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    SK Hynix questions PIM as heat and packaging emerge as HBM limits
    7h 54min ago
    Doosan develops 13µm ultra-thin CCL for memory chip substrates
    7h 54min ago
    Apple reportedly seeks lower OLED panel prices through larger orders
    7h 54min ago
    Huawei and Apple foldable phones set off a supply chain rush in September
    7h 54min ago
    2027 tri-fold phones enter a new phase as materials and durability become key battlegrounds
    7h 54min ago
    NEWS TAGGED HIGH-END
    Wednesday 26 August 2026
    Record mid-2026 growth for WUS Printed Circuit and China's pivot to ultra-high-layer PCBs
    The global hardware supply chain is undergoing a structural transformation, driven by an unprecedented surge in artificial intelligence infrastructure investment. "This shift has brought...
    Wednesday 26 August 2026
    Silicon Optronics advances high-end BSI products as memory shortage splits CIS demand
    CMOS image sensor (CIS) manufacturer Silicon Optronics (SOI) president Bob Chen pointed out during an earnings call on August 25 that artificial intelligence (AI) demand has caused...
    Wednesday 26 August 2026
    Foxconn shifts China manufacturing from expansion to upgrade
    Foxconn is accelerating the geographic diversification of its global manufacturing capacity as AI server demand surges and supply-chain regionalization continues, with 2026 capex expected...
    Wednesday 26 August 2026
    China chip equipment maker Naura posts 25% revenue growth, but R&D and margins squeeze profit
    Naura Technology Group posted faster revenue growth than profit in the first half of 2026, with stronger semiconductor equipment sales offset by heavier R&D spending, higher sales...
    Wednesday 26 August 2026
    TCL, Asus drop China OLED as LGD gains edge
    TCL has reportedly stopped using OLED panels from its own TCL CSOT unit as it expands its monitor lineup, instead turning again to LG Display (LGD), while Asus is said to have halted...
    Wednesday 26 August 2026
    TSMC's 310mm push threatens Samsung's PLP lead
    Samsung Electronics commercialized fan-out panel-level packaging (FOPLP) before rivals, using the technology in mobile and wearable chips and now preparing to extend it into AI and...
    Monday 24 August 2026
    How Nvidia's whitelist was beaten: 74 B300 servers, Taiwan to China
    Taiwan's Keelung District Prosecutors Office has indicted nine people over the illegal export of high-end AI servers built on Nvidia's B300 GPUs. The indictment lays out, step by step,...
    Monday 24 August 2026
    Jeilin shifts upmarket as high-end image SoCs drive margins higher
    Jeilin's move into higher-end image-processing chips is reshaping its revenue mix and boosting profitability, with implications for cameras, security devices, and drones used by customers...
    Monday 24 August 2026
    Jinpao Precision anticipates 2H26 growth from AI orders, aerospace progress
    Thailand-based precision sheet metal manufacturer Jinpao Precision Industry delivered strong results in the second quarter of 2026. Fueled by orders for artificial intelligence (AI)...
    Monday 24 August 2026
    India advances Wi-Fi mmWave FWA trial as Gemtek eyes 100x shipments
    Gemtek has made new progress in its India-based Wi-Fi mmWave fixed wireless access (FWA) rollout after India's Telecommunication Engineering Centre (TEC), under the Department of Telecommunications...
    Thursday 20 August 2026
    AI chip strategies echo StarCraft factions as memory bottleneck reshapes the race

    The global semiconductor ecosystem is facing an unprecedented shortage of memory chips, with hardware growth increasingly constrained...

    Wednesday 19 August 2026
    AI drives EISO high-end PCB orders as CCL shortages bite

    Niche printed circuit board (PCB) maker EISO Enterprise said that 2026 industry demand has returned to post-pandemic highs as AI applications...

    Tuesday 18 August 2026
    China's Horizon Robotics sets J7 against Nvidia, Tesla

    Horizon Robotics is preparing its next-generation Journey 7 (J7) automotive AI chip family for mass production in 2027, aiming to extend...

    Monday 17 August 2026
    Giant warns rising bicycle parts costs will pressure margins

    Giant said rising raw material prices and price hikes for components from Japanese supplier Shimano, starting from August 2026, will...

    Monday 17 August 2026
    China's Vertilite commits US$741M to InP laser chips for AI optical interconnects
    Chinese optical chipmaker Jiangsu Vertilite Semiconductor Technology is investing CNY5 billion (approx. US$741 million) in a new communications chip and device R&D and manufacturing...
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    BIZ FOCUS
    Aug 25, 08:00
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Monday 24 August 2026
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
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