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    PentaPro Materials: the new entrant in TSMC's supply chain with NT$3 billion second plant expansion
    3h 45min ago
    Why TSMC is giving old fabs billion-dollar makeovers
    3h 45min ago
    BMW China leads 2026 EV price war with significant discounts
    3h 45min ago
    DRAM prices surge spark speculative stockpiling as demand continue to rise
    3h 45min ago
    China's energy storage price war threatens AI infrastructure safety
    3h 45min ago
    Samsung dethroned: TCL seize CES spotlight
    3h 45min ago
    NEWS TAGGED HBM3E
    Tuesday 6 January 2026
    Samsung, SK Hynix reportedly reject long-term DRAM contracts and raise prices by up to 70%

    Reports in Korean business media say Samsung Electronics and SK Hynix are raising quoted prices for server DRAM by 60% to 70% for the...

    Tuesday 6 January 2026
    SK Hynix says HBM3E to dominate memory in 2026 as HBM4 ramps up

    SK hynix announced on Jan. 5 that it expects its fifth-generation high-bandwidth memory, HBM3E, to remain the dominant product in the...

    Friday 2 January 2026
    Samsung raises 2025 bonuses for DS division amid memory boom
    Samsung Electronics' Device Solutions (DS) division is set for a strong 2025, driven by robust performance in general-purpose DRAM and high-bandwidth memory (HBM).
    Wednesday 24 December 2025
    Samsung, SK Hynix reportedly hike HBM3E prices nearly 20% ahead of 2026 shift
    South Korean memory giants Samsung Electronics and SK Hynix have reportedly hiked prices for fifth-generation high-bandwidth memory by nearly 20% for 2026 deliveries, as soaring demand...
    Wednesday 24 December 2025
    Exclusive: Samsung slows DDR4 phase-out, reportedly requires NCNR contracts for server customers
    Memory giant Samsung Electronics is slowing its planned DDR4 DRAM production phase-out in the fourth quarter of 2025 amid surging market prices and tightening supply. Sources say...
    Tuesday 16 December 2025
    Samsung steadies 12-Layer HBM3E, eyes larger Google TPU orders
    Samsung Electronics has reportedly stabilized the performance of its 12-layer high-bandwidth memory, a development that could allow the company to expand shipments to Google's artificial...
    Thursday 11 December 2025
    SK Hynix reaps largest benefits from H200 export approval
    US President Donald Trump has allowed Nvidia's H200 chips to be exported to China, benefiting Samsung Electronics and SK Hynix. iNews24 and IT Chosun reported that...
    Wednesday 10 December 2025
    Nvidia H200 clearance paves the way for HBM3E in China
    The Trump administration has authorized exports of Nvidia's H200 artificial intelligence processors to China, a decision that analysts view as a partial concession allowing restricted...
    Monday 8 December 2025
    SK Hynix reportedly delays HBM4 mass production amid Nvidia Rubin AI accelerator launch plans
    SK Hynix has reportedly postponed the mass production timeline for its sixth-generation high bandwidth memory (HBM4) from the end of the second quarter of 2026 to the third quarter...
    Monday 8 December 2025
    Samsung shifts focus from HBM to DDR5 modules for higher profits
    Samsung Electronics has shifted its internal strategy in response to intensified HBM market competition, reallocating capacity toward DDR5 RDIMM modules and freeing up around 80,000...
    Friday 5 December 2025
    Broadcom CEO visits South Korea as Samsung HBM4 reportedly obtains Google TPU certification
    Update: Samsung has since reached out to DIGITIMES and denied this report. The company also declined to provide more details.
    Tuesday 2 December 2025
    Samsung, SK Hynix set profit-first DRAM regime
    Samsung Electronics and SK Hynix, which control about 70% of the global DRAM market, signalled in recent IR meetings with global investment banks that they will not pursue aggressive...
    Tuesday 2 December 2025
    Samsung restructures research and memory teams to reclaim HBM market share
    Samsung Electronics is undertaking one of its most significant internal restructurings in years as the company pushes to strengthen its artificial intelligence (AI) capabilities and...
    Monday 1 December 2025
    Samsung's HBM3E performance leap propels it to become primary supplier of Google's Ironwood TPU
    Media reports show that Google's Ironwood TPU is equipped with HBM3E from Samsung Electronics and SK Hynix. According to the Korea Economic Daily, Samsung supplied over 60%...
    Monday 1 December 2025
    TSMC reportedly set to take over base-die production in HBM4E generation

    Micron said in its latest quarterly results that it will work with TSMC to produce base logic dies for both standard and custom HBM4E...

    1/14 pages
    NTN special report
    BIZ FOCUS
    Jan 6, 16:39
    MSI Unveils Full Lineup of AI Products at CES 2026
    Tuesday 6 January 2026
    SK hynix Showcases Next Generation AI Memory Innovation at CES 2026
    Tuesday 6 January 2026
    Mobilint Brings Award-Winning Edge AI Hardware to the Global Stage at CES 2026
    Tuesday 6 January 2026
    Skyted's Sound Bubble at CES 2026
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