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    NEWS TAGGED ABF SUBSTRATE
    Tuesday 14 July 2026
    AI demand pushes global ABF substrate market into shortage, with pressure seen through 2028

    The AI boom is tightening an important but often overlooked part of the chip supply chain, with global readers likely to feel the effects...

    Thursday 11 June 2026
    Nvidia takes PCB material competition upstream as HVLP4 copper foil gap widens
    AI infrastructure demand is lifting high-end PCB orders, but fresh bottlenecks are emerging in the upstream copper-clad laminate (CCL) supply chain. T-glass glass fiber cloth remains...
    Thursday 21 May 2026
    AI chip boom strains ABF substrate supply chain
    AI is shifting the semiconductor supply chain's next bottleneck from wafer fabrication and HBM memory to ABF substrates — a lower-profile but critical packaging material used...
    Wednesday 13 May 2026
    Ajinomoto raises ABF substrate film prices 30%
    Ajinomoto has informed IC substrate makers that it will raise prices for its key ABF build-up film by 30%, with the new pricing expected to take effect in the third quarter of 2026...
    Monday 11 May 2026
    Tesla AI5 ignites Samsung-LG race for ABF substrates, robot parts

    LG Innotek is seeking to enter Tesla's AI semiconductor supply chain by targeting ABF-based FC-BGA substrate orders for the automaker's...

    Saturday 2 May 2026
    Samsung Electro-Mechanics tops US$2 billion quarterly sales, flags ABF substrate shortage
    Samsung Electro-Mechanics (Semco) reported its first-ever quarterly revenue exceeding KRW3 trillion (approx. US$2.2 billion), driven by expanding AI infrastructure investment and rising...
    Monday 20 April 2026
    AI chip rivalry escalates: ABF substrate sells out for Unimicron, Kinsus, Nan Ya PCB
    AI GPUs, CPUs, and ASICs are driving demand for increasingly larger sizes and higher layer counts in substrate technology. The supply-demand gap for high-end ABF substrates continues...
    Wednesday 15 April 2026
    Samsung Electro-Mechanics to pour KRW1.8 trillion into Vietnam as ABF demand outstrips supply
    Samsung Electro-Mechanics (SEM) is reportedly planning to invest KRW1.8 trillion (US$1.22 billion) in Vietnam to expand ABF substrate production capacity. As AI drives a surge in demand...
    Friday 10 April 2026
    Eclat Forever Machinery secures large IC substrate orders with visibility to 2027
    High-end ABF substrate wet process equipment maker Eclat Forever Machinery (EF) announced that, driven by clear expansion momentum from domestic IC substrate customers, capital expenditures...
    Saturday 4 April 2026
    Semco raises ABF substrate prices as AI server demand surges
    The explosive growth in artificial intelligence (AI) servers and high-performance computing (HPC) is driving up the value of key components like ABF substrates. With ongoing bottlenecks...
    Thursday 26 February 2026
    Fiberglass shortage persists in 2026, Unimicron increases substrate price
    As demand for high-speed transmission in AI advanced packaging surges, IC substrate major Unimicron Technology said that high-end ABF substrates required for AI applications are strongly...
    Monday 2 February 2026
    Kinsus approves US$744M ABF expansion on clear three-year demand outlook
    Kinsus, the IC substrate arm of Pegatron, has approved additional project-based capital spending totaling NT$23.5 billion (approx. US$744 million) to support ABF substrate equipment...
    Friday 30 January 2026
    ABF substrate crunch reshapes market: Unimicron leads and rivals close in

    AI server architectures are rapidly shifting toward ultra-high-density designs, keeping advanced CoWoS packaging capacity persistently tight...

    Monday 22 December 2025
    Eternal Precision Mechanics commands 95% share of ABF vacuum press market

    Eternal Precision Mechanics, a subsidiary of Eternal Materials, has quietly become one of the most dominant players in the global semiconductor...

    Thursday 18 December 2025
    Advanced packaging drives ABF substrate expansion as Taiwanese companies exit post-pandemic capacity cuts
    As more AI GPU, CPU, and ASIC customers ramp up their market push, advanced packaging capacity continues to face tight supply. This has prompted upstream IC packaging substrate makers...
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    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
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