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    NEWS TAGGED GLASS SUBSTRATE
    Friday 18 September 2026
    Corning to raise display glass substrate prices 15% from 4Q26
    Corning, the US glass substrate supplier, will raise prices for its yen-denominated display glass substrate products by 15% or more worldwide starting in the fourth quarter of 2026,...
    Wednesday 16 September 2026
    Glass substrates, TGV set to reshape 2027 advanced packaging race
    As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...
    Thursday 10 September 2026
    AUO matching glass substrate size stokes TSMC collab speculation
    AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.
    Thursday 10 September 2026
    Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

    Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

    Wednesday 9 September 2026
    LG Innotek tackles glass substrate microcrack issue as 2028 production race heats up

    LG Innotek is applying internally developed artificial intelligence to semiconductor glass substrate manufacturing, targeting microcracks,...

    Wednesday 9 September 2026
    SDC, LGD target advanced glass packaging
    As glass substrates emerge as a next-generation semiconductor packaging material, they have become the centerpiece of the display industry's cross-sector transformation. Although South...
    Wednesday 2 September 2026
    Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates

    Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how to supply 1,000 Watts, 1 Volt and 1,000 Amperes...

    Tuesday 1 September 2026
    Samsung Electro-Mechanics takes glass substrates to Semicon Taiwan
    As AI packages grow larger, the next substrate battleground is rapidly extending from traditional organic materials to glass. Samsung Electro-Mechanics (SEMCO) will make its first...
    Monday 24 August 2026
    Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials
    As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, advanced packaging substrates face mounting challenges: larger...
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026

    Interested in solving microcrack issues in through-glass via (TGV) fabrication? Want to learn how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor...

    Friday 14 August 2026
    Samsung Electro-Mechanics glass substrate plan slips, with mass production now seen after 2028
    Samsung Electro-Mechanics has again delayed its semiconductor glass substrate commercialization schedule after a prototype reportedly failed a customer's reliability review. The setback...
    Thursday 6 August 2026
    FOPLP leads production as CoPoS advances glass packaging
    AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF)...
    Monday 3 August 2026
    Samsung Electro-Mechanics deepens AI supply-chain bet with new contracts, eyes glass substrate production in 2027
    Samsung Electro-Mechanics used its second-quarter earnings call to signal that its bet on AI infrastructure is paying off and about to get bigger, pointing to a run of long-term supply...
    Friday 31 July 2026
    Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging

    Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate...

    Wednesday 29 July 2026
    China's glass substrate supply chain takes shape for AI chip packaging
    Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the...
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    BIZ FOCUS
    Sep 18, 14:29
    SK hynix Launches 'SK hynix Ventures' in Silicon Valley
    Monday 14 September 2026
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
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