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Monday 19 January 2026
NIST's PQC standards trigger global race to secure data before quantum attacks arrive
In August 2024, the US National Institute of Standards and Technology (NIST) finalized three Post-Quantum Cryptography (PQC) standards, known as FIPS 203, 204, and 205. These standards...
Thursday 15 January 2026
Column: Q-Day could break the internet—and the countdown has started

The development of quantum computing is increasingly taking on the character of a global arms race. Nations and corporations that secure...

Tuesday 13 January 2026
Column: IBM's 50-year-old liquid cooling patent shapes today's AI data center cooling
If today's AI data centers are blazing "powder kegs" of heat, IBM was the visionary that prepared the "fire extinguisher" half a century ago. While Nvidia's top chips now require water...
Monday 12 January 2026
Column: Decoding Jensen Huang's CES 2026 keynote and the AI infrastructure reset
At the opening of his keynote, Nvidia CEO Jensen Huang delivered a stark message: the world's US$10 trillion computing infrastructure is entering a fundamental modernization phase,...
Thursday 8 January 2026
Column: Infrastructure boom over, US AI now faces profitability reckoning
The US AI sector stands at a crossroads. After years of breakneck infrastructure expansion, cracks are beginning to show in the financial foundation supporting this boom.
Wednesday 7 January 2026
Column: US political economy enters new era of industrial revival and strategic decoupling
The global economic landscape underwent three major transformations in 2025: the Great Rebalancing, the evolution of the AI supercycle, and a US industrial revival driven by national...
Wednesday 24 December 2025
2D materials: from memory entry to logic's future
Two-dimensional (2D) materials were once regarded as important candidates for extending semiconductor scaling. Because they are only an atom thick, they are theoretically very suitable...
Wednesday 24 December 2025
AI chips run too hot: Engineers race to reinvent cooling
The rapid growth of generative AI and large-scale models has significantly increased power consumption in computing chips, pushing thermal management into critical focus. High-end...
Monday 22 December 2025
Column: 2D materials struggle to deliver on semiconductor scaling promise
The isolation of graphene in 2004 sparked widespread expectations that two-dimensional (2D) materials could fundamentally reshape electronic devices. Graphene and transition metal...
Wednesday 17 December 2025
Energy efficiency: The new battleground for AI servers
AI is inevitably driving innovation in global server architecture. AI servers differ significantly from traditional servers in design philosophy and operational mode. This reflects...
Tuesday 2 December 2025
Column: Quantum software growth accelerates
The UN has designated 2025 as the International Year of Quantum Science and Technology, recognizing significant breakthroughs in quantum hardware, quantum error correction, and practical...
Thursday 13 November 2025
Column: Quantum communication races toward commercialization despite unresolved challenges
Quantum communication, which uses phenomena such as entanglement to enable highly secure data transmission via photons, is set for significant expansion. Market forecasts estimate...
Saturday 8 November 2025
Column: Quantum sensing moves closer to commercial reality

Quantum sensing, one of the three pillars of quantum technology alongside quantum computing and quantum communication, is rapidly advancing...

Saturday 1 November 2025
China’s rare earth squeeze reaches a turning point in the global tech standoff
Rare earth elements (REEs), comprising 17 chemical elements including the 15 lanthanides from lanthanum (La, atomic number 57) to lutetium (Lu, 71), plus scandium and yttrium, are...
Friday 31 October 2025
Column: How Taiwan recyclers gain from China's rare earth curbs?
China's expanded rare earth export controls, now including semiconductors, heighten global strategic risks while offering Taiwan's firms a chance to boost sustainable material recovery...