News tagged Passive, PCB, other IC components at DIGITIMES

NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS

Friday 24 October 2025

Samsung CTO: Cross-disciplinary collaboration key to semiconductor innovation

Silicon transistors are approaching their physical limits, and AI is increasing demand for higher density, performance, and energy efficiency. Advanced packaging and bonding technologies...

Thursday 23 October 2025

Taiwan's ZDT and Unimicron forecast golden decade for PCB industry on AI boom

As artificial intelligence (AI) and high-performance computing (HPC) lead a new industrial revolution in the PCB sector, Taiwanese giants Zhen Ding Tech (ZDT) and Unimicron are optimistic...

Thursday 23 October 2025

Taiwanese firms poised to lead TGV process equipment amid semiconductor-PCB integration

Tongtai and Contrel are focusing on the convergence of semiconductors and PCBs in advanced TGV packaging. Taiwanese companies aim to lead in this area, as Tongtai seeks profitability...

Thursday 23 October 2025

AI server PCB demand fuels fierce CCL material supply battle

As Nvidia's next-gen AI server platform enters mass production, cloud service providers (CSPs) continue advancing their in-house ASIC development plans, sustaining robust demand for...

Thursday 23 October 2025

TPCA Show 2025 highlights AI-driven PCB industry revolution

The 26th Taiwan Printed Circuit Association Show (TPCA Show 2025) officially opened on October 22, 2025. During the event, Unimicron chairman Tzyy-Jang Tseng delivered a keynote speech...

Thursday 23 October 2025

China's ZJeagles breaks VCSEL funding record, accelerates AI photonics race

ZJeagles Comsemi Technology (ZJeagles) has closed its Series B+ funding round, securing over CNY700 million (approx. US$98 million) —...

Wednesday 22 October 2025

Taiwan's Topoint unveils advanced drilling solutions for AI-Era PCBs at TPCA show 2025

The TPCA Show 2025 — the printed circuit board industry's premier annual event — officially opened on October 22 in Taipei,...

Wednesday 22 October 2025

Samsung's Exynos 2600 returns to flagship-level performance

Samsung Electronics will reportedly equip its next-generation Galaxy flagship series with its own flagship mobile SoC platform, the Exynos 2600, resuming a shared chip supply with...

Wednesday 22 October 2025

Taiwan's test interface leaders go global on rising AI, HPC orders

Driven by next-generation AI chip mass production and seasonal demand for consumer electronics, Taiwan's test interface suppliers reported steady growth in September 2025. Industry...

Wednesday 22 October 2025

Ventec unveils next-gen PCB materials for AI servers, green electronics at TPCA 2025

Taiwan-based Ventec International Group, a niche copper-clad laminate (CCL) supplier, unveils its latest material innovations for manufacturing AI server printed wiring boards (PWBs)...

Wednesday 22 October 2025

Foreign investment drives Taiwan's semiconductor output to NT$6 trillion

In 2024, AI drove Taiwan's semiconductor output to surpass NT$5 trillion (approx. US$162.9 billion). It is expected to grow another 20% in 2025 to reach NT$6.3 trillion. Additionally,...

Tuesday 21 October 2025

Global Electronics Association joins AMD and ASE to encourage advanced packaging standardization at IMPACT 2025

The Global Electronics Association (GEA) participated as a co-organizer in the 2025 International Microsystems, Packaging, Assembly, and Circuits Technology (IMPACT) Conference, hosting...

Tuesday 21 October 2025

GaN technology set to decide AI server power chip battle

As Nvidia boldly announces the arrival of 800V high-voltage power supplies for AI servers, nearly all leading power semiconductor players have joined its supply chain. The industry...

Tuesday 21 October 2025

The quiet duopoly powering AI server substrates: Taiwan and Japan’s next supply edge

Eclat Forever Machinery (EFM), a Taiwan-based maker of advanced IC substrate equipment, told investors it expects stronger performance in 2026 than in 2025. Chairman Chou Cheng-chun...

Tuesday 21 October 2025

Potens enters AI market with new Hot-Swap MOS

Demand for hot swap power supply in servers is increasing as AI data centers proliferate. Potens Semiconductor Chairman Hsiang-Chi Meng stated that in addition to continuing its expansion...

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