Ajinomoto raised its full-year forecast on August 6 as growing demand for AI servers and high-performance computing lifted sales of electronic materials used in...
Rising investment in AI servers, high-speed networking, and satellite communications is accelerating a shift in Southeast Asia's electronics industry. Thailand, Vietnam,...
Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging high-performance chips, with...
The global appetite for AI chips is putting new strain on materials suppliers, turning one of Ajinomoto's lesser-known products into a pressure point for advanced...
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The...
China's OSAT providers are trying to move deeper into advanced packaging as artificial intelligence (AI) demand strains global chip packaging supply, creating an opening for...
LG Innotek is seeking to enter Tesla's AI semiconductor supply chain by targeting ABF-based FC-BGA substrate orders for the automaker's AI4 chips, intensifying its...
Demand from Nvidia and Apple has intensified shortages of high-end glass fiber cloth used in IC substrates, driving broad price increases for related materials and squeezing...
As Moore's Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of IC substrate technology and the global...
