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NEWS TAGGED DRAM
Friday 26 May 2023
Global DRAM revenue continues slide in 1Q23
Revenue of the global DRAM memory market registered a sequential decline for the third consecutive quarter in the first quarter of 2023, according to TrendForce.
Thursday 25 May 2023
DRAM chipmaker Nanya lands influx of short lead-time orders for TV applications
Nanya Technology has recently received an influx of short lead-time orders for TV applications, according to the DRAM memory maker.
Wednesday 24 May 2023
Samsung, SK Hynix may eventually suffer more than benefit from Micron sanction
With China formally imposing sanctions on Micron Technology, possible consequent impacts on Samsung Electronics and SK Hynix are fast drawing market concerns, and both Korean suppliers...
Tuesday 23 May 2023
Backend firms may see Micron cut orders in the wake of Chinese ban
Taiwan-based backend houses, which handle mainly conventional DRAM memory from Micron Technology, may experience a reduction in orders from the US customer due to China's prohibition...
Friday 19 May 2023
Samsung starts mass production 12nm DDR5 DRAM
Samsung Electronics has announced mass production of 16-gigabit (Gb) DDR5 DRAM chips built using the company's 12nm-class process technology.
Thursday 18 May 2023
Micron to produce EUV DRAM memory in Japan
Micron Technology has announced that it will introduce extreme ultraviolet (EUV) technology to Japan, utilizing this advanced patterning technology to produce its next generation...
Wednesday 17 May 2023
Memory demand poised to recover, says Etron chairman
The memory market has been showing signs of improvement and is anticipated to fully recover by the end of this year, according to Nicky Lu, chairman of memory IC design house Etron...
Tuesday 16 May 2023
Samsung develops DRAM supporting CXL 2.0
Samsung Electronics has developed what the company claims is the industry's first 128-gigabyte (GB) DRAM to support Compute Express Link (CXL) 2.0. Intel and Samsung collaborated...
Monday 15 May 2023
DRAM and NAND flash prices to fall further in 2Q23
According to TrendForce, DRAM and NAND Flash prices are expected to fall further in the second quarter of 2023 due to weak server shipments and high inventory levels.
Tuesday 9 May 2023
Neo Semiconductor develops 3D NAND-like DRAM
Neo Semiconductor has announced the release of 3D X-DRAM, the world's first 3D NAND-like DRAM, which the company believes would eliminate DRAM's capacity issue and replace the entire...
Tuesday 9 May 2023
Memory market emerging from slump
The memory chip market is coming out of its slump, with server and PC applications driving the recovery, according to sources at memory module makers.
Monday 8 May 2023
Winbond swings to loss in 1Q23
Winbond Electronics, a maker of specialty DRAM and flash memory, swung to its first quarterly loss in three years.
Friday 5 May 2023
AP Memory to expand AI memory biz
AP Memory Technology, which specializes in customized IoT RAM and other DRAM memory, will extend its AI memory business by entering the HPC area, according to company president Wen...
Thursday 4 May 2023
Nanya revenue increases for 2nd consecutive month
DRAM maker Nanya Technology's revenue increased for the second consecutive month in April.
Thursday 27 April 2023
Samsung says 1b DRAM production almost ready
Samsung Electronics has disclosed that preparations for volume production of 1b DRAM (12nm) are approaching the final stages.
Wednesday 26 May 2021
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module based on high-K metal gate (HKMG) process technology. Delivering more than twice the performance of DDR4 at up to 7,200Mbps, the new DDR5 will be capable of orchestrating the most extreme compute-hungry, high-bandwidth workloads in supercomputing, artificial intelligence (AI) and machine learning (ML), as well as data analytics applications. Samsung indicated the new DDR5 utilizes highly advanced HKMG technology that has been traditionally used in logic semiconductors. With continued scaling down of DRAM structures, the insulation layer has thinned, leading to a higher leakage current. By replacing the insulator with HKMG material, Samsung's DDR5 will be able to reduce the leakage and reach new heights in performance. This new memory will also use approximately 13% less power, making it especially suitable for datacenters where energy efficiency is becoming increasingly critical. Leveraging through-silicon via (TSV) technology, Samsung's DDR5 stacks eight layers of 16Gb DRAM chips to offer the largest capacity of 512GB. TSV was first utilized in DRAM in 2014 when Samsung introduced server modules with capacities up to 256GB.
