Under what the industry terms the "Filter Moore's Law," each process node shrink lowers tolerance for airborne molecular contaminants, causing filtration demand to grow exponentially...
Taiwanese server chassis maker Chenbro Micom is expanding its role in AI infrastructure, moving beyond traditional server enclosures into high-end AI servers and rack-level solutions...
PEN SJ Electronics, a subsidiary of China's SJ Electronics, will invest more than US$70 million in an advanced packaging materials and thermal management facility at Batu Kawan Industrial...
As the global smartphone system-on-chip (SoC) market contracts, competition in the high-end application processor (AP) segment is intensifying. MediaTek is accelerating its push into...
MAtek, a leading semiconductor testing company, reported September 2026 revenue of NT$569 million (approx. US$17.8 million), up 12.31% year-over-year. Revenue for the first nine months...
As AUO deepens its push into co-packaged optics (CPO), its subsidiary Darwin Precisions is also exploring opportunities in the semiconductor sector, leveraging its expertise in precision...
Samsung Electro-Mechanics (Semco) has secured another major AI server order, signing a KRW290 billion (about US$216 million) contract to supply multilayer ceramic capacitors (MLCCs)...
Amazon is considering moving about US$8 billion worth of high-end Nvidia chips off its balance sheet through a sale-leaseback structure, according to the Financial Times and...
JCET Group signed an agreement on September 29 for a high-end advanced packaging and testing project in Wuxi, Jiangsu Province. Wuxi municipal leadership pledged operational support...
Shinko Electric Industries announced on September 30 it has signed a purchase agreement to acquire the Mobara Fab from Japan Display (JDI) in Mobara City, Chiba Prefecture. The transaction...
The high-end cloud AI accelerator market will see a structural shift in 2027, with total ASIC shipments surpassing GPU shipments for the first time, driven by rising output from Google,...
Gold Circuit Electronics (GCE) plans to bring in Amazon as a strategic investor through a private placement expected to raise NT$1.59 billion (US$49.88 million), lifting the two companies...
Advanced Substrate Technologies (AST), a joint venture between Japan's Toppan Holdings and Broadcom, officially opened a manufacturing facility in Singapore on September 29, 2026,...
Rapid growth in AI server and high-speed networking demand since the second half of 2025 has tightened supply across printed circuit boards (PCBs), integrated circuit (IC) substrates,...
