DIGITIMES news archive

Total: 1,255 items

Yole Group CEO interview (Part 2): Post-Moore's Law era sparks advanced packaging race

Wednesday 24 September 2025

As Moore's Law approaches physical and commercial limits, advanced packaging has surged as a new battleground in the semiconductor industry. TSMC not only leads globally with its CoWoS technology but also fosters a...

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Commentary: China’s display push challenges Taiwan’s panel makers

Tuesday 23 September 2025

Over a decade ago, China's IT industry still heavily relied on imported chips and displays, but as of today, influenced by China-US geopolitical tensions, while the chips still depend on imports, the issue of the panel...

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panel technology chip shortage brand Tianma

Analysis: After Nvidia invests in Intel, who's next?

Friday 19 September 2025

Intel has secured another high-profile backer. Following earlier commitments from SoftBank and the US government, Nvidia has announced a US$5 billion investment in Intel,...

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Intel Nvidia x86 investment partnership

Commentary: MicroLED is lighting up display industry, but can it open new doors?

Friday 12 September 2025

AUO recently announced a collaboration with leading satellite navigation and smart wearable brand Garmin to launch the world's first smartwatch featuring microLED display technology, the Garmin Fenix 8 Pro microLED. The...

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microLED display PlayNitride technology

Commentary: Decoding the new semiconductor world order

Wednesday 10 September 2025

The semiconductor landscape has fundamentally shifted. As we move from 2025 to 2026, three forces dominate global technology discourse: semiconductors, artificial intelligence, and the Trump administration's trade...

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2026 2025 semiconductor industry technology Taiwan

Commentary: YMTC's decade-long march, leadership shifts, and the undercurrent of China's memory substitution drive

Wednesday 10 September 2025

YMTC, China's leading NAND flash producer, has unveiled a US$2.9 billion Phase III venture in Wuhan, signaling its determination to scale up capacity and sharpen its edge in next-generation memory chips. The move not...

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YMTC NAND flash Beijing capacity

Commentary: Advanced AI packaging driving semiconductor industry toward 'virtual integration'

Friday 5 September 2025

Advanced packaging is rewriting the rules of the semiconductor industry. According to DIGITIMES Research, in 2024, global AI data center accelerators (covering GPUs and ASICs) have seen advanced back-end packaging...

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packaging semiconductor industry DIGITIMES 2024 technology

Analysis: BOE supplies over 40M OLED panels for iPhone, testing supply chain management

Friday 5 September 2025

For Apple CEO Tim Cook, returning to the White House in early August 2025 and announcing a US$600 billion investment plan over the next four years was a strategic move that pleased President Donald Trump. Trump...

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Apple iPhone BOE OLED panel supply chain

Commentary: YMTC's 3D DRAM push challenges CXMT and global memory leaders

Thursday 4 September 2025

China's push to localize its memory supply chain is gathering momentum. YMTC has begun trial production at its first fully localized NAND flash fab, while market chatter indicates the company is now quietly investing in...

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DRAM YMTC CXMT 3D equipment

Commentary: TSMC's Songjiang escape highlights Korean chipmakers' China trap

Thursday 4 September 2025

The US Department of Commerce's Bureau of Industry and Security (BIS) has revoked the "Validated End-User" (VEU) status for Samsung Electronics and SK Hynix, ending a key exemption that allowed the companies to ship...

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TSMC China fab chipmakers equipment Samsung SK Hynix

Tech Forum 2025: TSMC faces the next decade of chip war from Arizona to Beijing

Thursday 4 September 2025

Taiwan Semiconductor Manufacturing Co. (TSMC) has begun mass production and turned a profit at its Arizona plant in 2025, a milestone that marks not only a breakthrough in its global expansion but also a reversal of...

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TSMC Taiwan Arizona Beijing technology

Tech Forum 2025: Qualcomm and MediaTek take smartphone rivalry to the cloud in AI chips

Thursday 4 September 2025

With global smartphone sales leveling off, Qualcomm and MediaTek are taking their long-running rivalry into the fast-growing cloud AI ASIC market. DIGITIMES Research estimates MediaTek controlled 37% of the smartphone...

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Qualcomm MediaTek cloud AI global smartphone chips

Tech Forum 2025: ASICs, packaging, and HBM reshape the AI chip race

Thursday 4 September 2025

The global market for high-end cloud AI accelerators is approaching a major turning point. DIGITIMES forecasts that beginning in 2026, the supply chain will enter a new "decentralized" phase shaped by three forces:...

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packaging HBM high-end market cloud AI

Commentary: Is Jensen Huang acting as Washington's AI envoy in Seoul's political theater?

Wednesday 3 September 2025

South Korea's Chosun Daily reported on September 1, 2025, that Nvidia CEO Jensen Huang is set to attend the Asia-Pacific Economic Cooperation (APEC) summit in Gyeongju in October 2025.

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Jensen Huang Nvidia APEC Samsung CEO

Research Insights: Win-win alliance between Tesla and Samsung strengthens chip and foundry ambitions

Monday 25 August 2025

...Tesla and Samsung have struck a US$16.5 billion chip deal seen as a win-win, with Samsung's Texas fab set to produce Tesla's next-gen AI6 chips. Tesla gains customized supply chain support, while Samsung strengthens its foundry credibility...

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Samsung Tesla Automotive IC supply chain Texas

Analysis: TSMC avoids US equity stake, balancing independence and monopoly risks

Monday 25 August 2025

The US government's acquisition of a 9.9% stake in Intel, alongside TSMC's exclusion from such equity participation, highlights contrasting subsidy approaches under shifting US administrations. For TSMC, the exclusion...

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government TSMC Intel acquisition investment

Commentary: Pixel 10 marks Google's decade of hardware struggles

Friday 22 August 2025

The launch of the Pixel 10 series marks the tenth anniversary of Google's Pixel brand. Over the past decade, the company's smartphone venture has highlighted persistent shortcomings in hardware sales and market...

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Google launch Google Pixel smartphone hardware

Commentary: The govt check TSMC should turn down

Thursday 21 August 2025

US Secretary of Commerce Howard Lutnick recently stated in interviews that the government should not only offer free subsidies but also acquire non-voting stakes to safeguard American taxpayers' interests. A...

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subsidies TSMC government Intel development

Commentary: From Biden's spending spree to Trump's Intel stake, US industrial policy is infused with personal will

Wednesday 20 August 2025

As the US government seriously considers taking a stake in Intel, the company faces more than just a simple transaction; it has become a strategic industry bet. Once the semiconductor leader, Intel's lagging advanced...

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Intel USA government investment policy Donald Trump

Commentary: CXMT targets HBM3 by 2026 as Trump redefines chip trade calculus

Wednesday 20 August 2025

Like advanced AI processors, high-bandwidth memory (HBM) has been a target of US export curbs under former President Joe Biden. HBM capacity and bandwidth shape the speed...

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CXMT HBM3 HBM US-China trade war 2026

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AND && A B	Intel AND AMD Intel && AMD Intel AMD	"Intel" and "AMD"
OR \|\|	Intel OR AMD Intel \|\| AMD	"Intel" or "AMD"
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