Friday 1 June 2018
Samsung 10nm 32GB DDR4 SoDIMM
Samsung Electronics has started mass producing 32GB DDR4 memory for gaming laptops in the widely used format of small outline dual in-line memory modules (SoDIMMs). The new SoDIMMs are based on 10nm-class process technology that will allow users to enjoy enriched PC-grade computer games on the go. Using the new memory solution, PC manufacturers can build faster top-of-the-line gaming-oriented laptops with longer battery life at capacities exceeding conventional mobile workstations, while maintaining existing PC configurations, according to Samsung. Compared to Samsung's 16GB SoDIMM based on 20nm-class 8Gb DDR4, which was introduced in 2014, the new 32GB module doubles the capacity while being 11% faster and approximately 39% more energy efficient, said the vendor. With a total of 16 of Samsung's newest 16Gb DDR4 DRAM chips (eight chips each mounted on the front and back), the 32GB SoDIMM allows gaming laptops to reach speeds up to 2,666Mbps. A 64GB laptop configured with two 32GB DDR4 modules consumes less than 4.6W in active mode and less than 1.4W when idle, said Samsung. This reduces power usage by approximately 39% and over 25%, respectively, compared to today's leading gaming-oriented laptops, which are equipped with 16GB modules.
Tuesday 23 January 2018
Samsung 1ynm DDR4
Samsung Electronics has begun mass producing the second generation of 10nm-class (1y-nm), 8Gb DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8Gb DDR4 features the highest performance and energy efficiency for an 8Gb DRAM chip, as well as the smallest dimensions, Samsung said. Samsung's 2nd-generation 10nm-class 8Gb DDR4 features an approximate 30% productivity gain over the company's 1st-generation 10nm-class 8Gb DDR4. In addition, the new 8Gb DDR4's performance levels and energy efficiency have been improved about 10% and 15% respectively, thanks to the use of an advanced, proprietary circuit design technology. The new 8Gb DDR4 can operate at 3,600Mbps per pin, compared to 3,200Mbps of the company's 1x-nm 8Gb DDR4. To enable these achievements, Samsung has applied new technologies, without the use of an EUV process. The innovation here includes use of a high-sensitivity cell data sensing system and a progressive "air spacer" scheme. In the cells of Samsung's 2nd-generation 10nm-class DRAM, a newly devised data sensing system enables a more accurate determination of the data stored in each cell, which leads to a significant increase in the level of circuit integration and manufacturing productivity. Samsung has finished validating its 2nd-generation 10nm-class DDR4 modules with CPU manufacturers, and next plans to work closely with its global IT customers in the development of more efficient next-generation computing systems.
AROUND THE WEB
China DRAM maker seeks IPO at US$14.5 billion value
Thursday 20 April 2023
US urges South Korea not to fill China shortfalls if Beijing bans Micron chips
The Financial Times
Monday 24 April 2023
May 15, 16:16
APD showcases innovative medical power supplies at CMEF 2023, garnering market attention
Friday 12 May 2023
Silicon Catalyst announces "Silicon Startups Contest" in partnership with Arm
Tuesday 2 May 2023
iCatch Technology unveils CR3 automotive AI imaging SoC for in-cabin sensing
Friday 28 April 2023
Avalue launching Intel Atom embedded industrial motherboards, EMX-EHLP, with Intel Celeron/Atom SoC BGA processor
Why are Huawei, SMIC taking different approaches against US curbs?
Nvidia sees AI GPU orders ramp up
TSMC wins major AI chip orders
Chinese EDA champion Empyrean can now "fully support" 7nm; sees 1Q23 sales growth
Developing advanced processes at SMIC could become an unrealized dream of co-CEO Liang Mong Song?
India's Vedanta to make 28-65nm semiconductor chips for local demand
Taiwan OSATs quietly ramp up support for Chinese customers
Who's in control of SMIC technology advances?
TSMC 7nm process capacity utilization falling rapidly
More ban on semiconductor equipment to China accelerating tech decoupling
China vendors see smartphone shipments down on year in 4Q22 and 1Q23, says DIGITIMES Research
LLMs to pave way for direct human interaction to enter into home-use robot market, says DIGITIMES Research
Despite market share loss, Japan IC substrate supplier influence on semi industry still strong, says DIGITIMES Research
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