News tagged CoWoS at DIGITIMES

NEWS TAGGED COWOS

Friday 24 April 2026

TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker

The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate...

Thursday 23 April 2026

TSMC targets 2029 production for A13 and A12 as next AI chip nodes

At its North America Technology Symposium, TSMC showcased a range of innovations in advanced process technologies. Following the introduction of its A14 process in 2025, the company...

Thursday 23 April 2026

GUC Announces 3nm 12 Gbps HBM4 PHY and Controller

Global Unichip Corp. (GUC), the advanced ASIC leader, today announced the successful demonstration of a 12 Gbps HBM4 IP platform implemented on TSMC's 3nm process technology...

Friday 10 April 2026

CoWoS capacity emerges as AI bottleneck as TSMC’s advanced packaging grows at 80% CAGR

Global advanced packaging capacity is currently in severe shortage. Nvidia has already reserved most of TSMC's leading-edge capacity, particularly its CoWoS packaging technology. According...

Tuesday 7 April 2026

Intel challenges TSMC CoWoS as Amazon, Google reportedly explore alternatives

AI-driven demand is pushing advanced chip packaging to its limits, exposing constraints in TSMC's CoWoS capacity and forcing hyperscalers...

Wednesday 1 April 2026

TSMC eyes SiPh breakthrough as industry consensus forms

TSMC is advancing its silicon photonics (SiPh) advanced packaging platform, Compact Universal Photonic Engine (COUPE), shifting from development to commercial mass production. TSMC...

Friday 20 March 2026

Intel pushes large-area AI packaging to close foundry gap

Intel is reportedly preparing large-area AI chip packaging to strengthen its foundry business and challenge TSMC and Samsung Electronics.

Friday 13 March 2026

Apple's Mac Neo gambit: when volume alone can't hold the TSMC crown

The semiconductor landscape is undergoing a fundamental shift, moving from a mobile-first volume game to an AI-driven value competition.

Wednesday 11 March 2026

Nvidia narrows CoWoP PCB partners to three amid advanced packaging crunch

Advanced packaging capacity is tightening, and Nvidia is quietly pushing its Chip-on-Wafer-on-PCB (CoWoP) technology forward. The company is working with PCB, semiconductor packaging,...

Friday 6 March 2026

Intel’s EMIB gains traction as CoWoS alternative, reviving IC substrate investment

The global AI surge has sharply increased demand for advanced chips, leaving TSMC's CoWoS capacity in tight supply. Intel's advanced packaging strategy is set to reach a critical turning...

Thursday 5 March 2026

TSMC's 20-year advanced packaging strategy secures Apple and Nvidia ties

TSMC has solidified its critical role in the global semiconductor supply chain through nearly two decades of strategic investment in advanced packaging, positioning itself at the forefront...

Thursday 26 February 2026

Is Nvidia's GTC mystery chip a 3D IC with memory stacked on the GPU?

All eyes are on Jensen Huang ahead of the March 16–19 GTC conference. Nvidia's chief executive has promised to unveil a chip unlike anything the world has seen before —and...

Wednesday 25 February 2026

ASE accelerates panel-level packaging push with fully automated 310mm line by 2026

AI and high-performance computing chip demand continue to expand, keeping TSMC's CoWoS capacity tight into 2026. The supply constraint is pushing Taiwan's major OSAT providers, including...

Monday 2 February 2026

SMIC reportedly sets up advanced packaging research institute in Shanghai

As Intel, Samsung Electronics, and TSMC increase investment in advanced packaging, market sources say SMIC has set up an advanced packaging research organization in Shanghai, with...

Friday 30 January 2026

ABF substrate crunch reshapes market: Unimicron leads and rivals close in

AI server architectures are rapidly shifting toward ultra-high-density designs, keeping advanced CoWoS packaging capacity persistently tight...

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BIZ FOCUS

Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook