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NEWS TAGGED HBM3E
Wednesday 24 April 2024
HBM prices likely to fall in 2H24 due to intensified market competition
Nvidia is arguably the biggest "beneficiary" of Artificial Intelligence (AI) so far, but the recent 10% plunge in Nvidia's stock price and the evaporation of its market capitalization...
Wednesday 24 April 2024
Micron to step up AI memory fabs construction in US after securing gov't grants
American memory chip giant Micron Technology, which has not built a new fab in the US for 20 years, is expected to step up its construction of new manufacturing facilities in New...
Wednesday 3 April 2024
Micron evaluates memory supplies from Taiwan after the earthquake
The 7.4 magnitude earthquake in Taiwan on April 3 is getting attention worldwide for DRAM supplies from Taiwan.
Tuesday 2 April 2024
Chip vendors gearing up for transition to 12-layer HBM memory
Primary memory manufacturers are expected to encounter increased competition in the High Bandwidth Memory (HBM) industry in the second half of 2024, as manufacturing technology specs...
Friday 29 March 2024
CXL and HBM become key sections of Samsung's memory solution roadmap
Samsung Electronics recently disclosed its next-generation memory solution technology roadmap on Memory Con 2024.
Thursday 28 March 2024
Samsung raises HBM shipping volume target, implying successful validation at Nvidia
Samsung Electronics announced an increase in its 2024 HBM shipping volume and disclosed more details about the development of its HBM4 product, showing that its specifications are...
Tuesday 26 March 2024
With HBM pie too tempting, could Micron sacrifice production capacity for other memory chips?
Micron Technology has seen its orders for High Bandwidth Memory (HBM) wait to be fulfilled throughout 2025.
Tuesday 26 March 2024
Samsung likely to solely supply 12-layer HBM3E to Nvidia as early as September
Reports suggest that Samsung Electronics may soon become the sole supplier of 12-layer HBM products for Nvidia.
Monday 25 March 2024
Exclusive: Taiwan supply chain helps Micron to achieve early HBM3E mass production
Support from Taiwan's supply chain was behind US memory IDM Micron's successful mass production of its latest-generation high bandwidth memory (HBM) product – HBM3E –...
Friday 22 March 2024
Samsung and SK Hynix see memory businesses turn the corner in 2024
The South Korean memory industry is finally starting to recover.
Thursday 21 March 2024
Nvidia's Jensen Huang takes diplomatic rain check on Samsung's wafers
Huang showcased his diplomatic flair at Nvida's AI developers' conference.
Tuesday 19 March 2024
Global top-3 memory maker status, 4Q23

Introduction

Tuesday 19 March 2024
SK Hynix begins volume production of industry's first HBM3E
SK Hynix Inc. announced today that it has begun volume production of HBM3E, the newest AI memory product with ultra-high performance, for supply to a customer in late March. The company...
Thursday 14 March 2024
Samsung is reportedly 'upgrading' its HBM development team
Samsung Electronics is reportedly pushing to establish an HBM development unit to increase Samsung's competitiveness in High-Bandwidth Memory (HBM). In other words, the recently formed...
Wednesday 13 March 2024
Samsung denies rumors about applying MR-MUF to improve HBM yield
Refuting a Reuters report citing five people stating that Samsung Electronics will apply Mass Reflow Molded Underfill (MR-MUF) technology, which is the process used by SK...