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    NEWS TAGGED IC SUBSTRATE
    Friday 10 April 2026
    Eclat Forever Machinery secures large IC substrate orders with visibility to 2027
    High-end ABF substrate wet process equipment maker Eclat Forever Machinery (EF) announced that, driven by clear expansion momentum from domestic IC substrate customers, capital expenditures...
    Thursday 9 April 2026
    AI chip demand tightens ABF substrate supply, three-year upcycle in sight
    As AI CPUs, GPUs, and application-specific integrated circuits (ASICs) advance to new generations, they are driving a sharp increase in both substrate size and layer counts. Simultaneously,...
    Wednesday 8 April 2026
    Taiwan's Zhen Ding projects AI-driven surge as next-gen platforms hit production

    Looking ahead, Taiwan's printed circuit board giant Zhen Ding Technology expects a strong growth trajectory beginning in the second quarter,...

    Wednesday 11 March 2026
    Nvidia narrows CoWoP PCB partners to three amid advanced packaging crunch
    Advanced packaging capacity is tightening, and Nvidia is quietly pushing its Chip-on-Wafer-on-PCB (CoWoP) technology forward. The company is working with PCB, semiconductor packaging,...
    Friday 6 March 2026
    Intel’s EMIB gains traction as CoWoS alternative, reviving IC substrate investment
    The global AI surge has sharply increased demand for advanced chips, leaving TSMC's CoWoS capacity in tight supply. Intel's advanced packaging strategy is set to reach a critical turning...
    Thursday 26 February 2026
    Fiberglass shortage persists in 2026, Unimicron increases substrate price
    As demand for high-speed transmission in AI advanced packaging surges, IC substrate major Unimicron Technology said that high-end ABF substrates required for AI applications are strongly...
    Wednesday 25 February 2026
    Unimicron names UMC's SC Chien chair in substrate strategy shift
    Unimicron held an investor conference on 25 February 2026. A day earlier, its board approved the appointment of UMC co-president SC Chien as chairman and group chief strategy officer...
    Sunday 15 February 2026
    UMC appoints new representative as Unimicron chairman Tseng retires
    Leading IC substrate maker Unimicron Technology announced that chairman Tzyy-jang Tseng is stepping down upon reaching retirement age. The company said the leadership change was triggered...
    Monday 2 February 2026
    Kinsus approves US$744M ABF expansion on clear three-year demand outlook
    Kinsus, the IC substrate arm of Pegatron, has approved additional project-based capital spending totaling NT$23.5 billion (approx. US$744 million) to support ABF substrate equipment...
    Friday 30 January 2026
    ABF substrate crunch reshapes market: Unimicron leads and rivals close in

    AI server architectures are rapidly shifting toward ultra-high-density designs, keeping advanced CoWoS packaging capacity persistently tight...

    Wednesday 21 January 2026
    AI demand boosts Unimicron and Nan Ya PCB profits in December 2025
    The IC substrate industry is accelerating its recovery into a new bull cycle, driven by steady growth in AI-related application demand. At the same time, price increases are gradually...
    Friday 2 January 2026
    IC substrates and networking PCBs grow; materials and equipment face shortages
    The PCB industry is making large upgrades. The largest beneficiaries of the AI boom are IC substrate makers that are part of the advanced chip packaging supply chain, such as Unimicron...
    Wednesday 31 December 2025
    South Korean PCB industry faces cost challenges as AI drives raw material prices up
    The South Korean printed circuit board (PCB) industry is struggling as soaring gold and copper prices, up 50% and 30% respectively since early 2025, increase production costs. Despite...
    Wednesday 24 December 2025
    Unimicron leases Dajia plant to Uniflex, spins off flexible PCB business
    Taiwan-based IC substrate maker Unimicron recently announced that it will sublease part of its Taichung Dajia land and factory to its flexible PCB (FPCB) subsidiary Uniflex Technology...
    Monday 22 December 2025
    Memory supercycle exposes T-Glass constraint, tightening BT substrate supply
    As the global memory industry enters a supercycle driven by structural supply shortages, BT substrates for memory chips are also tightening. Taiwan-based IC substrate makers Kinsus...
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook