SK Hynix aims to finalize the technical specifications for high-bandwidth flash (HBF) in January 2027 as it develops new memory technologies to address growing bottlenecks in AI inference...
In October 2022, the US Bureau of Industry and Security (BIS) imposed a package of export restrictions on China, including controls on equipment and components for manufacturing 3D...
Global smartphone shipments fell 20% year-on-year in the third quarter of 2026, their lowest 3Q level since 2012, as persistent DRAM and NAND shortages inflated production costs, constrained...
AI chips are becoming harder to build, but that complexity is also creating new opportunities for semiconductor equipment suppliers. Applied Materials says rising transistor counts,...
Memory chipmakers have become the fastest-growing source of demand for ASML, and the two largest of them have reportedly accepted higher replacement-part prices from the Dutch company...
Global DRAM demand for humanoid robots is projected to increase more than 20-fold by 2030 as robot deployments expand and memory capacity per unit doubles, potentially opening a new...
Nvidia's next-generation Rubin AI accelerators are expected to rely predominantly on 12-layer HBM4 high-bandwidth memory, despite reports that the chipmaker has asked Samsung Electronics...
Applied Materials is increasing investments in research and development, manufacturing and its global supply chain as it targets greater market share and profitability through 2030...
The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026；GMIF2026), co-hosted by the Shenzhen Memory Industry Association and the School of Integrated...
Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising...
Elon Musk has criticized memory chip suppliers for charging what he called "extortionate" prices while praising Micron Technology's approach to future pricing, highlighting tensions...
DDR4 contract prices are rising faster than those of the newer DDR5 standard, reversing the usual pricing pattern in the memory market. The artificial intelligence (AI) boom has prompted...
China's ChangXin Memory Technologies (CXMT) plans to mass-produce next-generation 4F² DRAM by the end of 2026, potentially ahead of South Korean rivals Samsung Electronics and...
Qualcomm is pushing to cut edge AI's energy cost as phones, cars, and other devices face tighter power and cooling limits than data centers. At the opening of Applied Materials' EPIC...
While the rapid advancement of AI has driven steadily growing investment in large-scale infrastructure, one of its downstream effects is becoming increasingly visible in the memory...
