Taiwan's Ministry of Economic Affairs has approved a NT$250 million (US$8.2 million) project spearheaded by Aewin Technologies, Kenmec Mechanical Engineering, and I-Chiun Precision...
Soaring demand for AI computing is ushering the semiconductor sector into a fresh cycle of high-speed growth, pushing advanced packaging requirements to new heights. From infrastructure...
Industrial PC (IPC) manufacturers have been actively expanding into new application markets in recent years, optimistic about the semiconductor industry's growing demand for full-process...
TSMC and major OSAT firms are aggressively expanding their advanced packaging capacity in response to rising demand driven by AI applications. Once considered peripheral, advanced...
Advanced packaging is rewriting the rules of the semiconductor industry. According to DIGITIMES Research, in 2024, global AI data center accelerators (covering GPUs and ASICs)...
TSMC's CoWoS capacity remains in high demand, securing its dominant position in advanced semiconductor packaging with rumored gross margins nearing 80%. However, TSMC is proceeding...
The global surge in generative AI is driving explosive growth in the AI server market, making advanced CoWoS packaging a crucial battleground for GPU makers and custom chip developers...
On August 28, Niching presented strong growth prospects at its latest investor conference, highlighting the AI-driven opportunities for cooling solutions. The company's improved product...
Advanced packaging technologies are evolving at breakneck speed, with attention now shifting beyond wafer-level processes to panel and printed circuit board (PCB) platforms. A new...
Nvidia's new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification...
Traditional glass manufacturer Taiwan Glass has invested its resources in AI fiberglass cloth, successfully transforming and penetrating the AI server supply chain led by Nvidia to...
The artificial intelligence boom is driving sharp demand growth across the printed circuit board (PCB) materials chain, pushing both prices and volumes higher. Supply pressure is...
The AI chip market is expected to stay under Nvidia's dominance in 2026, as Samsung Electronics, SK Hynix, and Micron battle to win sixth-generation high-bandwidth memory (HBM4) orders...
TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration...
