CONNECT WITH US
NEWS TAGGED HIGH-END
Wednesday 30 September 2026
Gold Circuit turns Amazon into a shareholder for Trainium servers
Gold Circuit Electronics (GCE) plans to bring in Amazon as a strategic investor through a private placement expected to raise NT$1.59 billion (US$49.88 million), lifting the two companies...
Wednesday 30 September 2026
Broadcom-Toppan venture opens Singapore's first high-end FC-BGA substrate plant
Advanced Substrate Technologies (AST), a joint venture between Japan's Toppan Holdings and Broadcom, officially opened a manufacturing facility in Singapore on September 29, 2026,...
Wednesday 30 September 2026
AI boom strains PCB supply chain as materials, equipment shortages persist into 2027
Rapid growth in AI server and high-speed networking demand since the second half of 2025 has tightened supply across printed circuit boards (PCBs), integrated circuit (IC) substrates,...
Wednesday 30 September 2026
Apple iPhone Duo revives UDC battle as Samsung weighs trade-offs
Apple has launched its first foldable phone, the iPhone Duo, adopting under-display camera (UDC) technology long used by Samsung Electronics. The move puts all-screen design back at...
Tuesday 29 September 2026
AI boom sends China and Taiwan's PCB makers racing to HK for capital
Global investment in AI infrastructure is expanding rapidly, driving specification upgrades across the supply chain, from AI servers to high-speed optical modules, and pushing printed...
Tuesday 29 September 2026
Taiwan PCB output hits record high on AI demand, putting NT$1 trillion year within reach

AI server, high-speed networking, and memory demand continued to lift Taiwan's PCB industry in the second quarter of 2026, boosting...

Thursday 24 September 2026
IEI sees network security, video growth through 2028

Industrial PC maker IEI Integration said on September 23 that it remains upbeat on full-year 2026 revenue, expecting double-digit growth...

Wednesday 23 September 2026
Vivo launches camera monitor accessory, stoking panel demand
Vivo officially unveiled its new flagship X500 series smartphones in Shanghai on September 21, along with wearable accessories including smartwatches and earphones. The X500 series...
Wednesday 23 September 2026
ZDT prices US$800M ECB to expand AI server PCB push

Printed circuit board (PCB) maker Zhen Ding Technology (ZDT) Group completed pricing of its sixth overseas convertible bond issue on...

Tuesday 22 September 2026
AT&S Unveils Strategy to Drive AI Growth

Zhu Jinping, Executive Vice President, Head of BU Electronics Solutions, and Chairman of AT&S China, addressed the Austria Connect China 2026 conference today, offering...

Tuesday 22 September 2026
Macronix Secure Memories Build Hardware Defenses for EU CRA
In the fiercely competitive European and other global markets, high-end applications such as automotive electronics, industrial control, networking equipment, and AI data centers face...
Tuesday 22 September 2026
Nvidia Rubin architecture drives high-end MLCC demand, solidifying Murata, SEMCO leadership

While market focus surrounding AI infrastructure has centered primarily on core computing components—such as GPUs, CPUs, high-bandwidth...

Monday 21 September 2026
Leading Interconnect Semiconductor starts Shenzhen advanced packaging substrate plant

Leading Interconnect Semiconductor, a Zhen Ding Technology subsidiary, has broken ground on an AI advanced packaging substrate project...

Monday 21 September 2026
ByteDance's China AI chip push hits substrate shortage

China's fast-rising AI models are running into a compute supply bottleneck as demand for advanced packaging substrates surges, with...

Monday 21 September 2026
iPhone Duo takes the baton from 18 Pro to extend Apple's upgrade wave

Apple has changed its iPhone launch cadence this year, splitting its high-end releases into two waves. The iPhone 18 Pro series went...