Foxconn Interconnect Technology (FIT) chairman Sidney Lu said AI demand remains strong, with overall capacity near full utilization...
As artificial intelligence applications accelerate, surging global semiconductor demand is pushing advanced packaging, co-packaged optics...
As transistor scaling becomes more difficult and costly, advanced packaging has become one of the most important paths for extending Moore's Law. Technologies such as...
The intellectual property dispute between Corning and China-based IRICO has entered a new phase at the U.S. International Trade Commission (ITC), with the focus shifting...
Co-packaged optics (CPO) remains a key focus in the AI era. Beyond advanced packaging and testing, compound semiconductors, and other...
Corning expects AI infrastructure to become an increasingly powerful growth engine, outlining how its glass technologies will move beyond...
On July 28, Corning reported higher revenue and profit for the second quarter, supported by growth across several business segments,...
Corning's long-running intellectual property (IP) dispute with China-based IRICO has entered a new phase after the U.S. International Trade Commission (ITC) issued what...
Corning has unveiled an early-stage fiber-to-chip connector concept that could reshape optical packaging if it matures, though the...
