Micron Technology is exploring tightly coupled DRAM that could deliver more than 10 times the bandwidth of HBM while using substantially less energy per bit, as the memory maker looks...
At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...
The competition in high-bandwidth memory (HBM) is moving beyond DRAM stack height, bandwidth, and packaging to the base die at the very bottom of the package. As Nvidia pushes its...
Micron's plant at the Southern Taiwan Science Park, which it purchased from AUO for NT$7.4 billion (US$233.8 million) in August 2024, is now officially in operation, marking a key...
SEMI has raised its forecast for global wafer fab equipment (WFE) sales in 2028 to US$220 billion, up from about US$200 billion projected in July, as stronger investment in advanced...
Nine listed Chinese memory and memory-adjacent chip companies have now filed their first-half 2026 results, and together they measure the depth of the current DRAM and NAND upcycle...
China's leading DRAM maker CXMT has gone from years of accumulated losses to one of the most profitable companies on the mainland market, propelled by an extraordinary memory upcycle...
Samsung Electronics has reportedly locked up as much as 70% of its memory production capacity under long-term supply agreements (LTAs), as relentless AI infrastructure demand for high...
China's leading DRAM maker CXMT has reportedly begun small-volume production of HBM3E, a step that could ease one of the most important hardware constraints on China's domestic AI...
Samsung Electronics is reportedly developing an 8-layer version of seventh-generation high-bandwidth memory for Nvidia, matching the chipmaker's requirements for its customized NVHBM...
China's memory-chip industry is narrowing parts of the technology gap with global leaders on two fronts. YMTC is approaching SK Hynix in NAND revenue share while running a more advanced...
China's smartphone and memory supply chains are moving closer together, with Xiaomi's new Xring O3 processor potentially providing CXMT with an early commercial entry into the LPDDR6...
At Hot Chips 2026, Samsung Electronics moved processing-in-memory (PIM) closer to practical deployment, presenting what it described as the industry's first LPDDR-based PIM device...
