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    IC design firms brace for uncertain peak season as prices rise
    9min ago
    Interview: Qnity's Taiwan investment to focus on advanced packaging, CPO and cooling
    Jun 29, 18:44
    NEWS TAGGED GLASS SUBSTRATE
    Wednesday 24 June 2026
    Global market for advanced chip packaging set for rapid expansion
    The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...
    Wednesday 24 June 2026
    JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects
    JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources...
    Monday 22 June 2026
    TSMC glass substrate rollout unlikely before 2030

    The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving...

    Tuesday 16 June 2026
    TSMC reportedly teams with Ibiden, Innolux to push CoPoS, glass substrates

    TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in...

    Thursday 4 June 2026
    Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging
    Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...
    Tuesday 2 June 2026
    Display to semiconductor: Panel makers weaponize large glass substrates for FOPLP

    Introduction

    Saturday 30 May 2026
    Intel makes first major move into India's semiconductor ecosystem with advanced glass substrate manufacturing MoU
    India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state...
    Tuesday 26 May 2026
    Intel's Rio Rancho fab becomes test case for AI-era chip packaging
    Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions...
    Sunday 19 April 2026
    Corning leads glass substrate race as South Korea's KCC and LX Glass face steep challenges
    Glass core substrates, valued for their low dielectric loss and warpage reduction, are key to next-generation advanced semiconductor packaging. In South Korea, traditional glass makers...
    Tuesday 14 April 2026
    Glass substrates move toward mass production as Intel, Samsung Electro-Mechanics step up efforts
    Glass substrates are entering a critical pre-mass production phase as demand for high-performance AI chips accelerates. As AI workloads require larger chip sizes and higher bandwidth,...
    Tuesday 27 January 2026
    China reportedly enters semiconductor glass substrate market
    China is moving into the semiconductor glass substrate market, with both chip-related suppliers and display makers entering the field, according to Korean industry reports.
    Tuesday 20 January 2026
    Eternal Precision secures position in AI with glass substrate, panel-level packaging equipment
    Eternal Precision Mechanics (EPM), a subsidiary of Eternal Materials, made its official market debut on January 16, listing shares at an underwriting price of NT$125 (approx. US$3....
    Tuesday 13 January 2026
    Macroblock advances Micro LED glass substrate applications towards mass production
    LED driver IC designer Macroblock stated that Micro LED applications based on PCB substrates have been rolled out one after another, while Micro LED applications using glass substrates...
    Monday 12 January 2026
    AGC completes restructuring by exiting small glass substrate business for mobile phones
    Japanese glass manufacturer AGC Corporation announced the completion of a major restructuring initiative, exiting the small-glass-substrate business for mobile phones. This move signals...
    Friday 26 December 2025
    South Korean giants race to mass-produce semiconductor glass substrates in 2026
    As demand for artificial intelligence (AI) semiconductors continues to surge, the market for glass substrates, which are widely regarded as a critical material for next-generation...
    1/34 pages
    Research Report Database
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    Friday 29 May 2026
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    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook