Kioxia helped create the NAND flash industry, but AI is changing what leadership in memory looks like. The Japanese supplier is benefiting from record NAND demand and higher prices,...
After more than a decade away, Apple may be preparing to return to the enterprise server market. According to The Information, as reported by Reuters, the company is...
Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged optics (CPO), chiplets, and glass...
At SEMICON Taiwan 2026, Google outlined the direction of its AI infrastructure, and DIGITIMES notes that the discussion extended well beyond its next-generation TPU....
SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with the HBM4E generation, a move that...
As artificial intelligence applications accelerate, surging global semiconductor demand is pushing advanced packaging, co-packaged optics (CPO), glass core substrates...
