Phison Electronics CEO Pua Khein-Seng says he tells himself every day that the memory shortage will ease tomorrow. In reality, he says, AI-driven demand has opened a gap between memory...
SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023...
As HBM approaches half the cost of a GPU-HBM CoWoS package, can memory still be viewed as merely a passive component of AI computing? The answer goes back to the "memory wall," a challenge...
China's push into 3D DRAM is moving from early-stage research into wafer processes and equipment, with efforts spanning the Institute of Microelectronics of the Chinese Academy of...
Samsung Electronics is reshaping its next-generation dynamic random-access memory (DRAM) roadmap, elevating its B1b wafer-to-wafer (W2W) hybrid bonding technology from a project-specific...
High-bandwidth memory (HBM) is expected to account for nearly 30% of DRAM makers' total wafer capacity in 2027, up from about 20% currently, as Samsung Electronics moves to accelerate...
China's AI sector is shifting from catch-up to commercialization, with value concentrating in hardware bottlenecks and large platforms rather than independent model labs. Across memory,...
Acer and Phison Electronics are offering sharply different readings of the DRAM market as supply conditions improve for mainstream PC memory while AI and server demand keep the broader...
China's ChangXin Memory Technologies (CXMT) is gaining ground in the global DRAM market as Samsung Electronics and SK Hynix allocate more production capacity to high-bandwidth memory...
Samsung Electronics has reportedly revised the roadmap for its first sub-10nm DRAM generation, making a wafer-to-wafer hybrid-bonding architecture the baseline for its D0a process...
