CONNECT WITH US
NEWS TAGGED DRAM
Monday 9 June 2025
Samsung reportedly races to LPDDR6 with 1c DRAM by late 2025 to fend off Chinese rival
Samsung Electronics is accelerating its development of next-generation low-power memory technology, aiming to begin production of LPDDR6 using its advanced 1c DRAM process in the...
Monday 9 June 2025
Korean equipment firms see Chinese memory makers flooding premium orders amid US curbs
South Korean semiconductor equipment manufacturers are seeing a surge in demand from Chinese memory chipmakers, according to a report from Hankyung. ChangXin Memory Technologies...
Friday 6 June 2025
DRAM prices unlikely to drop in 2025; Team Group embraces edge AI opportunities
Driven by the established trend of memory manufacturers reducing production, Team Group general manager Gerry Chen stated that memory prices are not expected to decline in 2025. The...
Thursday 5 June 2025
CXMT's surprise HBM3 sprint puts Samsung, SK Hynix on alert
China's CXMT is accelerating its development of high-bandwidth memory (HBM) and DDR5 chips, mounting a direct challenge to the global DRAM dominance of Samsung Electronics and SK...
Thursday 5 June 2025
Micron takes lead in LPDDR5X race with early 1γ-based mobile memory shipment
Micron Technology has begun mass production of its 1γ-based LPDDR5X memory, outpacing rivals Samsung Electronics and SK Hynix in the race to supply faster, low-power DRAM for...
Wednesday 4 June 2025
Samsung's DRAM yield jumps following bold redesign under new chief Jun Young-Hyun
Samsung Electronics is accelerating its push to reclaim semiconductor leadership, spotlighting its latest breakthrough in sixth-generation DRAM (1c node) yields. The development is...
Wednesday 4 June 2025
DDR4 Memory prices surge as chipmakers announce phase-out
Amid intensifying US-China tensions and persistent uncertainty in global demand, major memory chipmakers are moving to phase out DDR4 DRAM, triggering a rapid spike in prices as supply...
Wednesday 4 June 2025
South Korea maintains HBM chip lead while China faces tech and trade hurdles
The global HBM market is undergoing a seismic shift, propelled by surging demand for AI and high-performance computing. South Korea's memory heavyweights—Samsung Electronics...
Wednesday 4 June 2025
Samsung executives visit Nvidia headquarters to secure HBM supply deal
Samsung Electronics memory division executives traveled to Nvidia's US headquarters in late May to advance large-scale high-bandwidth memory (HBM) supply arrangements, according to...
Tuesday 3 June 2025
SoftBank and Intel forge AI memory venture to challenge HBM dominance
Japan's SoftBank has partnered with Intel to co-develop cutting-edge DRAM tailored for AI applications, aiming to challenge the incumbent High Bandwidth Memory (HBM) technology. The...
Tuesday 3 June 2025
Samsung upgrades capacity layout, reportedly transforming old memory lines into packaging mainstay
Samsung Electronics is reportedly repurposing its existing facilities to bolster its advanced semiconductor packaging capabilities, aiming to enhance competitiveness in the rapidly...
Tuesday 3 June 2025
South Korea's chip crown becomes a strategic burden

South Korea's leadership in DRAM, NAND, and high-bandwidth memory (HBM) is becoming a strategic liability amid rising US-China friction. With...

Monday 2 June 2025
Nanya targets 4Q25 profitability as DDR4 rivals exit
Both AI and non-AI demands in the DRAM market are showing gradual recovery signs. Nanya estimates that it will clear all inventory before the third quarter of 2025. With yield improvements...
Friday 30 May 2025
Winbond ramps up in the DRAM shake-up, but trade fears loom
Amid growing uncertainty over global tariffs, Taiwanese memory chipmaker Winbond Electronics has seen a sudden surge in urgent orders during the second quarter of 2025, so much so...
Wednesday 28 May 2025
Samsung races to deliver HBM3E memory to Nvidia but faces certification hurdles
In the high-stakes race to supply memory for the next generation of artificial intelligence, Samsung Electronics is under mounting pressure to deliver its 12-layer HBM3E chips to...