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NEWS TAGGED HIGH-END
Friday 11 September 2026
AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle
Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...
Friday 11 September 2026
China's Shenzhen Kaifa plans CNY1.85 billion expansion for high-end memory packaging and testing
Chinese electronics manufacturer Shenzhen Kaifa Technology, also known as Shenzhen Kaifa or Kaifa, plans to invest CNY1.85 billion (about US$260 million) to expand high-end memory-chip...
Friday 11 September 2026
Global IC substrate market to surge 32% to US$19.5 billion in 2026 as Taiwan, Korea lead ABF, BT
Rising demand for generative AI, high-performance computing (HPC), and data center buildouts is pushing the global IC substrate industry into a new phase marked by upgrades in high-end...
Thursday 10 September 2026
AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand
AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the...
Thursday 10 September 2026
Nvidia reportedly drives testing interface capacity crunch, pushes Taiwan suppliers
AI chip demand is tightening high-end testing interface capacity, and supply-chain sources say Nvidia has raised prices to secure most of the probe card and test socket output from...
Thursday 10 September 2026
Global PMX sees semiconductor parts shipments strengthen
Global PMX, a major maker of automotive power and safety components, said August consolidated revenue rose to NT$802 million (approx. US$25.4 million), up 33.50% year on year and extending...
Wednesday 9 September 2026
Huaqin signs Nanchang projects as robotics push widens
Huaqin Technology has signed two new projects in Nanchang High-tech Zone, expanding the smart-hardware ODM group's local manufacturing base into embodied-AI robotics and data collection,...
Wednesday 9 September 2026
Lotte Energy Materials pivots from EV weakness to AI, ESS copper foil
Cooling electric vehicle demand is forcing South Korean copper foil makers to rethink capital and capacity. Lotte Energy Materials has sold a 90% stake in its architectural exterior...
Tuesday 8 September 2026
Ma-tek August revenue hits record, eyes U.S. FA, MA service in 2027
MA-tek, a semiconductor testing and analysis company, reported August revenue of NT$565 million, up 17.78% from a year earlier and marking a record high for the sixth straight month...
Tuesday 8 September 2026
PCB maker Zhen Ding tops US$634M August revenue on AI server, optical module demand
PCB maker Zhen Ding Technology (ZDT) said business momentum is accelerating as demand strengthens during the traditional peak season. In addition to continued stocking for new mobile...
Monday 7 September 2026
Foxconn revenue climbs on AI server demand, outlook improves
Foxconn said August sales rose sharply from a year earlier as demand for AI servers and related hardware continued to lift its cloud and networking business. The latest update suggests...
Sunday 6 September 2026
I-Chiun eyes Nvidia Vera Rubin supply chain as thermal business nears half of sales
I-Chiun Precision Industry is accelerating its shift from LED lead frames into high-end thermal solutions, with thermal products now accounting for 40-45% of revenue. The company expects...
Sunday 6 September 2026
Tongtai doubles semiconductor orders on AI data-center demand
Facing rapid demand expansion across the semiconductor and AI industries, Tongtai Group (TT Group) has aggressively promoted an import-substitution and localization strategy in recent...
Friday 4 September 2026
Samsung turns to chips, OLED for next phase of Vietnam expansion
Samsung is expanding its Vietnam footprint beyond smartphones, with semiconductor testing, high-end chip substrates, OLED displays and R&D emerging as the next pillars of its presence...
Friday 4 September 2026
CPO high-density optical interconnects drive E&R's submicron 2D FAU breakthrough
To meet next-generation high-speed optical interconnect demand, fiber array units (FAU) are moving from traditional one-dimensional layouts to high-density two-dimensional (2D) architectures,...