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    NSIG chair exit brings leadership succession into focus
    11min ago
    China's generative AI user base tops 700 million, driving adoption into manufacturing and humanoid robots
    25min ago
    NEWS TAGGED DRAM
    Wednesday 30 September 2026
    Column: Memory and logic collide as AI shifts the balance
    As HBM approaches half the cost of a GPU-HBM CoWoS package, can memory still be viewed as merely a passive component of AI computing? The answer goes back to the "memory wall," a challenge...
    Wednesday 30 September 2026
    Commentary: What risks does China's DRAM capacity face amid tightening market?
    China's continued expansion of DRAM capacity has raised a key question for the global memory market: will supply and demand flip?
    Wednesday 30 September 2026
    CXMT's US$5.2 billion buildout deepens China's push for domestic DRAM equipment
    China's largest dynamic random-access memory (DRAM) maker ChangXin Memory Technologies (CXMT) is accelerating a CNY34.9 billion (US$5.2 billion) expansion aimed at chipmaking equipment,...
    Wednesday 30 September 2026
    CXMT expansion meets surging GigaDevice DRAM demand, sharpening China's memory supply-chain buildout
    CXMT's continued DRAM capacity expansion is coinciding with stronger demand from China's domestic memory sector.
    Wednesday 30 September 2026
    Inside China's 3D DRAM push: from lab to fab, and the road ahead
    China's push into 3D DRAM is moving from early-stage research into wafer processes and equipment, with efforts spanning the Institute of Microelectronics of the Chinese Academy of...
    Tuesday 29 September 2026
    CXMT to spend US$5.2 billion on R&D and testing as DRAM supply stays tight
    China's ChangXin Memory Technologies (CXMT) plans to invest CNY34.9 billion (approx. US$5.2 billion) in technology R&D and additional back-end DRAM testing capacity, stepping up...
    Tuesday 29 September 2026
    Samsung reshuffles DRAM roadmap, prioritizing B1b hybrid bonding for D0a, HBM5
    Samsung Electronics is reshaping its next-generation dynamic random-access memory (DRAM) roadmap, elevating its B1b wafer-to-wafer (W2W) hybrid bonding technology from a project-specific...
    Tuesday 29 September 2026
    SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform

    SK Hynix has validated its HBM5 memory with TSMC's CoWoS packaging, the company said in a September 28 post on its corporate newsroom...

    Tuesday 29 September 2026
    HBM to take nearly 30% of DRAM capacity as Samsung speeds up P5
    High-bandwidth memory (HBM) is expected to account for nearly 30% of DRAM makers' total wafer capacity in 2027, up from about 20% currently, as Samsung Electronics moves to accelerate...
    Monday 28 September 2026
    Weekly news roundup: China gains ground in memory and AI hardware as supply stays tight
    China's AI sector is shifting from catch-up to commercialization, with value concentrating in hardware bottlenecks and large platforms rather than independent model labs. Across memory,...
    Saturday 26 September 2026
    Acer, Phison split on DRAM outlook as PC memory supply eases
    Acer and Phison Electronics are offering sharply different readings of the DRAM market as supply conditions improve for mainstream PC memory while AI and server demand keep the broader...
    Thursday 24 September 2026
    CXMT gains ground in DRAM as Samsung, SK Hynix shift more capacity to HBM
    China's ChangXin Memory Technologies (CXMT) is gaining ground in the global DRAM market as Samsung Electronics and SK Hynix allocate more production capacity to high-bandwidth memory...
    Thursday 24 September 2026
    Samsung reportedly shifts sub-10nm DRAM roadmap toward hybrid bonding
    Samsung Electronics has reportedly revised the roadmap for its first sub-10nm DRAM generation, making a wafer-to-wafer hybrid-bonding architecture the baseline for its D0a process...
    Tuesday 22 September 2026
    Samsung weighs 4nm expansion as HBM4 demand strains capacity

    Samsung Electronics is considering expanding its 4nm foundry capacity as rising HBM4 base-die demand pushes existing capacity to full...

    Tuesday 22 September 2026
    China's memory race turns inward — CXMT, YMTC head toward patent showdown

    Global memory shortages remain severe, with AI and cloud applications intensifying demand for scarce supply. Prices for both DRAM and...

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