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    Monday 24 August 2026
    SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
    Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
    Wednesday 19 August 2026
    PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips
    As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and...
    Friday 14 August 2026
    Rapidus targets 8-reticle interposers by 2030
    Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...
    Monday 13 July 2026
    Samsung develops glass interposer as TSMC expands packaging capacity

    Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging...

    Friday 15 May 2026
    TSMC to trim Vanguard International stake to 19% in block trade
    TSMC said Thursday it plans to sell up to 152 million common shares of Vanguard International Semiconductor (VIS) to institutional investors through a block trade, reducing its stake...
    Sunday 10 May 2026
    AI demand fills Vanguard's Singapore fab ahead of schedule
    Vanguard International Semiconductor said AI-driven demand has largely offset geopolitical and macroeconomic headwinds and will be the dominant force shaping semiconductor industry...
    Wednesday 6 May 2026
    VIS joins CoWoS chain with TSMC-backed Singapore interposer foundry
    Vanguard International Semiconductor (VIS) said on May 5 that it has secured support from TSMC for a new interposer foundry line at its 12-inch Singapore fab, alongside a broader push...
    Wednesday 1 April 2026
    TSMC eyes SiPh breakthrough as industry consensus forms
    TSMC is advancing its silicon photonics (SiPh) advanced packaging platform, Compact Universal Photonic Engine (COUPE), shifting from development to commercial mass production. TSMC...
    Thursday 26 February 2026
    Is Nvidia's GTC mystery chip a 3D IC with memory stacked on the GPU?
    All eyes are on Jensen Huang ahead of the March 16–19 GTC conference. Nvidia's chief executive has promised to unveil a chip unlike anything the world has seen before —and...
    Monday 26 January 2026
    LG Display pushes into glass interposers as Korean panel makers seek growth
    LG Display is moving from research toward execution in the emerging glass interposer market, working with domestic glass-processing partners to apply its display manufacturing experience...
    Saturday 3 January 2026
    Analysis: Japan targets advanced packaging to crack TSMC's manufacturing edge
    Japanese semiconductor firms are pivoting toward advanced packaging and alternative lithography as TSMC extends its scale advantage in artificial intelligence chips. TSMC's 3nm and...
    Monday 22 December 2025
    AP Memory sets 2026 mass production timeline for S-SiCap discrete silicon capacitors

    AP Memory is expanding into AI servers and high-performance computing, with its S-SiCap roadmap delivering concrete progress. Fourth-generation...

    Wednesday 17 December 2025
    Rapidus unveils glass interposer to challenge TSMC
    Rapidus, Japan's state-backed chipmaker, has developed a prototype glass interposer for artificial intelligence chips. The company says the technology could lower production costs...
    Thursday 2 October 2025
    CoWoS creates turning point for 12-inch SiC
    Third-generation semiconductor silicon carbide (SiC) has recently shifted industry focus from the mainstream 6-inch and 8-inch wafers to the more futuristic 12-inch SiC substrates,...
    Thursday 4 September 2025
    Resonac launches JOINT3 alliance to develop next-gen semiconductor tech
    Japanese chemical and materials company Resonac announced on September 3, 2025, the formation of a new industry alliance named JOINT3, comprising 28 domestic and international semiconductor-related...
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    BIZ FOCUS
    Aug 27, 08:00
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Tuesday 25 August 2026
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
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