US President Donald Trump recently claimed that Taiwan's TSMC will double the size of its Arizona fab project, reviving attention on...

Intel is developing a new memory architecture aimed at challenging the dominance of high-bandwidth memory (HBM), with commercialization...

Huawei is reportedly partnering with Chinese DRAM maker Shenzhen Shengweixu Technology (SwaySure) and the Chinese government to build...

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...

High-bandwidth memory (HBM) prices could more than double in 2027 as Nvidia's Rubin platform drives demand, HBM4 raises production...

CXMT has launched a CNY29.5 billion (approx. US$4.1 billion) STAR Market IPO, giving China's top DRAM maker fresh capital to upgrade...

CXMT's STAR Market IPO suggests China's largest DRAM maker is prioritizing commodity memory over an aggressive near-term push into...

Samsung Electronics and SK Hynix may take longer than expected to adopt hybrid bonding in next-generation high-bandwidth memory, as...

Samsung Electronics has started mass production of its PM1763 enterprise SSD, a PCIe 6.0-based drive built for AI infrastructure and slated...

Samsung Electronics is using HBM4 to test whether its memory, logic, foundry, and advanced packaging businesses can finally work as...