Micron is doubling down on HBM as a core growth driver, reporting strong momentum in its HBM3E ramp and laying out a clear roadmap for its next-generation HBM4 products.

SK Hynix has reportedly secured customized high-bandwidth memory (HBM) orders from Nvidia, Microsoft, and Broadcom, pulling ahead of domestic rival Samsung Electronics in the race...

Samsung Electronics wrapped up its global strategy meeting with the Device Solutions division, outlining plans to regain ground in high-bandwidth memory and foundry operations. The...

South Korea's top chipmakers, SK Hynix and Samsung Electronics, are heading into 2025 with dramatically diverging fortunes, as the global race for AI-driven memory dominance accelerates...

China continues to lag behind memory giants SK Hynix, Micron, and Samsung Electronics in developing high bandwidth memory (HBM) technology. Although US export controls on semiconductor...

AMD on June 12 officially confirmed that its next-generation AI accelerators—the Instinct MI350X and MI355X—will feature 12-high HBM3E memory supplied by Samsung and Micron...

Samsung Electronics has reportedly failed its third attempt at obtaining Nvidia's certification for 12-layer HBM3E chips in June 2025, according to a recent report by a Hong Kong...

SK Hynix is approaching the final delivery deadline for its May orders of thermal compression bonding (TCB) equipment from Hanmi Semiconductor and Hanwha Semitech, as the industry...

According to a press release on June 10, Micron Technology announced it has begun shipping samples of its 36GB HBM4 with 12-high stacking to multiple customers. The new memory is...

European financial securities firm UBS recently released a report indicating that Samsung Electronics' anticipated 12-layer HBM3E, originally expected by June 2025, may not be ready...

China's CXMT is accelerating its development of high-bandwidth memory (HBM) and DDR5 chips, mounting a direct challenge to the global DRAM dominance of Samsung Electronics and SK...

Samsung Electronics, once known for showcasing its "super gap" or "ultra gap" in chipmaking prowess, has taken an uncharacteristically quiet approach to its 2025 foundry events. The...

Samsung Electronics memory division executives traveled to Nvidia's US headquarters in late May to advance large-scale high-bandwidth memory (HBM) supply arrangements, according to...

These are the most-read DIGITIMES Asia stories from May 26 to June 1. Top highlights include Huawei's 5nm HarmonyOS PC as a milestone in China's chip self-sufficiency, Wolfspeed's...

In the high-stakes race to supply memory for the next generation of artificial intelligence, Samsung Electronics is under mounting pressure to deliver its 12-layer HBM3E chips to...