Cyient Ltd's wholly owned subsidiary, Cyient Semiconductors Singapore Pte Ltd, has entered into a definitive agreement to acquire over 65% of US-based power semiconductor company...
As more AI GPU, CPU, and ASIC customers ramp up their market push, advanced packaging capacity continues to face tight supply. This has prompted upstream IC packaging substrate makers...
OpenAI is reportedly in negotiations with Amazon Web Services (AWS) to secure funding and collaborate on AWS's in-house developed application-specific integrated circuits (ASICs)...
Broadcom reported strong AI-related order growth but noted lower gross margins for ASIC products compared to non-AI items, causing market uncertainty about 2026 revenue. Industry...
As major US CSPs are ramping up ASIC development, the capacity gap in TSMC's CoWoS advanced packaging continues to widen. Thus, the rise of "CoWoS-like" capacity by OSAT providers...
Broadcom is rapidly scaling its custom AI chip business, with CEO Hock Tan detailing a US$73 billion AI backlog, major new ASIC customers, and multi-billion-dollar XPU orders. The...
MediaTek is recalibrating its business strategy by targeting automotive electronics as a next major growth area, following a slowdown in smartphone-related revenue. The company has...
ASIC server shipment growth momentum in 2026 is expected to surpass that of Nvidia-led GPU servers, with Google's TPU servers accounting for the largest shipment volume. Inventec,...
Semiconductor equipment suppliers reveal that TSMC and non-TSMC players, including ASE, Amkor, and UMC, are accelerating the expansion of advanced packaging Chip on Wafer on Substrate...
Novatek posted NT$7.618 billion (US$244 million) in November 2025 revenue, a drop of 3.3% month on month and 7.23% year over year. Revenue for the first eleven months of 2025 came...
Google's TPU demand is expected to stay high through 2027, driven by AI applications like Gemini. However, production growth in 2026 may be limited by advanced packaging (CoWoS) and...
For years, the artificial intelligence chip market has been dominated by a singular narrative: Nvidia's GPUs reigning supreme as the engines powering the AI revolution. But as cloud...
Google's TPU has drawn massive attention to the competitive landscape between ASIC and GPU servers. During the DIGITIMES Tech Forum 2026, DIGITIMES Research senior analyst Jim Hsiao...
As AI workloads move from cloud to edge, the volume of image and sensor data across industries is rising rapidly. Edge devices that previously relied on FPGAs and off-the-shelf...
Amid rising demand for Google's TPU chips, MediaTek has emerged as a key ASIC supplier with confirmed orders for its V7e product line set to begin shipping in the second half of 2026...
