Zeiss is moving into a new AI chip battleground as advanced packaging and silicon photonics rise on the back of chiplet-based architectures,...
The global race toward 6G has entered a new phase after the 3rd Generation Partnership Project (3GPP) finalized the development timeline...
TSMC Chairman C.C. Wei formally announced on July 16 that the company will invest an additional US$100 billion in the US, funding several...
Nvidia and other artificial intelligence chipmakers are still facing shortages as TSMC's advanced-node and CoWoS packaging capacity...
LG Chem has begun supplying semiconductor strippers to Amkor Technology, a major US-based packaging and testing provider, in its first...
Samsung Electronics is negotiating with customers to raise average selling prices for commodity DRAM by as much as 20% in the third...
Samsung Electronics has unveiled new research on a three-dimensional transistor architecture that it says could help extend logic chip...
