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Thursday 15 October 2026
Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints?
On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding...
Thursday 15 October 2026
UMC declines expedited Samsung order for Galaxy Z Fold8; GF eyed as backup DDI foundry
Following stronger-than-expected demand for its Galaxy Z Fold8, Samsung Electronics submitted an expedited wafer production request to United Microelectronics Corporation (UMC) that...
Monday 12 October 2026
Apple iPhone launch and holiday demand lift Momo revenue to a record September
Fubon Multimedia, which operates the Momo e-commerce platform, reported consolidated revenue of approximately NT$8.59 billion (US$269.4 million) in September 2026, up 8.2% from a year...
Monday 12 October 2026
Largan signals early peak-season cut, challenging phone chips in 4Q26
Largan chairman and CEO Adam Lin said October 2026 orders are tracking at roughly the same level as September's, but will begin declining in November as customers cut their forecasts...
Monday 12 October 2026
Commentary: Largan plays defense in phones, presses CPO offensive
Largan chairman Adam Lin spoke about the company's cautious smartphone outlook while taking a more aggressive stance on co-packaged optics (CPO) during a recent online earnings briefing...
Saturday 10 October 2026
Huawei faces price reset as memory costs surge
Huawei consumer business group chairman Richard Yu said surging memory component costs have added more than US$200 to the hardware cost of each Huawei smartphone, putting fresh pressure...
Friday 9 October 2026
MediaTek 3Q26 revenue beats forecast, maintains peak-season momentum
MediaTek reported its September and third-quarter 2026 revenue results, with September revenue of NT$55.40 billion (approx. US$1.74 billion), down 13.69% from the previous month and...
Thursday 8 October 2026
Samsung to exit in-house automotive AP, focus on high-margin chips
Samsung Electronics' System LSI division is reportedly planning a retreat from the automotive application processor (AP) business and launching a major restructuring, with a future...
Wednesday 7 October 2026
Apple and LG Electronics reportedly team up on branded smart home devices
Apple and LG Electronics are reportedly pairing up to create a line of smart home devices, though the devices will carry the LG brand name. The two companies are expanding their reach...
Wednesday 7 October 2026
Commentary: Largan earnings call spotlight — CPO, expansion and 4Q26 order momentum
Largan Precision will hold its earnings call on October 8, when the optical lens maker is due to report third-quarter results and outline its fourth-quarter outlook. With September...
Tuesday 6 October 2026
Apple, Qualcomm renew patent deal, iPhone modem shift deepens
Qualcomm announced on September 24 that it has renewed its global patent licensing agreement with Apple, with the new contract set to take effect on April 1, 2027. The terms and value...
Tuesday 6 October 2026
Arcadyan September revenue hits record on mobile communications strength
As the networking market enters its traditional peak season, customer demand is gradually recovering. Arcadyan Technology announced on October 5 its September revenue, which reached...
Monday 5 October 2026
Largan Precision sees steady smartphone lens demand as CPO fibre arrays near production
Largan Precision reported September consolidated revenue of NT$5.78 billion (US$181.99 million), up 15% from August but down 7% from a year earlier. Third-quarter revenue rose 15%...
Friday 2 October 2026
Samsung launches Tab S12, Buds On, SmartTag3
Samsung Electronics on October 1 unveiled its next-generation premium Galaxy Tab S12 series, its first clip-on wireless earbuds, the Galaxy Buds On, and the Galaxy SmartTag3, which...
Wednesday 30 September 2026
Apple A20 Pro ditches PoP memory packaging for WMCM
Apple's A20 Pro chip has dropped traditional package-on-package (PoP) packaging in favor of Wafer-Level Multi-Chip Module (WMCM), with memory and processor dies laid out side by side...