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    Resonac develops 12-inch SiC substrate to target AI and EV demand
    9h 18min ago
    High-end GPUs may be slowing China’s AI compute expansion
    9h 18min ago
    2026 smartphone SoC battle centers on NPU as vendors boost cores and memory for agentic AI
    9h 18min ago
    LGES and Samsung SDI ESS orders reportedly fill two years of North America capacity
    9h 18min ago
    Analysis: China's 15th five-year plan spotlights diamond materials for AI cooling
    9h 18min ago
    NEWS TAGGED DRAM
    Thursday 17 September 2026
    SK Hynix looks beyond HBM as inference workloads diversify
    SK Hynix is expanding its memory strategy beyond the conventional GPU-HBM pairing as inference workloads split between latency-sensitive services and capacity-heavy, long-context a...
    Thursday 17 September 2026
    Samsung bets on zHBM as 2.5D memory nears its limits
    Samsung Electronics is betting on vertically stacked zHBM to move memory beyond the physical constraints of conventional 2.5D architectures, setting a system-level target of raising...
    Thursday 17 September 2026
    CXMT cashes in on the DRAM shortage — and takes aim at HBM
    ChangXin Memory Technologies (CXMT) is emerging from the memory shortage with sharply higher profits and greater pricing power, giving China's largest DRAM maker more resources to...
    Thursday 17 September 2026
    SK Hynix weighs US memory options as buyers lock in 2027 supply
    SK Hynix is keeping its US memory options open as customers move earlier to secure 2027 supply, with tightening availability raising pressure on memory makers to consider additional...
    Wednesday 16 September 2026
    Samsung advances jump 70% amid shift to long-term memory deals

    Samsung Electronics' total advances received rose 70.4% in the first half of 2026, while memory suppliers and their largest customers...

    Wednesday 16 September 2026
    SK Hynix, Intel in talks on US production to ease memory crunch
    SK Hynix is in talks with Intel about a potential deal that could give the South Korean company its first memory chip manufacturing operation in the US, as tight supply pushes customers...
    Wednesday 16 September 2026
    Apple reportedly accepts Samsung's 1Q27 memory hike, raising the 2027 smartphone cost floor
    Apple's acceptance of sharply higher Samsung Electronics memory prices for early 2027 is putting a number on the cost of the AI boom for smartphones. The reported agreement comes just...
    Wednesday 16 September 2026
    Micron unveils 512GB DDR5 RDIMM for next-gen servers

    Micron has demonstrated what it calls the world's first 512GB DDR5 registered dual in-line memory module (RDIMM) across multiple server...

    Wednesday 16 September 2026
    AI efficiency fuels Jevons Paradox debate over HBM demand
    As artificial intelligence (AI) models move from answering questions to autonomously completing multi-step tasks, OpenAI's new model GPT-6 Astra, or Astra, is drawing fresh market...
    Wednesday 16 September 2026
    Global top-3 memory maker status, 3Q 2026: AI servers drive record memory revenue; SSD, LPDDR upgrades ahead

    Introduction

    Wednesday 16 September 2026
    Chip revenue heads to US$2.4 trillion on price, not volume, Yole says
    The semiconductor industry is on track to nearly quadruple in revenue by 2031 while shipping barely more silicon than it does today, a divergence that makes pricing power, not capacity,...
    Wednesday 16 September 2026
    DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies

    SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with...

    Tuesday 15 September 2026
    Astera Labs targets the KV cache bottleneck as agentic AI outgrows GPU memory
    Astera Labs has added three products to its Leo memory controller line, aimed at a problem that arises as AI inference shifts from single queries to agents that run continuous loops:...
    Tuesday 15 September 2026
    China elevates HBM and HBF in five-year plan, opening a new front in AI memory
    China's Ministry of Industry and Information Technology (MIIT) and National Development and Reform Commission (NDRC) have jointly released the 15th Five-Year Plan for the Development...
    Tuesday 15 September 2026
    Samsung, SK Hynix diverge on cell design for sub-10nm DRAM in 2028

    Samsung Electronics and SK Hynix are preparing to move DRAM below the 10nm threshold in 2028, with the two memory makers pursuing different...

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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
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