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    NEWS TAGGED MANZ
    Monday 15 June 2026
    CoPoS and FOPLP accelerate as Manz delivers its first 310mm electrochemical deposition equipment

    Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical...

    Monday 2 March 2026
    XTPL, Manz Partner for Ultra-Precise Dispensing Tech in Asia

    XTPL (WSE:XTP), a developer of Ultra-Precise Dispensing (UPD) technology for nanomaterial deposition, has entered a strategic partnership with Manz Asia to support the...

    Friday 18 April 2025
    Manz bolsters CoPoS innovation in Taiwan, eyes US expansion
    Manz, a pioneering company in semiconductor equipment, is ramping up its efforts to advance Chip-on-Panel-on-Substrate (CoPoS) technology, aiming for commercialization and broader...
    Tuesday 22 October 2024
    Manz pushing CoPoS to drive up AI chip capacity
    Thanks to the AI tsunami, demand for AI chips from all sectors is continuing to surge. The Chip-on-Wafer-on-Substrate (CoWoS) architecture that dominates existing 2.5D and 3D packaging...
    Tuesday 27 August 2024
    Manz AG anticipates growth in advanced packaging amid CoWoS shortage
    The semiconductor industry is experiencing a surge in demand for advanced packaging technologies, driven by the rapid growth of high-end AI servers and generative AI. This trend has...
    Tuesday 4 June 2024
    Laying groundwork for panel-level packaging processes, Manz deepens deployment in advanced semiconductor packaging blue ocean
    As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced...
    Thursday 7 September 2023
    Innovative technology and exclusive service mechanisms - Manz Taiwan helps customers adopt FOPLP
    Fan-out panel level packaging (FOPLP) offers advantages in cost control, high-density integration, and high reliability. After years of research and development, the technology has...
    Wednesday 24 May 2023
    Manz AG develops breakthrough production solution of panel-level packaging to seize growth of automotive semiconductors
    Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia 2023...
    Thursday 6 October 2022
    Manz AG takes leading market position of FOPLP equipment by fast transitioning from concept to mass production
    In 2022, the demand of semiconductor chips is facing an uncertain outlook, apart from the strong surge in orders of previous year. Especially in consumer electronics sectors, the market...
    Tuesday 28 December 2021
    Providing one-stop service for FOPLP RDL, Manz helps consumer electronics companies develop new opportunities
    With the rise of smart devices, applications for semiconductor components are quickly expanding. The requirements for chip size, information transmission speed, and power in network...
    Wednesday 21 April 2021
    Manz intelligent production solutions enable new business growth
    Manz AG is the wet chemistry process leader in Taiwan and China for production of displays panels, printed circle boards and advanced semiconductor packaging technology. The product...
    Tuesday 26 August 2014
    Manz and other equipment suppliers to showcase latest production solutions at Touch Taiwan 2014
    Germany-based Manz AG and a number of Taiwan-based PCB and LCD panel equipment suppliers will showcase their latest production equipment for the PCB and flat panel industries at Touch...
    Thursday 15 May 2014
    Manz to set up PCB equipment experimental factory in China
    Germany-based equipment maker Manz AG will invest CNY8.0 million (US$1.3 million) to establish a PCB production equipment experimental factory at its existing plant in Suzhou, eastern...
    Thursday 31 October 2013
    Demand for high-end PCBs promising: Q&A with Manz executive Alex Liu
    Disappointing sales of high-end smartphones and other unfavorable factors have discouraged PCB makers from spending money on capacity building since the the second half of 2013. However,...
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    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook