Leading US glass substrate manufacturer Corning stated that China is the only market outside of the US that has deployed all five of its major business segments. Corning's accumulated...
BOE Technology chairman Chen Yanshun revealed at the 2025 BOE Investor Day that the company will pivot toward glass substrate packaging and perovskite solar cell (PSC) technology...
Hana Technology, a South Korean equipment maker formerly focused on battery solutions, has developed core Through Glass Via (TGV) technology for semiconductor glass substrates, signaling...
Glass substrates are considered one of the key directions for advanced packaging development, especially showing significant potential in high-performance computing (HPC) and data...
According to Computerbase, under the leadership of new CEO Lip-Bu Tan, Intel might no longer push forward with in-house R&D of glass substrates but instead turn to purchasing...
BOE is advancing its semiconductor glass core substrate (GCS) business. According to South Korean media reports, BOE recently procured equipment for a GCS packaging R&D pilot...
German laser technology provider LPKF has begun actively asserting its patents related to semiconductor glass substrate technology, signaling a potentially more aggressive posture...
Samsung Electro-Mechanics (Semco) reportedly has begun building a glass substrate ecosystem to support the development of next-generation semiconductors, with Samsung Electronics...
Applied Materials has entered the semiconductor glass substrate market, reportedly developing the industry's most advanced lithography equipment dedicated to this emerging segment...
Samsung Electro-Mechanics announced that preparations for its glass substrate sample production line are nearing completion, with plans to begin supplying samples to two to three...
Samsung Display debuted at Computex 2025, highlighting its advanced OLED technology. The company presented a range of IT OLED products, such as notebooks, tablets, monitors, and other...
E Ink, the leading company in electronic paper technology, has joined forces with Realtek Semiconductor to introduce a next-generation System on Panel (SoP) design for electronic...
Nippon Electric Glass (NEG) is increasing its production of carrier glass for advanced memory and semiconductor packaging due to the growing demand for generative AI, which has boosted...
Amid intensifying competition in advanced semiconductor packaging, Samsung Electronics is reportedly taking direct control of glass substrate supply chain development, a critical...
Samsung Electro-Mechanics is teaming up with South Korean semiconductor materials company SoulBrain to develop materials for glass substrates, with plans for mass production by 2027...
