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NEWS TAGGED CXMT
Monday 19 October 2026
CXMT eyes nearly US$20 billion profit as AI-driven DRAM shortages fuel earnings turnaround
China's leading DRAM manufacturer, ChangXin Memory Technologies (CXMT), expects to report net profit of CNY131 billion to CNY132.5 billion (≈ US$19.58 billion to US$19.8 billion)...
Friday 16 October 2026
CXMT targets DDR5 RDIMMs by end of 2026; SiCarrier showcases China's advanced chipmaking equipment
China's leading DRAM manufacturer CXMT has disclosed progress in its 4F² DRAM architecture and plans to introduce DDR5 registered dual in-line memory modules (RDIMMs) by the end...
Friday 16 October 2026
China's YMTC targets 9,600 MT/s with 4F² DRAM design
China's Yangtze Memory Technologies (YMTC) is developing a next-generation 4F² DRAM design targeting data transfer speeds of 9,600 megatransfers per second (MT/s), expanding beyond...
Thursday 15 October 2026
Samsung reportedly completes 4F² DRAM development as China's CXMT targets year-end launch
Samsung Electronics has reportedly completed development of next-generation 4F² DRAM technology and is aligning commercialization with customer requirements, even as China's ChangXin...
Wednesday 14 October 2026
CXMT targets 4F² DRAM production two years ahead of Samsung, but can China close technology gap?
China's ChangXin Memory Technologies (CXMT) plans to mass-produce next-generation 4F² DRAM by the end of 2026, potentially ahead of South Korean rivals Samsung Electronics and...
Tuesday 13 October 2026
CXMT's server DRAM push raises margin concerns for Samsung, SK Hynix
China's ChangXin Memory Technologies (CXMT) is raising concerns over the future pricing power of Samsung Electronics, SK Hynix, and Micron as its plans for next-generation server DRAM...
Monday 12 October 2026
CXMT targets 2026 debut of 4F² DDR5 RDIMM in bid to challenge server DRAM rivals

China's ChangXin Memory Technologies (CXMT) plans to introduce DDR5 registered DIMMs (RDIMMs) based on its new 4F² DRAM architecture by the...

Thursday 8 October 2026
27 Samsung, SK Hynix veterans joined China's CXMT, study shows
An investigation by a South Korean lawmaker's office revealed that former Samsung Electronics and SK Hynix personnel who transitioned to Chinese DRAM maker ChangXin Memory Technologies...
Friday 2 October 2026
China AI infrastructure spreads to mid-sized firms
China's AI investment is increasingly turning into server purchases and data center construction, and the wave that began with large tech companies is now spreading to mid-sized firms...
Wednesday 30 September 2026
Commentary: What risks does China's DRAM capacity face amid tightening market?
China's continued expansion of DRAM capacity has raised a key question for the global memory market: will supply and demand flip?
Wednesday 30 September 2026
CXMT's US$5.2 billion buildout deepens China's push for domestic DRAM equipment
China's largest dynamic random-access memory (DRAM) maker ChangXin Memory Technologies (CXMT) is accelerating a CNY34.9 billion (US$5.2 billion) expansion aimed at chipmaking equipment,...
Wednesday 30 September 2026
CXMT expansion meets surging GigaDevice DRAM demand, sharpening China's memory supply-chain buildout
CXMT's continued DRAM capacity expansion is coinciding with stronger demand from China's domestic memory sector.
Wednesday 30 September 2026
Inside China's 3D DRAM push: from lab to fab, and the road ahead
China's push into 3D DRAM is moving from early-stage research into wafer processes and equipment, with efforts spanning the Institute of Microelectronics of the Chinese Academy of...
Tuesday 29 September 2026
CXMT to spend US$5.2 billion on R&D and testing as DRAM supply stays tight
China's ChangXin Memory Technologies (CXMT) plans to invest CNY34.9 billion (approx. US$5.2 billion) in technology R&D and additional back-end DRAM testing capacity, stepping up...
Monday 28 September 2026
Weekly news roundup: China gains ground in memory and AI hardware as supply stays tight
China's AI sector is shifting from catch-up to commercialization, with value concentrating in hardware bottlenecks and large platforms rather than independent model labs. Across memory,...