News tagged glass substrate at DIGITIMES

NEWS TAGGED GLASS SUBSTRATE

Monday 24 August 2026

Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials

As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, advanced packaging substrates face mounting challenges: larger...

Monday 24 August 2026

iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026

Interested in solving microcrack issues in through-glass via (TGV) fabrication? Want to learn how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor...

Friday 14 August 2026

Samsung Electro-Mechanics glass substrate plan slips, with mass production now seen after 2028

Samsung Electro-Mechanics has again delayed its semiconductor glass substrate commercialization schedule after a prototype reportedly failed a customer's reliability review. The setback...

Thursday 6 August 2026

FOPLP leads production as CoPoS advances glass packaging

AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF)...

Monday 3 August 2026

Samsung Electro-Mechanics deepens AI supply-chain bet with new contracts, eyes glass substrate production in 2027

Samsung Electro-Mechanics used its second-quarter earnings call to signal that its bet on AI infrastructure is paying off and about to get bigger, pointing to a run of long-term supply...

Friday 31 July 2026

Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging

Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate...

Wednesday 29 July 2026

China's glass substrate supply chain takes shape for AI chip packaging

Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the...

Saturday 25 July 2026

Intel, China-based Lens Technology partner to explore glass substrate semiconductor packaging

Intel Corporation and Lens Technology have announced a strategic collaboration to explore the development of advanced semiconductor packaging technologies using glass substrates. The...

Friday 24 July 2026

TGV still faces technical barriers; CoPoS commercialization not likely until 2030

Introduction

Saturday 18 July 2026

JNTC-TOPPAN glass substrate push signals AI packaging supply-chain shift

As AI accelerators and high-bandwidth memory (HBM) packages grow larger and more complex, substrate technology is becoming a new constraint in advanced packaging. Organic substrates...

Friday 10 July 2026

E&R Engineering advances glass substrate pilot production to 2H27

E&R Engineering says AI demand and faster-than-expected glass substrate adoption are tightening equipment supply and advancing investment plans across Asia and the US. For global...

Friday 3 July 2026

BOE targets AI packaging with Micro LED optical interconnect and glass substrate CPO

BOE, China's leading display panel maker, is accelerating its move into next-generation packaging technologies for the AI era. The company...

Thursday 2 July 2026

BOE, Chinese panel makers' chip push tightens the squeeze on South Korea

China's display makers, led by BOE Technology (BOE), are pushing deeper into semiconductors, with BOE advancing glass substrates, and...

Wednesday 24 June 2026

Global market for advanced chip packaging set for rapid expansion

The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...

Wednesday 24 June 2026

JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects

JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources...

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Aug 27, 08:00

ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026

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