As SK Hynix kicks off its second-half 2025 recruitment drive with a generous bonus package, the move has generated significant buzz among Samsung Electronics employees, especially...
As Nvidia raises the performance threshold for fourth-generation high-bandwidth memory (HBM4), reports suggest that Micron Technology may be struggling to meet these standards. Industry...
Global DRAM shipments saw their sharpest increase in nearly two years during the second quarter of 2025, solidifying SK hynix's lead over Samsung Electronics. The surge was driven...
Driven by strong AI demand, memory contract prices for NAND and DRAM rose sharply by an estimated 15-20% in the fourth quarter of 2025, breaking traditional year-end price decline...
The Ministry of Economy, Trade and Industry (METI) of Japan announced on September 12, 2025, that it will provide Micron Technology with subsidies amounting to as much as JPY536 billion...
China's DRAM maker CXMT is reportedly developing compute express link (CXL) DRAM modules, a move that could escalate rivalry with Samsung Electronics and SK Hynix as the CXL market...
Nvidia has reportedly abandoned its initial SOCAMM1 low-power DRAM module for AI workloads, shifting focus to SOCAMM2 with faster speeds and broader supplier collaboration, including...
Memory manufacturers are swiftly following SanDisk's announcement of a 10% price increase for NAND products, signaling a broader industry move toward higher pricing amid expected...
The global memory industry saw simultaneous growth in volume and pricing during the third quarter of 2025, with DRAM and NAND memory prices rising amid ongoing supply constraints...
Winbond Electronics has implemented significant price increases for its DDR4 DRAM products beginning in the third quarter of 2025, with contract prices for the fourth quarter finalized...
China's state-backed DRAM maker CXMT is rapidly advancing in high-bandwidth memory (HBM), a market long controlled by Samsung Electronics and SK Hynix. Citing SemiAnalysis, South...
Recent reports indicate that Samsung Electronics is restarting construction on parts of its P4 and P5 fabs to accelerate advanced DRAM mass production. SK Hynix is also reportedly...
Yangtze Memory Technologies (YMTC) officially registered its Phase III unit, Changcun Phase III (Wuhan) Integrated Circuit, on September 5. The company has not disclosed details on...
The rising wave of artificial intelligence (AI) is driving the growing importance of high-bandwidth memory (HBM), which has become a core component of AI system architectures. The...
