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    Intel's Rio Rancho fab becomes test case for AI-era chip packaging
    1min ago
    GlobalWafers rolls out phased GaN capacity expansion to ease supply crunch
    4min ago
    Huawei eyes AI storage breakthrough with DoB packaging, 245TB SSD roadmap
    7min ago
    ASML expands Taiwan hiring and operations to meet advanced chip demand
    11min ago
    Commentary: Stellantis' capital shift signals quiet reshaping of Europe's auto industry
    14min ago
    Analysis: Huawei's Tau Law signals a new semiconductor framework — with implications beyond China
    40min ago
    Kian-Shen reports 2025 revenue decline but eyes growth in electric bus chassis and sustainable transport
    43min ago
    Samsung to shift P4 output toward HBM, tightening DRAM supply
    May 25, 19:07
    NEWS TAGGED ASIC
    Tuesday 26 May 2026
    GUC showcases VSORA Jotunn8 AI processor at TSMC Europe Symposium

    Global Unichip Corp. (GUC), the Advanced ASIC Leader, will showcase Jotunn8, a next-generation data center AI inference processor developed by VSORA, at the TSMC Europe...

    Monday 25 May 2026
    Anthropic-Microsoft deal could broaden ASIC demand across cloud supply chains
    Anthropic has reportedly approached Microsoft about renting AI computing power running on Microsoft's in-house chips to expand support for its Claude model business. The move is a...
    Monday 25 May 2026
    iCatch Technology Showcases HSB-Aligned Imaging ASIC PAISB at COMPUTEX 2026

    iCatch Technology announced PAISB (Physical AI Sensor Bridge) - a HSB-aligned Imaging ASIC designed to enable scalable, time-aligned multi-sensor ingest for Physical...

    Monday 25 May 2026
    Embedded substrates draw AI chip interest as packaging turns strategic
    Rising interest in embedded substrates among Nvidia, AMD, and Intel signals potential shifts in AI data‑center supply chains, as the technology promises improved signal integrity...
    Wednesday 20 May 2026
    Google and Blackstone could lift ASIC demand with TPU leasing joint venture
    Recent media reports say Google is set to team up with Blackstone to form a new cloud computing leasing company, with Blackstone as the main shareholder. The new venture aims to build...
    Monday 18 May 2026
    Nvidia GB300 drives AI server boom as Vera Rubin ramp approaches third quarter
    Nvidia's GB300 is becoming the mainstream AI server product in the first quarter of 2026, boosting ODM revenue and profit worldwide; with Vera Rubin servers due to ramp in the third...
    Friday 15 May 2026
    AI servers squeeze ODM margins as consignment gains traction
    As AI server prices rise, original design manufacturers (ODMs) are hitting record revenue, but also coming under pressure on their gross margins. To defend profitability, manufacturers...
    Friday 15 May 2026
    Foxconn says AI server mix and consignment model will drive annual shipments to more than double
    Foxconn (Hon Hai) held an online investor briefing on May 14, where executives outlined that cloud and networking products accounted for nearly 50% of group revenue in the first quarter...
    Thursday 14 May 2026
    QBit Semiconductor targets edge AI growth as copier chips turn oligopolistic
    IC design firm QBit Semiconductor will list on the Emerging Stock Board on May 15, 2026, and chairman Simon Shen, a former Kinpo executive, said the debut marks a new milestone for...
    Thursday 14 May 2026
    Tencent eyes Chinese ASIC ramp in 2H26
    Tencent Holdings Limited reported a 9% year-over-year increase in total revenue to CNY196 billion (approx. US$28.86 billion) for the first quarter of 2026, driven by a strategic pivot...
    Thursday 14 May 2026
    MediaTek courts Intel as Google pushes for alternatives to CoWoS
    MediaTek's decision to pursue advanced packaging partnerships with both TSMC's CoWoS ecosystem and Intel's EMIB platform has become one of the semiconductor industry's most closely...
    Wednesday 13 May 2026
    Imec's IC-Link joins TSMC 3DFabric Alliance, extending 3D integration access worldwide
    Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate...
    Wednesday 13 May 2026
    AI server tracker: GUC surges ahead as Faraday and Alchip face slower 2026 start

    Taiwan's ASIC and design services sector is showing sharply diverging fortunes in 2026, with new monthly revenue data highlighting strong...

    Tuesday 12 May 2026
    Interview: Cyient Semiconductors CEO on Kinetic acquisition — why power is the new compute bottleneck
    As the semiconductor industry grapples with the growing energy demands of artificial intelligence, Cyient Semiconductors is repositioning itself away from being a primarily semiconductor...
    Friday 8 May 2026
    Anpec plans midyear 15% price hike to protect PMIC margins
    Taiwan power management IC (PMIC) maker Anpec Electronics recently said its 2026 growth momentum will mainly rely on demand in non-PC applications to offset declines in PC-related...
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    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook