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NEWS TAGGED DISPLAY
Friday 30 July 2021
HannStar Display to set up 5.5G production line
Small- to medium-size TFT-LCD panel maker HannStar Display will set up a new production line planned to be of 5.5th generation in terms of glass substrate size, with production to...
Tuesday 27 July 2021
AMOLED panels make significant headway in notebook, tablet segments
Propelled by the relentless efforts of Korean and Chinese panels makers, the application of the AMOLED panels has made significant headway in the tablet and notebook sector since...
Monday 26 July 2021
China top-3 OSATs to see combined revenue climb over 20% in 2021, says Digitimes Research
China's top-3 OSAT providers - Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Huatian Technology - are expected to see their combined revenue surge...
Thursday 22 July 2021
HiSilicon faces difficulty gaining manufacturing support for OLED DDI
HiSilicon is gearing up in-house development of OLED display driver chips (DDI), but has encountered difficulty in gaining sufficient support from foundries and OSATs capable of providing...
Wednesday 21 July 2021
PCB maker Dynamic to commercialize new capacity later in 3Q21
Taiwan-based PCB maker Dynamic Electronics expects additional production capacity at its factory site in Huangshi, China to come online later in third-quarter 2021 and contribute...
Friday 16 July 2021
ChipMOS, Chipbond may further raise backend quotes in 2H21
Backend houses ChipMOS Technologies and Chipbond Technology are expected to raise again their backend service quotes later in the second half of 2021, as robust demand for car-use...
Thursday 8 July 2021
HannStar Display to expand LCD panel capacity
HannStar Display plans to invest NT$17 billion (US$607.4 million) to build an additional LCD panel production capacity of 30,000 substrates monthly, which will come online by 2023,...
Tuesday 6 July 2021
Pegatron and Foxconn to share new 5.4-inch iPhone orders
Pegatron will continue to share with Foxconn Technology (Hon Hai Precision) for new 5.4-inch iPhone devices slated for launch in the second half of 2021, according to sources from...
Monday 28 June 2021
Foundries accelerating 28nm process capacity expansions
Foundries including TSMC and UMC, and China's SMIC, have all stepped up their capacity expansions particularly for 28nm process, according to industry sources.
Thursday 24 June 2021
Taiwan LCD TVs – 1Q 2021
Taiwan's TV shipments went down 34.2% sequentially to reach only 6.26 million units, due to seasonal factors and shortages of driver ICs, SoCs and panels.
Tuesday 22 June 2021
Notebook ODMs to post single-digit shipment growth in 2Q21
The ongoing shortages of power management chips and display driver ICs will constrain notebook ODMs' shipment growth to just single digits sequentially in the second quarter, according...
Tuesday 22 June 2021
Corning announces moderate price increase for display glass in 3Q21
Corning has announced it will implement a moderate increase to its display glass substrate prices in the third quarter of 2021.
Wednesday 16 June 2021
IC Insights raises 2021 IC market forecast to 24% growth
IC Insights has raised its IC market growth forecast for 2021 to 24%, compared with its previous estimate of 19% growth.
Wednesday 16 June 2021
Shortage of notebook ICs in varying degrees
Shortages of notebook-use ICs are in varying degrees, according to industry sources. The supply of display driver ICs, power management chips and I/O controllers is extremely tight,...
Tuesday 15 June 2021
PSMC negotiating orders for 2023
Taiwan-based pure-play foundry Powerchip Semiconductor Manufacturing (PSMC) continue to see orders demanding 8- and 12-inch wafer fabrication services pull in, and is in talks with...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.