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    Alibaba’s Zhenwu V900 and Huawei’s Ascend 960 move ahead, narrowing Nvidia’s compute gap
    Sep 23, 17:49
    Qualcomm expands flagship SoC lineup to give OEMs more flexibility
    Sep 23, 17:49
    United Renewable Power plans US plant, expands overseas sales and space solar business
    Sep 23, 17:49
    Trump policies heighten US auto industry fears over Chinese EV makers
    Sep 23, 17:49
    Interview: IMAPS chairman says TSMC’s CoWoS was a key lesson in advanced packaging
    Sep 23, 17:49
    NEWS TAGGED HBM3E
    Friday 4 September 2026
    Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
    Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4...
    Tuesday 1 September 2026
    Samsung locks 70% of memory output as HBM spot prices soar
    Samsung Electronics has reportedly locked up as much as 70% of its memory production capacity under long-term supply agreements (LTAs), as relentless AI infrastructure demand for high...
    Tuesday 1 September 2026
    Commentary: CXMT's HBM3E leap gives China's AI chipmakers a new path to scale
    China's leading DRAM maker CXMT has reportedly begun small-volume production of HBM3E, a step that could ease one of the most important hardware constraints on China's domestic AI...
    Wednesday 26 August 2026
    SK hynix adds second major customer as Nvidia misses Samsung's top five
    SK hynix added a second customer accounting for more than 10% of revenue in the first half of 2026, while Nvidia remained outside Samsung Electronics' five largest customers, highlighting...
    Tuesday 25 August 2026
    Nvidia memory demand widens the gap between SK Hynix and Samsung

    Nvidia's AI memory orders helped drive a sharp split between SK Hynix and Samsung Electronics in the first half of 2026. According to...

    Thursday 6 August 2026
    DRAM price surge lifts Samsung and Micron as SK Hynix loses share
    Samsung Electronics and Micron Technology are benefiting more strongly from rising conventional DRAM and NAND prices than SK Hynix, whose focus on high-bandwidth memory (HBM) has slowed...
    Monday 6 July 2026
    Samsung, SK Hynix and Micron face HBM4 race as custom chip demand grows

    The global high-bandwidth memory market is expected to pivot from HBM3E to HBM4 in the second half of 2026, setting up a sharper contest...

    Monday 18 May 2026
    Samsung reportedly boosts 1b DRAM yields as Korean memory rivalry heats up
    Samsung Electronics has significantly improved yields for its latest DRAM technologies used in high-bandwidth memory (HBM), according to IT Chosun, underscoring the intensifying...
    Thursday 23 April 2026
    GUC Announces 3nm 12 Gbps HBM4 PHY and Controller

    Global Unichip Corp. (GUC), the advanced ASIC leader, today announced the successful demonstration of a 12 Gbps HBM4 IP platform implemented on TSMC's 3nm process technology...

    Wednesday 15 April 2026
    SK Hynix may cut Nvidia HBM4 shipments as Rubin ramp reportedly faces delays

    SK Hynix is reportedly considering reducing its planned 2026 shipments of high-bandwidth memory (HBM4) to Nvidia by about 20-30%, amid...

    Friday 10 April 2026
    CXMT targets 12-layer HBM production by 2027, closing gap with Korea
    China's largest memory maker CXMT is targeting mass production of 12-layer high-bandwidth memory (HBM) by 2027, positioning itself to challenge mainstream specifications long dominated...
    Wednesday 4 February 2026
    Samsung, SK Hynix move into HBM4 as yields and policy risks loom
    Samsung Electronics and SK Hynix have both secured production-ready technology for 16-layer stacks of sixth-generation high-bandwidth memory, known as HBM4, positioning the two South...
    Wednesday 28 January 2026
    Analysis: SK Hynix's exclusive supply to Microsoft reflects HBM3E market consolidation
    Recent reports indicate that SK Hynix has become the exclusive HBM supplier for Microsoft's next-generation AI accelerator, Maia 200, underscoring its competitiveness in the HBM3E...
    Monday 26 January 2026
    Samsung expected to start HBM4 shipments to Nvidia, AMD in February
    Samsung Electronics is expected to begin shipping its sixth-generation high-bandwidth memory chips, known as HBM4, to Nvidia as early as February, Reuters reported, while...
    Monday 19 January 2026
    Micron sets 1γ as mainstream node for 2026 as HBM and SOCAMM2 ramp
    With shipments of application-specific integrated circuits (ASICs) and XPUs expected to rise sharply in 2026, AI accelerators are set to continue relying on fifth-generation high-bandwidth...
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    BIZ FOCUS
    Sep 23, 08:00
    The Robot in the Supply Chain
    Tuesday 22 September 2026
    Macronix Secure Memories Build Hardware Defenses for EU CRA
    Tuesday 22 September 2026
    GUC Announces 2nm 16 Gbps HBM4E IP
    Tuesday 22 September 2026
    AI Drones Advance Industrial Inspection, Suntek Unlocks New Market Opportunities
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