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Global EV sales and battery capacity
May 20, 17:56
NEWS TAGGED DRAM
Friday 13 May 2022
The memory industy (5): Looking for a new biz model that can create new value
When the memory industry can no longer leverage Moore's Law to create new value, it has to find new technologies to establish a new business model that can create new economic valu...
Thursday 12 May 2022
The memory industry (4): Technology diversion between DRAM and 3D NAND flash
In 2014, 3D NAND flash was introduced to the industry with 24 layers, and it co-existed with 2D NAND flash until 2017. 3D NAND flash gradually came to dominate the market with its...
Thursday 12 May 2022
Winbond to enjoy revenue growth in 2Q22
Despite recent falls in memory chip prices, Winbond Electronics is poised to generate sequential revenue growth in the second quarter of 2022, according to market sources.
Wednesday 11 May 2022
The memory industry (3): Taiwan's DRAM sector
Let's take a moment to review the rise and fall of Taiwan's DRAM industry. Taiwan's DRAM industry came into being in the mid-1990s. In the beginning, although some companies wanted...
Tuesday 10 May 2022
The memory industry (2): The era of makers utilizing manufacturing processes and equipment for both DRAM and 2D NAND flash
NAND flash was invented by Toshiba in 1989 and entered commercial mass production in the early 2000s. Since NAND flash has much faster access speed than mechanical hard drives, and...
Tuesday 10 May 2022
Memory prices to rebound in 2H22, say IC distributors
Memory prices will be trending downward in the second quarter of 2022, but are likely to rebound in the second half of the year when new smartphones hit market shelves, according...
Monday 9 May 2022
The memory industry (1): The era of DRAM driving semiconductor manufacturing process improvement
Semiconductor is a high-tech industry that requires continuous investment in the development of cutting-edge technologies to create new economic value. With the advantage of entering...
Monday 9 May 2022
Memory chips increasingly important in heterogeneous integration, says Winbond
The role of memory chips has become increasingly important in heterogeneous integration, and Winbond Electronics is working with potential customers in multiple related design projects,...
Friday 6 May 2022
DRAM spot prices continue slide
DRAM spot prices have been falling since April and will continue trending downward in May and June, which will be dragging down further the memory contract prices in the second quarter,...
Wednesday 4 May 2022
Innodisk sets edge AI computing as new business focus
Taiwan-based Innodisk, dedicated to supplying industrial embedded flash and DRAM storage solutions, has announced its new business focus on edge AI computing technologies and applications,...
Tuesday 3 May 2022
Specialty memory vendor ESMT remains upbeat about 2022 sales
Taiwan's specialty memory IC design house Elite Semiconductor Memory Technology (ESMT) is still striving to rake in record revenues for 2022 despite posting lackluster business results...
Friday 29 April 2022
Samsung claims advanced foundry yields stabilizing
Samsung Electronics' foundry business achieved its highest-ever first-quarter sales, thanks to solid demand from all applications and improvements in the yields of the advanced process,...
Thursday 28 April 2022
SK Hynix sees profits more than double in 1Q22
SK Hynix has reported operating profits jumped 116% from a year earlier to KRW2.86 trillion (US$2.26 billion) in the first quarter of 2022 when revenue climbed 43% on year to KRW12.16...
Friday 22 April 2022
Notebook component shortages worsening on China lockdowns
A variety of notebook components including connectors, wirings, PCBs, plastics, metal parts and molds, all long in sufficient supply, have slipped into shortages due to production...
Thursday 21 April 2022
Winbond to scale up DDR3 output
Winbond Electronics has disclosed plans to boost its DDR3 chip output, which will climb as a proportion of the company's total DRAM revenue to 50% by 2024 from the current 30%.
Wednesday 26 May 2021
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module based on high-K metal gate (HKMG) process technology. Delivering more than twice the performance of DDR4 at up to 7,200Mbps, the new DDR5 will be capable of orchestrating the most extreme compute-hungry, high-bandwidth workloads in supercomputing, artificial intelligence (AI) and machine learning (ML), as well as data analytics applications. Samsung indicated the new DDR5 utilizes highly advanced HKMG technology that has been traditionally used in logic semiconductors. With continued scaling down of DRAM structures, the insulation layer has thinned, leading to a higher leakage current. By replacing the insulator with HKMG material, Samsung's DDR5 will be able to reduce the leakage and reach new heights in performance. This new memory will also use approximately 13% less power, making it especially suitable for datacenters where energy efficiency is becoming increasingly critical. Leveraging through-silicon via (TSV) technology, Samsung's DDR5 stacks eight layers of 16Gb DRAM chips to offer the largest capacity of 512GB. TSV was first utilized in DRAM in 2014 when Samsung introduced server modules with capacities up to 256GB.
Friday 1 June 2018
Samsung 10nm 32GB DDR4 SoDIMM
Samsung Electronics has started mass producing 32GB DDR4 memory for gaming laptops in the widely used format of small outline dual in-line memory modules (SoDIMMs). The new SoDIMMs are based on 10nm-class process technology that will allow users to enjoy enriched PC-grade computer games on the go. Using the new memory solution, PC manufacturers can build faster top-of-the-line gaming-oriented laptops with longer battery life at capacities exceeding conventional mobile workstations, while maintaining existing PC configurations, according to Samsung. Compared to Samsung's 16GB SoDIMM based on 20nm-class 8Gb DDR4, which was introduced in 2014, the new 32GB module doubles the capacity while being 11% faster and approximately 39% more energy efficient, said the vendor. With a total of 16 of Samsung's newest 16Gb DDR4 DRAM chips (eight chips each mounted on the front and back), the 32GB SoDIMM allows gaming laptops to reach speeds up to 2,666Mbps. A 64GB laptop configured with two 32GB DDR4 modules consumes less than 4.6W in active mode and less than 1.4W when idle, said Samsung. This reduces power usage by approximately 39% and over 25%, respectively, compared to today's leading gaming-oriented laptops, which are equipped with 16GB modules.
Tuesday 23 January 2018
Samsung 1ynm DDR4
Samsung Electronics has begun mass producing the second generation of 10nm-class (1y-nm), 8Gb DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8Gb DDR4 features the highest performance and energy efficiency for an 8Gb DRAM chip, as well as the smallest dimensions, Samsung said. Samsung's 2nd-generation 10nm-class 8Gb DDR4 features an approximate 30% productivity gain over the company's 1st-generation 10nm-class 8Gb DDR4. In addition, the new 8Gb DDR4's performance levels and energy efficiency have been improved about 10% and 15% respectively, thanks to the use of an advanced, proprietary circuit design technology. The new 8Gb DDR4 can operate at 3,600Mbps per pin, compared to 3,200Mbps of the company's 1x-nm 8Gb DDR4. To enable these achievements, Samsung has applied new technologies, without the use of an EUV process. The innovation here includes use of a high-sensitivity cell data sensing system and a progressive "air spacer" scheme. In the cells of Samsung's 2nd-generation 10nm-class DRAM, a newly devised data sensing system enables a more accurate determination of the data stored in each cell, which leads to a significant increase in the level of circuit integration and manufacturing productivity. Samsung has finished validating its 2nd-generation 10nm-class DDR4 modules with CPU manufacturers, and next plans to work closely with its global IT customers in the development of more efficient next-generation computing systems.
AROUND THE WEB
Micron to shut DRAM chip design operations in Shanghai
Thursday 27 January 2022
May 19, 12:09
Computex Focus: DataVan to showcase new retail solutions for new normal
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Wednesday 18 May 2022
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Datacenters to become biggest consumer of NAND flash in 2023-2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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