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NEWS TAGGED DISPLAY
Monday 25 October 2021
Display driver IC inventory swelling
High-tech supply chains are encountering the availabilities of different chips that are in varying degrees. Chips such as display driver ICs (DDI) are no longer in tight supply, prompting...
Wednesday 13 October 2021
DDI backend firms expect flat growth in 4Q21
Taiwan-based display driver IC (DDI) backend specialists expect to post flat sequential revenue growth in the fourth quarter of 2021, as tight foundry capacity constrains their fabless...
Wednesday 13 October 2021
Taiwan DDI suppliers poised to generate significant revenue increases in 2021
Despite uncertainty emerging over the demand outlook for the fourth quarter, Taiwan-based display driver IC (DDI) specialists are all poised to generate signifiant revenue increases...
Friday 8 October 2021
Egis board approves investments in three companies
The board of directors of Egis Technology, a Taiwan-based IC design house specializing in fingerprint sensors, has approved plans to make investments in three firms - PC peripheral...
Thursday 7 October 2021
Novatek scores record revenues in 3Q21
Display driver IC specialist Novatek Microelectronics saw its third-quarter revenue hit a record high of NT$38.35 billion (US$1.37 billion), up 12.41% sequentially and 74.29% on year,...
Tuesday 5 October 2021
CSOT display module plant in India to begin volume production in November
CSOT's display module plant in India is set to begin volume product in mid-November, according to reports from Chinese media.
Tuesday 5 October 2021
Memory demand for game consoles soon to pick up
Memory chip demand for game consoles will be picking up later in the second half of 2021, as Nintendo is poised to roll out its new-generation Switch equipped with a 7-inch OLED display,...
Monday 27 September 2021
Taiwan IC vendors poised to raise prices in 4Q21
Several Taiwan-based IC design houses are poised to raise their chip prices starting the fourth quarter of 2021 to reflect rising manufacturing costs, according to industry sources...
Friday 24 September 2021
DDI backend firms to enhance advanced testing capacity
Display driver IC backend specialists Chipbond Technology and ChipMOS Technologies are looking to enhance their high-end testing capability, eyeing promising growth in demand for...
Friday 17 September 2021
Mirle Automation sees order backlog swell
Mirle Automation, dedicated to supplying automated logistics systems and flat panel display (FPD) transporting equipment, has seen its backlog of orders exceed NT$10 billion (US$360.6...
Thursday 16 September 2021
Corning names new president for CDTT
Corning has appointed Andrew Ho as president of Corning Display Technologies Taiwan (CDTT), replacing Daniel Tseng, who has been named president and general manager of Corning Display...
Thursday 16 September 2021
GF, Qualcomm team up for advanced 5G RF front-end devices
GlobalFoundries (GF) has announced the foundry is continuing its partnership with Qualcomm, expanding their RF collaboration on 5G multi-Gigabit speed RF front-end products.
Thursday 16 September 2021
MSI adopts AUO miniLED display technology in creator notebook
AU Optronic's (AUO) AmLED (adaptive miniLED) display technology is featured in MSI's new creator notebook series.
Wednesday 15 September 2021
91.4 million automotive display panels shipped globally in 1H21
Global automotive display panel shipments reached 91.4 million units in first-half 2021, increasing 39.1% on year, according to Omdia.
Wednesday 15 September 2021
Apple to place orders for around 90 million units of iPhone 13 series for 2021
Apple will place orders for around 90 million units of the freshly launched iPhone 13 series with its upstream assemblers for 2021, Digitimes Research estimates.
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.