEO CC Wei at a press event on August 6. The impact on its third-quarter revenues is expected to...
3D NAND die with M.2 SSD
Photo: Company, Tuesday 7 April 2015
KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool
Photo: Company, Thursday 18 July 2013
KLA-Tencor Surfscan SP3
Photo: Company, Monday 18 July 2011