IC substrate manufacturer Nan Ya PCB announced that company president Andy Tang will retire and step down on June 16, 2025. The company has yet to announce a successor.

While the US-China trade war has entered a tentative truce, tensions in the semiconductor sector are escalating, placing renewed scrutiny on Taiwan's IC substrate manufacturers operating...

Nan Ya Printed Circuit Board Corp. (Nanya PCB), a leading Taiwanese IC substrate manufacturer, announced on May 19 that Chairman Chia-chau Wu will step down following the company's...

PCB manufacturer Zhen Ding Technology posted a 23% year-over-year increase in consolidated revenue for the first quarter of 2025, marking a record high for the quarter. The company's...

Samsung Electro-Mechanics (Semco) is set to expand its advanced IC substrate business by officially ramping up mass production of IC substrates for artificial intelligence (AI) accelerators...

For 2025, Zhen Ding Tech chairman Charles Shen pointed out that four major product applications are expected to grow simultaneously, with the IC substrate business showing the most...

Austria-based AT&S AG, a major player in the PCB and IC substrate industry, has announced the establishment of a new Information Technology Shared Service Centre (IT SSC) in Pune,...

AI-powered applications reshaped the electronics manufacturing landscape in 2024, driving a resurgence for Taiwan’s leading IC substrate makers. Unimicron, Kinsus, and Zhen...

Japanese manufacturer Ibiden has established itself as a dominant player in the IC substrate market for AI chips, driven by Nvidia's strong demand for these substrates. Ibiden emphasized...

Image transfer, also known as photolithography (or simply, lithography), plays a crucial role in defining the circuit patterns on a panel. With photolithography, IC substrate manufacturers...

Innovative IC substrate manufacturer Phoenix Pioneer Technology is undergoing a strategic transformation into advanced packaging. The company is developing cutting-edge xQFN lead...

Fan-out panel level packaging (FOPLP) is a promising semiconductor technology that has been attracting investments from Taiwan's supply chains, including IC foundries, OSATs, panel...

Japanese IC substrate manufacturer Ibiden has lowered its overall performance forecast for the fiscal year 2024 (April 2024 to March 2025). Similarly, another IC substrate company,...

The second half of the year is typically a peak season for substrates. Despite market volatility, strong demand for AI continues to drive the global integrated circuit (IC) substrate...