Out in Front
Tuesday 23 April 2024
Samsung's 2.5D packaging still has last mile to cross before getting Nvidia orders
Although Samsung has been the subject of market rumors regarding Nvidia's placement of its 2.5D packaging orders, industry sources recently said there is no information regarding...
Tuesday 23 April 2024
What factors lie behind system assembly changes for Nvidia's next-gen servers?
With Nvidia's recently announced Blackwell GPU architecture poised to become the mainstream for the next generation of AI servers, industry watchers expect Blackwell-equipped AI servers...
Monday 22 April 2024
Advanced packaging still in short supply; production expansion spreading overseas
TSMC's advanced packaging CoWoS capacity continues to have strong demand. Even after doubling its capacity in 2024 and collaborating with OSAT companies, it can still not fully meet...
Friday 19 April 2024
TSMC lowers 2024 semiconductor, foundry outlook
Taiwan Semiconductor Manufacturing Company (TSMC) has cut its 2024 growth predictions for the foundry and semiconductor industries while keeping the company's growth forecast at 21...
Monday 8 April 2024
Samsung's advanced packaging reportedly grabs Nvidia orders amid competition with TSMC
Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging...
Tuesday 2 April 2024
TSMC places additional equipment orders for CoWoS packaging
TSMC has placed more equipment orders to boost its CoWoS packaging manufacturing capability, according to sources at fab toolmakers.
Wednesday 27 March 2024
Taiwan wafer foundry industry, 1Q24


Thursday 21 March 2024
Nvidia CEO reiterates solid partnership with TSMC
One key takeaway from the ongoing GTC is that Nvidia's AI empire has taken shape with strong partnerships from TSMC and other Taiwanese makers, such as those major server ODMs.
Wednesday 20 March 2024
Nvidia flexes AI muscle at GTC 2024
Nvidia founder and CEO Jensen Huang heralded the arrival of the AI era in a two-hour speech on March 18 at the company's GTC event.
Tuesday 19 March 2024
TSMC chooses CoWoS factory site while continuing 3nm capacity expansion
TSMC confirmed that a CoWoS advanced packaging factory will be set up in Chiayi, a farming county and mid-sized city combined (with a 700,000 population), located north of Tainan.
Tuesday 19 March 2024
TSMC to build two advanced packaging fabs in southern Taiwan
TSMC plans to set up two new advanced packaging fabs in Chiayi, southern Taiwan, a high-ranking Taiwanese government official has announced.
Thursday 14 March 2024
Taiwanese IC distributors to capitalize on handset and PC inventory shrinkage, AI chip boom in 2024
Taiwan's major IC distributors, including WPG Holdings, WT Microelectronics, Supreme Electronics, and Edom Technology, anticipate several significant trends for 2024 in the semiconductor...
Thursday 7 March 2024
Backend houses gearing up for AI chip boom
The arrival of the Artificial Intelligence (AI) age has underscored the increasing importance of semiconductor packaging and testing, with makers stepping up efforts to expand advanced...
Tuesday 5 March 2024
UMC and PSMC cut into supply chain for AI chips
Pure-play foundries United Microelectronics (UMC) and Powerchip Semiconductor Manufacturing (PSMC) have received orders for Si interposers, allowing them to enter the supply chain...
Monday 4 March 2024
Weekly news roundup: SMIC plans 5nm chip production expansion for Huawei amid US sanctions
These are the most-read DIGITIMES Asia stories from February 26 – March 1.
Summary of Tech Supply Chain News!
Taiwan IPC makers pushing integrated services to boost profits and to see revenues grow in 2024, says DIGITIMES Research
Global smartphone shipments hit 2023 peak in 4Q23, but decelerate in 1Q24 due to seasonality, says DIGITIMES Research
Meet the analyst: Operating system in AI era will be king, says DIGITIMES Research