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NEWS TAGGED ANALYSIS
Saturday 21 March 2026
Analysis: Samsung's Exynos chip rebounds with mixed performance in 2nm era
Samsung Electronics' self-developed mobile application processor (AP) series, Exynos, long criticized for poor performance and overheating issues, is showing signs of revival. The...
Friday 20 March 2026
Analysis: Supermicro co-founder's GTC star turn ends in federal indictment
At NVIDIA GTC 2026, Super Micro Computer (Supermicro) appeared firmly at the center of the AI infrastructure boom. The company showcased its deepening collaboration with Nvidia and...
Friday 20 March 2026
Analysis: Alibaba and Baidu raise AI pricing as token-based model reshapes cloud economics
Alibaba and Baidu have raised prices for AI computing services, reflecting a broader shift in how cloud providers monetize AI as demand for tokenized workloads accelerates.
Friday 20 March 2026
Analysis: Memory price swings leave e-reader supply chain in the red
Recent shifts in the memory market are putting significant pressure on the e-reader supply chain, from upstream manufacturers to midstream module makers and downstream brand compan...
Thursday 19 March 2026
Analysis on Micron's strategic pivot: de-commoditizing the memory industry

The most significant revelation from CEO Sanjay Mehrotra during Micron's earnings call was the structural shift in how the company engages with...

Thursday 19 March 2026
Analysis: China's on-device AI chipmakers rush to supply OpenClaw, race for edge AI silicon leadership
OpenClaw is forcing a rethink of the AI hardware stack, shifting the locus of deployment from cloud-based interaction to autonomous, always-on agents running locally on devices.
Wednesday 18 March 2026
Analysis: How Nvidia is leveraging DeepSeek R1 surge to cement hardware–model domination
On March 11 (US time), Nvidia announced a US$26 billion five-year investment in open-source large language models and introduced Nemotron 3 Super, its most powerful hybrid mixture-of-experts...
Monday 16 March 2026
Analysis: Alibaba Qwen talent exit highlights ByteDance's push in multimodal AI
A core researcher behind Alibaba's Qwen large language model has left the company and is reportedly joining ByteDance's AI research unit Seed, Chinese media reported. The move underscores...
Monday 16 March 2026
Analysis: OpenClaw sparks China's AI agent wave, economists see new compute boom
AI agent technology is gaining momentum in China's tech sector, driven by the open-source platform OpenClaw and a trend known locally as "raising lobsters". The phenomenon is drawing...
Friday 13 March 2026
Apple's Mac Neo gambit: when volume alone can't hold the TSMC crown
The semiconductor landscape is undergoing a fundamental shift, moving from a mobile-first volume game to an AI-driven value competition.
Thursday 5 March 2026
Analysis: AI PCB rivalry across four economies puts Taiwan under pressure
Rising geopolitical tensions and surging demand for AI applications are reshaping the global printed circuit board (PCB) industry. The Taiwan Printed Circuit Association (TPCA) notes...
Monday 2 March 2026
Analysis: Europe's stalled gigafactory push threatens battery autonomy
With Northvolt, Cellforce, and ACC all defunct, Europe's battery ambitions have collided with a brutal market reality: Chinese manufacturers now own nearly 70% of global lithium battery...
Thursday 26 February 2026
Analysis: As Stargate stalls, Musk races ahead in AI infrastructure
The Trump administration has staked much of its AI credibility on Stargate — a US$500 billion infrastructure push announced alongside Sam Altman and Masayoshi Son. The project...
Wednesday 25 February 2026
Analysis: OpenAI's spending cut is not what it seems; AI infrastructure partners remain on track
A recent OpenAI disclosure has reignited debate about the company's AI infrastructure ambitions — but the alarm is largely misplaced. According to CNBC, OpenAI told...
Wednesday 18 February 2026
Analysis: 2nm shifts chipmaking from scaling to chiplet integration

The semiconductor industry is shifting at 2nm from transistor scaling to chiplet-based architectures and advanced packaging. Performance...