Samsung Electronics is reportedly developing a new packaging technology to address the overheating of mobile application processors (APs), which may be applied to its next-generation...

ASE Holdings (ASEH) has stepped up production expansion for advanced packaging and does not rule out establishing additional facilities in Japan, the US, or Mexico, according to company...

ASE CEO Tien Wu said at the company's 2024 shareholder meeting on June 26 that the semiconductor industry will have better performance in the second half of 2024, thanks to the demand...

Companies across industries, including the passive component sector, are optimistic about generative AI's business potential.

Malaysia is fast becoming a semiconductor hub in Southeast Asia, with efforts being devoted particularly to expanding its advanced packaging, IC design, and AI sectors.

ASE Technology Holding (ASEH) recently announced that its subsidiary Advanced Semiconductor Engineering (ASE) will collaborate with Hung Ching Development & Construction to build...

Intel Foundry's design ecosystem has hit a new milestone as key partners Ansys, Cadence, Siemens, and Synopsys release reference flows for Intel's Embedded Multi-die Interconnect...

Taiwan-based backend houses have seen demand for advanced packaging and testing services growing from the AI chip segment, which is expected to fuel sales growth in the second half...

In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics,...

Chinese OSATs including Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics (TFME) have stepped up their deployments for advanced packaging, offering services...

The Mini LED demand in the LED industry has shown a lack of new momentum, leading to a halt in expansion plans, and impacting equipment supplier FitTech's operations.

TSMC's second-quarter sales may surpass the target, seeing customers' AI and HPC-related orders flowing in. In July, chips for Apple's iPhone 16 and Intel's 3nm chips will start mass...

It is important to know how individual memory companies choose to develop their High Bandwidth Memory (HBM) technology for future competitions.

Samsung Electronics is actively expanding its partner alliance to strengthen its semiconductor packaging technology, seeking to compete with the world's leading foundry, TSMC, in...

Contrel Technology, an LCD equipment specialist, is increasing its deployment in MicroLED and advanced packaging, which is expected to yield results in 2025.