Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged optics (CPO), chiplets, and glass...

WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV) substrates for optical communications...

China's semiconductor self-reliance campaign is moving beyond lithography machines and advanced processors into less visible materials that can be just as difficult to...