The Taiwanese semiconductor sector reported a starkly bifurcated performance for February 2026, as a massive cyclical rebound in the memory market...
JetCool, a subsidiary of Flex, has partnered with Broadcom to develop liquid cooling solutions for next-generation AI processors, according...
Microip will attend Embedded World 2026 in Nuremberg, Germany, from March 10 to 12. The company has released details of several new hardware...
In the AI era, technological competition among leading chip design companies continues to intensify. Broadcom announced in 2024 that it...
Taiwan's IC design landscape is undergoing a massive structural shift. Early 2026 revenue data reveals a dual-track performance: while established...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced it has successfully taped-out industry-leading, Universal Chiplet Interconnect Express. (UCIe.)...
