China's semiconductor and computing hardware companies reported or forecast strong earnings growth in the first nine months of 2026, fueled by AI infrastructure investment, demand...
China's leading DRAM manufacturer CXMT has disclosed progress in its 4F² DRAM architecture and plans to introduce DDR5 registered dual in-line memory modules (RDIMMs) by the end...
China's Yangtze Memory Technologies (YMTC) is developing a next-generation 4F² DRAM design targeting data transfer speeds of 9,600 megatransfers per second (MT/s), expanding beyond...
Samsung Electronics has reportedly completed development of next-generation 4F² DRAM technology and is aligning commercialization with customer requirements, even as China's ChangXin...
SK Hynix aims to finalize the technical specifications for high-bandwidth flash (HBF) in January 2027 as it develops new memory technologies to address growing bottlenecks in AI inference...
In October 2022, the US Bureau of Industry and Security (BIS) imposed a package of export restrictions on China, including controls on equipment and components for manufacturing 3D...
Global smartphone shipments fell 20% year-on-year in the third quarter of 2026, their lowest 3Q level since 2012, as persistent DRAM and NAND shortages inflated production costs, constrained...
AI chips are becoming harder to build, but that complexity is also creating new opportunities for semiconductor equipment suppliers. Applied Materials says rising transistor counts,...
Memory chipmakers have become the fastest-growing source of demand for ASML, and the two largest of them have reportedly accepted higher replacement-part prices from the Dutch company...
Global DRAM demand for humanoid robots is projected to increase more than 20-fold by 2030 as robot deployments expand and memory capacity per unit doubles, potentially opening a new...
Nvidia's next-generation Rubin AI accelerators are expected to rely predominantly on 12-layer HBM4 high-bandwidth memory, despite reports that the chipmaker has asked Samsung Electronics...
Applied Materials is increasing investments in research and development, manufacturing and its global supply chain as it targets greater market share and profitability through 2030...
The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026；GMIF2026), co-hosted by the Shenzhen Memory Industry Association and the School of Integrated...
Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising...
Elon Musk has criticized memory chip suppliers for charging what he called "extortionate" prices while praising Micron Technology's approach to future pricing, highlighting tensions...
