Zhu Jinping, Executive Vice President, Head of BU Electronics Solutions, and Chairman of AT&S China, addressed the Austria Connect China 2026 conference today, offering...
While market focus surrounding AI infrastructure has centered primarily on core computing components—such as GPUs, CPUs, high-bandwidth...
Leading Interconnect Semiconductor, a Zhen Ding Technology subsidiary, has broken ground on an AI advanced packaging substrate project...
China's fast-rising AI models are running into a compute supply bottleneck as demand for advanced packaging substrates surges, with...
Apple has changed its iPhone launch cadence this year, splitting its high-end releases into two waves. The iPhone 18 Pro series went...
HEC Compucase's AI server-related rollout continues to gain traction as AI racks, cooling modules, and high-end power supplies move...
Printed circuit board (PCB) wet-process equipment maker Ampoc Far-East said demand for its in-house high-end equipment has surged on...
Semiconductor packaging and testing materials distributor Niching Industrial hosted an investor conference on September 17. chief financial...
Copper-clad laminate (CCL) manufacturer Ventec International Group has approved an expansion budget of NT$1.5 billion (approx. US$47.11...
In response to rapid AI market growth, the Taoyuan City Government announced plans to establish a 40-hectare high-end integrated circuit...
