Semiconductor equipment suppliers reveal that TSMC and non-TSMC players, including ASE, Amkor, and UMC, are accelerating the expansion of advanced packaging Chip on Wafer on Substrate...
Google's TPU demand is expected to stay high through 2027, driven by AI applications like Gemini. However, production growth in 2026 may be limited by advanced packaging (CoWoS) and...
Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending...
From TSMC to SK hynix, every Q3 2025 earnings call delivered the same sobering message, the AI build-out is being throttled by three physical choke points that no amount...
Despite Nvidia's strong third quarter of fiscal 2026 performance, surpassing forecasts for 12 consecutive quarters, global market concerns over AI remain. According to supply chain...
TSMC's advanced CoWoS packaging capacity has become extremely tight, resulting in only a few leading AI chipmakers having the means to book capacity in large quantities. Other ASIC...
Kuan-Cheng Hsu, ASML's Taiwan and Southeast Asia customer marketing head, highlighted that AI-driven semiconductor demand is entering its strongest growth cycle ever, accelerating...
The market is focusing on rising demand for Nvidia AI GPUs and various ASICs, with optimism growing as TSMC plans to expand its CoWoS capacity and sees OSAT partners joining the race...
Benefiting from the artificial intelligence (AI) boom driving strong semiconductor and server exports, Taiwan's economic growth forecast for 2025 has been revised up to 5.94% by the...
AI investment has boosted semiconductor demand, with TSMC reporting a third-quarter 2025 revenue of US$33.1 billion. Strong advanced packaging demand, supported by Nvidia GPUs, benefits...
SEMICON West 2025 was held for the first time in Phoenix, Arizona, with a significant increase in the number of CEO Summits and various forums compared to previous years, with one...
ASE Technology Holding has initiated construction of a new K18B factory at the Nanzi Science Park in Kaohsiung to address growing demand in artificial intelligence (AI), automotive...
Third-generation semiconductor silicon carbide (SiC) has recently shifted industry focus from the mainstream 6-inch and 8-inch wafers to the more futuristic 12-inch SiC substrates,...
The surge in AI chips fueling CoWoS packaging demand has put silicon carbide (SiC), a third-generation semiconductor, on the verge of entering this high-value arena. The shift is...
