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Monday 29 June 2026
Samsung could become HBM market share leader in 2027
Samsung Electronics could overtake SK Hynix in the global high-bandwidth memory (HBM) market in 2027, driven by the competitive edge of HBM4, the sixth generation of HBM. Market watchers...
Monday 29 June 2026
Apple reportedly seeks CXMT approval to secure DRAM supply amid memory crunch

DRAM and NAND Flash supplies are tightening as global AI data centers continue to expand. Apple is actively lobbying the Trump administration...

Monday 29 June 2026
Exclusive: Winbond sees AI making memory a strategic resource, maps next growth in DRAM and Flash

AI is turning memory from an inventory risk into a strategic resource. As memory becomes integral to platform and system design, customers...

Monday 29 June 2026
Analysis: Micron gains pricing power as Trump-backed US manufacturing widens margins

Micron's latest earnings point to a shift in the AI hardware boom that could matter far beyond the US. The memory maker's surging revenue...

Monday 29 June 2026
Samsung slows next-gen memory push as price surge rewards existing lines

Samsung Electronics is slowing its investment schedule for 1d DRAM, the seventh-generation 10nm-class DRAM node, as a sharp surge in...

Monday 29 June 2026
Taiwan joins post-HBM memory race with Intel, SoftBank

Taiwan's semiconductor ecosystem has entered the race to develop a possible post-HBM memory architecture, with Powerchip Semiconductor...

Friday 26 June 2026
SK Hynix's US$29 billion Nasdaq plan puts capacity expansion in focus

SK Hynix is pairing a potentially record-scale Nasdaq ADR offering with an aggressive push to expand chip production for artificial intelligence,...

Friday 26 June 2026
CXMT listing signals acceleration of China's memory self-sufficiency strategy amid global tech decoupling

CXMT's IPO highlights the growing geopolitical fragmentation of the global semiconductor industry,...

Thursday 25 June 2026
Commentary: Micron turns AI memory crunch into a buyback story
Micron Technology is turning the AI memory boom into a new Wall Street story: not just record DRAM, NAND and HBM demand, but stronger free cash flow, long-term customer commitments...
Thursday 25 June 2026
Micron says AI memory shortage will outlast 2027, locks in US$100 billion customer deals
Micron Technology expects the global memory market to remain supply-constrained beyond 2027, driven by surging artificial intelligence demand and structural limits on new manufacturing...
Wednesday 24 June 2026
SK Hynix reportedly eases HBM4 push as commodity DRAM margins surge

SK Hynix is reportedly easing the pace of some HBM4 production conversions and redirecting more attention toward commodity DRAM, as a...

Wednesday 24 June 2026
Asus keeps 2026 notebook shipment target steady as commercial and service demand supports growth
Asus said it kept its 2026 notebook shipment target unchanged, citing stronger commercial demand and expanded after-sales services as the reasons it could aim for growth despite a...
Wednesday 24 June 2026
Samsung pushes memory supply deals as demand spreads beyond HBM

Samsung Electronics is putting long-term memory supply agreements higher on its second-half agenda as demand from data centers broadens...

Wednesday 24 June 2026
JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects
JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources...
Tuesday 23 June 2026
Corsair's reported CXMT DDR5 move puts China DRAM on the global supply-chain map
China's DRAM supply chain is becoming a new variable in the global memory market. CXMT, China's largest DRAM manufacturer, is accelerating its DDR5 expansion. Recent reports stated...