Advanced packaging has emerged as the centerpiece of semiconductor innovation, with industry attention now focused on what will replace the dominant chip-on-wafer-on-substrate (CoWoS)...
Taiwan's AI server exports have doubled, with manufacturers' GPU and graphics card production capacity fully booked, driving remarkable export growth for the country. Minister of...
The Industrial Development Administration (IDA) of Taiwan's Ministry of Economic Affairs (MOEA) is partnering with 16 local companies to present heterogeneous integration packaging...
Taiwan's Ministry of Economic Affairs has approved a NT$250 million (US$8.2 million) project spearheaded by Aewin Technologies, Kenmec Mechanical Engineering, and I-Chiun Precision...
Soaring demand for AI computing is ushering the semiconductor sector into a fresh cycle of high-speed growth, pushing advanced packaging requirements to new heights. From infrastructure...
Industrial PC (IPC) manufacturers have been actively expanding into new application markets in recent years, optimistic about the semiconductor industry's growing demand for full-process...
TSMC and major OSAT firms are aggressively expanding their advanced packaging capacity in response to rising demand driven by AI applications. Once considered peripheral, advanced...
Advanced packaging is rewriting the rules of the semiconductor industry. According to DIGITIMES Research, in 2024, global AI data center accelerators (covering GPUs and ASICs)...
TSMC's CoWoS capacity remains in high demand, securing its dominant position in advanced semiconductor packaging with rumored gross margins nearing 80%. However, TSMC is proceeding...
The global surge in generative AI is driving explosive growth in the AI server market, making advanced CoWoS packaging a crucial battleground for GPU makers and custom chip developers...
On August 28, Niching presented strong growth prospects at its latest investor conference, highlighting the AI-driven opportunities for cooling solutions. The company's improved product...
Advanced packaging technologies are evolving at breakneck speed, with attention now shifting beyond wafer-level processes to panel and printed circuit board (PCB) platforms. A new...
Nvidia's new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification...
Traditional glass manufacturer Taiwan Glass has invested its resources in AI fiberglass cloth, successfully transforming and penetrating the AI server supply chain led by Nvidia to...
