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Friday 25 April 2025
Exclusive: Google considers HBM3E supplier change
Samsung Electronics has recently intensified its deployment in advanced high bandwidth memory (HBM) processes. However, supply chain sources reveal that Samsung's HBM3E certification...
Thursday 24 April 2025
SK hynix announces 1Q25 financial results
SK hynix (or "the company") announced today that it recorded KRW17.6391 trillion in revenues, KRW7.4405 trillion in operating profit (with an operating margin of 42%), and KRW8.1082...
Monday 21 April 2025
Samsung makes headway in HBM4 chip yields, signaling a potential comeback in the high-end memory race

As rivals race ahead in HBM3E, Samsung quietly builds momentum in next-gen HBM4 development, banking on its in-house chipmaking and packaging...

Friday 18 April 2025
Micron challenges South Korean dominance in HBM market amid tariff protectionism
Recently, reports from South Korea claim that Micron is set to become a rising star in the HBM market, following Samsung Electronics and SK Hynix. Although Donald Trump's current...
Tuesday 15 April 2025
Micron reportedly secures Nvidia certification for fifth-gen 12-layer HBM3E supply
Micron Technology is advancing in the high bandwidth memory (HBM) market, historically led by South Korean giants SK Hynix and Samsung. Reports indicate that Micron has secured Nvidia's...
Friday 11 April 2025
HBM helps SK Hynix claim crown as Samsung loses DRAM leadership
Surpassing Samsung in DRAM market share for the first time in its 40-year history can be attributed mainly to SK Hynix's dominance in the high bandwidth memory (HBM) market. Samsung's...
Tuesday 8 April 2025
Samsung logs profit beat with boost from Galaxy smartphones
Samsung Electronics Co.'s quarterly profit beat expectations after strong demand for its Galaxy S25 smartphones and legacy DRAM outpaced slipping margins in the high-stakes AI memory...
Wednesday 2 April 2025
Hanmi Semiconductor hikes key HBM equipment price, likely impacts SK Hynix
Hanmi Semiconductor has increased the price of its thermal compression bonder (TC Bonder; TCB), a critical piece of equipment for high-bandwidth memory (HBM) production, by 25% starting...
Tuesday 1 April 2025
Samsung looks to salvage chip fortunes as chairman Lee Jae-yong courts China's AI and EV powerhouses
Samsung Electronics Chairman Lee Jae-yong recently made a high-profile visit to China, meeting with leading Chinese automaker executives and President Xi Jinping. South Korean analysts...
Friday 28 March 2025
SK Hynix to finalize 2026 HBM production target by mid-2025 amid rising AI demand
SK Hynix announced during its 77th shareholders' meeting that it will determine product volume for its high bandwidth memory (HBM) lineup in the first half of 2025. CEO Noh-Jung Kwak...
Friday 28 March 2025
Samsung and SK Hynix profits set to soar with memory chip market recovery
As the memory chip market re-enters a favorable cycle, industry forecasts predict that Samsung Electronics and SK Hynix's operating profits in 2025 could surge by 40% compared to...
Wednesday 26 March 2025
Micron breaks the 'memory wall' with Nvidia: SOCAMM, HBM3E now shipping
Micron Technology showcased its latest AI-optimized memory technologies at GTC 2025, unveiling advanced DRAM solutions designed for data center and high-performance computing (HPC)...
Monday 24 March 2025
SK Hynix to pull M15X fab timeline forward by two months
SK Hynix is reportedly accelerating equipment installation at its M15X fab in Cheongju, South Korea, moving the original timeline forward from December to October in response to surging...
Thursday 20 March 2025
Samsung's HBM3E reportedly receives high marks during Nvidia audit
Samsung Electronics' fifth-generation HBM3E received satisfactory scores during Nvidia's recent audit and is expected to pass Nvidia's quality certification as early as June, according...
Thursday 20 March 2025
Samsung vows to reclaim ground in AI memory market with rollout
Samsung Electronics Co. pledged to strengthen its position in the high-bandwidth memory (HBM) chip market this year, in response to shareholder criticism over its underperformance...