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NEWS TAGGED NAND
Thursday 1 June 2023
Micron intros new PCIe Gen5 SSD and DRAM offerings for high-throughput apps
Micron Technology has introduced the Crucial Pro series, which consists of memory and storage products designed for gamers, content creators, workstation professionals, and anyone...
Tuesday 30 May 2023
Phison sees opportunities arising from AI storage
Phison Electronics, a NAND flash device controller specialist, believes that AI will gain traction in a variety of NAND storage applications, and that the company will expand its...
Monday 22 May 2023
NAND flash prices may level off after 3Q23, says Silicon Motion
NAND flash memory prices are unlikely to stabilize until after the third quarter of 2023, according to Wallace Kou, president and CEO of flash device controller specialist Silicon...
Friday 19 May 2023
NAND flash chipmakers mull price hike
NAND flash chipmakers including Samsung Electronics, SK Hynix, and China's Yangtze Memory Technologies (YMTC) are considering raising their quotes, according to sources at memory...
Wednesday 17 May 2023
Micron intros new datacenter SSD featuring 232-layer NAND
Micron Technology has released two SSDs: the Micron 6500 ION NVMe SSD and the Micron XTR NVMe SSD. These drives, designed to keep up with the accelerating growth of data, provide...
Tuesday 16 May 2023
SK Hynix denies using NIL equipment for 3D NAND production in 2025
According to South Korea media ChosunBiz, citing Korean industry sources, SK Hynix is testing nano imprint lithography (NIL) equipment and conducting R&D associated with...
Monday 15 May 2023
DRAM and NAND flash prices to fall further in 2Q23
According to TrendForce, DRAM and NAND Flash prices are expected to fall further in the second quarter of 2023 due to weak server shipments and high inventory levels.
Tuesday 9 May 2023
Neo Semiconductor develops 3D NAND-like DRAM
Neo Semiconductor has announced the release of 3D X-DRAM, the world's first 3D NAND-like DRAM, which the company believes would eliminate DRAM's capacity issue and replace the entire...
Tuesday 9 May 2023
Memory market emerging from slump
The memory chip market is coming out of its slump, with server and PC applications driving the recovery, according to sources at memory module makers.
Monday 8 May 2023
Macronix April revenue hits 6-month high
Macronix International, a maker of mask ROM and flash memory, saw its revenue climb to a six-month high of NT$3.01 billion (US$98 million) in April 2023.
Monday 8 May 2023
Memory suppliers in bankruptcy risk on seesawing NAND price
The latest financial results of the world's top three memory suppliers report total losses of US$8.3 billion. The amount exceeds US$10 billion if it includes losses of other suppliers...
Friday 5 May 2023
Silicon Motion sees gradual recovery in memory market
Silicon Motion Technology, a memory device controller IC company, has seen an increase in client orders that may lead to a stronger market rebound by the end of 2023.
Thursday 27 April 2023
Micron to stop lowering memory chip prices starting May, say sources
Micron Technology has recently notified its distributors that starting in May, it will not consider any requests for DRAM and NAND flash quotes lower than the current levels, according...
Wednesday 26 April 2023
SK Hynix remains in the red, sees sales rebound ahead
SK Hynix saw its operating loss widen to about KRW3.4 trillion (US$2.54 billion) in the first quarter of 2023 from KRW1.9 trillion in the prior quarter, when revenue declined 34%...
Tuesday 25 April 2023
NAND flash beyond 200 layers? Chinese equipment vendor admits difficulty
As a result of an SCMP report indicating that Chinese memory chip maker Yangtze Memory Technologies Corp. (YMTC) is planning to use domestically sourced equipment to make...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.