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    Samsung Galaxy S26 supply faces challenges amid US-Iran conflict disrupting logistics
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    Transsion faces challenges amid memory price hikes and Middle East conflict
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    Notebook shipments buoyed by early-2026 orders amid memory shortages and Apple’s MacBook Neo
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    China's chip leaders call for nationwide effort to build a domestic ASML within five years
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    UK space supply chain faces talent, parts, and funding bottlenecks
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    China's top humanoid robot makers showcased innovations at South Korea AW 2026
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    NEWS TAGGED COWOS
    Thursday 5 March 2026
    TSMC's 20-year advanced packaging strategy secures Apple and Nvidia ties
    TSMC has solidified its critical role in the global semiconductor supply chain through nearly two decades of strategic investment in advanced packaging, positioning itself at the forefront...
    Thursday 26 February 2026
    Is Nvidia's GTC mystery chip a 3D IC with memory stacked on the GPU?
    All eyes are on Jensen Huang ahead of the March 16–19 GTC conference. Nvidia's chief executive has promised to unveil a chip unlike anything the world has seen before —and...
    Wednesday 25 February 2026
    ASE accelerates panel-level packaging push with fully automated 310mm line by 2026
    AI and high-performance computing chip demand continue to expand, keeping TSMC's CoWoS capacity tight into 2026. The supply constraint is pushing Taiwan's major OSAT providers, including...
    Monday 2 February 2026
    SMIC reportedly sets up advanced packaging research institute in Shanghai
    As Intel, Samsung Electronics, and TSMC increase investment in advanced packaging, market sources say SMIC has set up an advanced packaging research organization in Shanghai, with...
    Friday 30 January 2026
    ABF substrate crunch reshapes market: Unimicron leads and rivals close in

    AI server architectures are rapidly shifting toward ultra-high-density designs, keeping advanced CoWoS packaging capacity persistently tight...

    Thursday 29 January 2026
    Exclusive: TSMC reshapes advanced packaging expansion, shifting AP8, AP7, and US fab plans
    The surge in generative AI (GenAI) and high-performance computing (HPC) demand has pushed advanced semiconductor packaging to become the most critical and constrained capacity bottleneck...
    Thursday 15 January 2026
    TSMC retains pricing power using Apple and AI dual structure
    Generative AI is reshaping TSMC's customer structure. While Apple remains TSMC's largest single customer by revenue share, the rapid growth of high-performance computing (HPC) businesses...
    Monday 12 January 2026
    TSMC expands advanced packaging, reportedly set to name first 'general plant manager'
    TSMC is rapidly expanding its advanced packaging operations and is reportedly poised to appoint its first-ever "general plant manager" to oversee all facilities. The role is expected...
    Monday 5 January 2026
    TSMC's CoWoS outsourcing to ASE and Amkor challenges Samsung
    As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT)...
    Wednesday 31 December 2025
    Taiwan OSATs boost spending as CoWoS supply tightens

    Taiwan's leading semiconductor assembly and test providers are launching record capital spending programs to expand advanced packaging...

    Monday 22 December 2025
    TSMC's CoPoS equipment set for mid-2026; overseas suppliers shake up Taiwan firms
    Benefiting from surges in AI GPU, and ASIC demand, both TSMC and non-TSMC camps have raised their 2026 CoWoS capacity plans. Notably, due to CoWoS supply shortages and Nvidia's requirements,...
    Monday 15 December 2025
    TSMC to expand CoW Orders in 2H26 as OSAT CoWoS-like tech rises
    As major US CSPs are ramping up ASIC development, the capacity gap in TSMC's CoWoS advanced packaging continues to widen. Thus, the rise of "CoWoS-like" capacity by OSAT providers...
    Wednesday 10 December 2025
    TSMC expands CoWoS capacity with Nvidia booking over half for 2026-27
    Semiconductor equipment suppliers reveal that TSMC and non-TSMC players, including ASE, Amkor, and UMC, are accelerating the expansion of advanced packaging Chip on Wafer on Substrate...
    Tuesday 9 December 2025
    Google TPU demand remains strong, but CoWoS and memory cap 2026 production
    Google's TPU demand is expected to stay high through 2027, driven by AI applications like Gemini. However, production growth in 2026 may be limited by advanced packaging (CoWoS) and...
    Monday 8 December 2025
    Exclusive: Ex-TSMC R&D VP talks advanced packaging and CoWoS
    Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending...
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    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook