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    LG Electronics's three strategies to counter competition from Chinese brands
    4h 35min ago
    China's SeeYA wins Meta’s MR panel order as BOE misses certification
    4h 35min ago
    Qualcomm says HBC memory architecture offers better value than HBM as hyperscalers show interest
    4h 36min ago
    InP enters a capacity race as TCL moves into indium phosphide laser chips
    4h 36min ago
    Taiwan’s semiconductor materials sector sees opportunity in advanced packaging and CPO
    4h 36min ago
    Huawei lifted R&D spending to push AI chips and semiconductor self-reliance
    4h 36min ago
    NEWS TAGGED DRAM
    Tuesday 1 September 2026
    Micron opens Tainan plant after 6.5 months amid labor dispute
    Micron's plant at the Southern Taiwan Science Park, which it purchased from AUO for NT$7.4 billion (US$233.8 million) in August 2024, is now officially in operation, marking a key...
    Tuesday 1 September 2026
    SEMI lifts 2028 wafer fab equipment forecast to US$220 billion
    SEMI has raised its forecast for global wafer fab equipment (WFE) sales in 2028 to US$220 billion, up from about US$200 billion projected in July, as stronger investment in advanced...
    Tuesday 1 September 2026
    China's memory chipmakers post a record 1H — but not all of it came from chips
    Nine listed Chinese memory and memory-adjacent chip companies have now filed their first-half 2026 results, and together they measure the depth of the current DRAM and NAND upcycle...
    Tuesday 1 September 2026
    Analysis: CXMT's US$11.5B profit surge raises the stakes in China's AI memory race
    China's leading DRAM maker CXMT has gone from years of accumulated losses to one of the most profitable companies on the mainland market, propelled by an extraordinary memory upcycle...
    Tuesday 1 September 2026
    Samsung locks 70% of memory output as HBM spot prices soar
    Samsung Electronics has reportedly locked up as much as 70% of its memory production capacity under long-term supply agreements (LTAs), as relentless AI infrastructure demand for high...
    Tuesday 1 September 2026
    Commentary: CXMT's HBM3E leap gives China's AI chipmakers a new path to scale
    China's leading DRAM maker CXMT has reportedly begun small-volume production of HBM3E, a step that could ease one of the most important hardware constraints on China's domestic AI...
    Tuesday 1 September 2026
    Samsung is said to develop 8-layer HBM4E for Nvidia's NVHBM push
    Samsung Electronics is reportedly developing an 8-layer version of seventh-generation high-bandwidth memory for Nvidia, matching the chipmaker's requirements for its customized NVHBM...
    Monday 31 August 2026
    CXMT's global DRAM push runs into US curbs

    ChangXin Memory Technologies (CXMT) is suing the Pentagon to overturn its designation as a Chinese military company as the Chinese DRAM...

    Friday 28 August 2026
    China memory catch-up broadens: YMTC closes in on SK Hynix NAND share, CXMT advances DRAM tech
    China's memory-chip industry is narrowing parts of the technology gap with global leaders on two fronts. YMTC is approaching SK Hynix in NAND revenue share while running a more advanced...
    Thursday 27 August 2026
    CXMT lands early LPDDR6 opportunity with Xiaomi Xring O3, eyes China flagship phones
    China's smartphone and memory supply chains are moving closer together, with Xiaomi's new Xring O3 processor potentially providing CXMT with an early commercial entry into the LPDDR6...
    Thursday 27 August 2026
    Nvidia reportedly shifts HBM4 mix toward 8-high as memory supply stays tight

    Nvidia has reportedly asked Samsung Electronics and SK Hynix to increase the share of 8-high products...

    Wednesday 26 August 2026
    Hot Chips 2026: Samsung advances LPDDR5X-PIM as HBM costs mount
    At Hot Chips 2026, Samsung Electronics moved processing-in-memory (PIM) closer to practical deployment, presenting what it described as the industry's first LPDDR-based PIM device...
    Tuesday 25 August 2026
    Samsung pushes HBM toward logic, SK Hynix targets packaging at Hot Chips 2026
    Samsung Electronics and SK Hynix outlined different areas of emphasis for overcoming the next high-bandwidth memory (HBM) bottleneck at Hot Chips 2026, with Samsung pushing more logic...
    Monday 24 August 2026
    Etron chair sees memory boom extending to 2028-2030
    The memory industry is undergoing a structural shift as AI demand surges, and Etron Technology chairman Nicky Lu said the sector's boom will stretch beyond 2027, with shortages likely...
    Monday 24 August 2026
    Samsung's DRAM capacity lead shrinks as SK Hynix expands faster

    Samsung Electronics' DRAM wafer capacity will grow only marginally through 2027, with investment directed at node migration and line...

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    BIZ FOCUS
    Sep 1, 08:00
    Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing
    Monday 31 August 2026
    NewPower Worldwide expands credit facility to $750M for growth
    Monday 31 August 2026
    Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON
    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
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