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NEWS TAGGED NAND FLASH
Thursday 5 August 2021
Adata, Apacer post handsome profits in 1H21
Memory module makers Adata Technology and Apacer Technology have both posted significant profit increases in the first half of 2021.
Monday 2 August 2021
Macronix gearing up for ROM output ramp-up
Macronix International is gearing up for a substantial ramp-up in shipments of its ROM memory chips starting the third quarter of 2021, according to company president CY Lu.
Monday 2 August 2021
YMTC starts shipping 128-layer 3D NAND flash for China homegrown SSD
Yangtze Memory Technologies (YMTC) has kicked off mass production of 128-layer 3D NAND flash memory for a home-grown SSD series, according to industry sources.
Thursday 29 July 2021
DRAM, NAND flash contract prices grow modestly in 3Q21
Contract market prices for DRAM and NAND flash memory have both registered a modest 5-10% growth in the third quarter of 2021, according to industry sources.
Wednesday 28 July 2021
Macronix to expand 12-inch fab capacity
Macronix International, a maker of memory chips, has disclosed plans to expand its 12-inch fab capacity for 3D NAND and NOR flash with an investment of NT$41.5 billion (US$1.48 bil...
Wednesday 28 July 2021
Macronix sees profits more than double in 2Q21
ROM and NOR flash memory maker Macronix International saw its net profits climb 110% sequentially to NT$1.93 billion (US$68.6 million) in the second quarter of 2021, buoyed by rising...
Tuesday 27 July 2021
SK Hynix posts profit surge in 2Q21
SK Hynix has reported net profits surged 100% sequentially and 57% on year to KRW1.99 trillion (US$1.73 billion) in the second quarter of 2021.
Monday 19 July 2021
Memory channel sales in China sluggish
Memory module houses and channel distributors are less optimistic about the outlook for China's channel sales in the third quarter of 2021, despite an ongoing rally in contract market...
Monday 12 July 2021
Adata expects double-digit rise in DRAM contract prices
Memory module maker Adata Technology expects DRAM contract prices to register a double-digit sequential surge in the third quarter of 2021, with an over 15% rise in low-power DRAM...
Friday 9 July 2021
Phison to see revenue hit another record high in 3Q21
Phison Electronics is expected to see its revenue hit another record high in the third quarter of 2021, buoyed by rising NAND flash prices and strong SSD sales, according to market...
Friday 9 July 2021
Supreme upbeat about server chip demand in 3Q21
Growth in memory chip demand for servers and data centers is poised to outperform that for handsets in the third quarter of 2021, according to Taiwan-based Supreme Electronics.
Monday 5 July 2021
OSATs see significant surge in 2H21 memory backend demand
Taiwan memory backend specialists are optimistic about their business prospects for the second half of the year as memory demand for handset and other consumer electronics applications...
Wednesday 30 June 2021
External SSD demand for Sony PS5 to surge in 2H21
Sony will soon reveal a list of PS5-compatible external SSDs, which will be driving growth in the overall large-capacity SSD demand during the second half of 2021, according to industry...
Tuesday 29 June 2021
DRAM, NAND flash prices to rise about 10% in 3Q21
DRAM and NAND flash prices are expected to rise about 10% sequentially in the third quarter of 2021, but the price outlook for the fourth quarter is still uncertain, according to...
Monday 28 June 2021
Flash device controller suppliers see order visibility stretched
NAND flash device controller suppliers have seen order visibility stretched beyond 2022 to 2023, thanks to strong demand for notebook, Chromebook and handset applications, coupled...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.