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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Friday 5 June 2026
AI servers and MLCC recovery drive growth at Ample Electronic
As artificial intelligence fuels demand across the electronics supply chain, Taiwanese conductive paste supplier Ample Electronic is seeing a rebound in one of the industry's most...
Friday 5 June 2026
AI demand strains PCB supply chains, lead times stretch past 20 weeks
Explosive demand for artificial intelligence is widening supply chain bottlenecks for global electronics makers, with shortages now reaching from advanced chips and packaging into...
Friday 5 June 2026
US targets China's PCB grip as AI and defense supply risks mount
As demand for artificial intelligence (AI) computing expands rapidly, market attention has long centered on GPUs, high-bandwidth memory (HBM), and advanced packaging. However, printed...
Friday 5 June 2026
India faces PCB supply squeeze as raw material shocks, AI demand, and import dependence drive costs higher
India's PCB industry is facing mounting supply constraints and cost pressures, driven by a combination of raw material inflation, logistics disruptions, and a structural reliance on...
Friday 5 June 2026
Arm says Taiwan powers its rise as agentic AI lifts PC growth
Arm CEO Rene Haas told the COMPUTEX keynote on June 2 that Taiwan has been inseparable from Arm's growth over the past 30 years, while Nvidia CEO Jensen Huang said that agentic AI...
Friday 5 June 2026
Hiwin targets logistics automation with Dexterity dual-arm robot
Motion control component maker Hiwin made its first cross-sector appearance at COMPUTEX 2026, showcasing a full technology stack spanning precision transmission, actuator modules,...
Friday 5 June 2026
Hanmi Semiconductor eyes record sales in Computex debut as HBM4 demand grows
Hanmi Semiconductor is projecting record annual revenue this year, as rising demand for high-bandwidth memory equipment lifts prospects for the South Korean chip-equipment maker and...
Thursday 4 June 2026
Ventec wins spillover high-speed CCL orders, revenue rises
Ventec International said May 2026 revenue kept growing, driven by sustained demand for high-margin aerospace polyimide (PI) materials, the start of mass production after high-speed...
Thursday 4 June 2026
Samsung's rumored CIS production shift highlights industry debate over fab ownership
Samsung Electronics' decision to place a key image sensor production line under its System LSI division highlights a broader question facing the CMOS image sensor (CIS) industry: whether...
Thursday 4 June 2026
LG Innotek targets Intel EMIB substrate chain with SK Hynix samples

LG Innotek is seeking to enter the supply chain for substrates used in Intel's EMIB advanced-packaging technology, supplying early samples...

Thursday 4 June 2026
Taiwan test interface maker CHPT rides AI chip orders to record May revenue
Chunghwa Precision Test Tech. (CHPT), a supplier of semiconductor test interfaces, reported revenue in May 2026 that reached another monthly record, supported by sustained orders from...
Thursday 4 June 2026
AI sparks tight supply warning for high-end passive components; MLCC rally eyes new super cycle
AI-driven demand for computing infrastructure has ended the passive components industry's inventory adjustment phase, with Taiwan-based leaders Yageo and Walsin Technology both seeing...
Thursday 4 June 2026
Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging
Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...
Thursday 4 June 2026
Exclusive: China tightens its grip on Silicon Carbide as the industry shifts to 8-inch wafers
At Computex 2026, much of the spotlight fell on the rapid evolution of AI data center infrastructure. Among the technologies drawing renewed attention was silicon carbide (SiC), a...
Thursday 4 June 2026
xMEMS tackles data center heat with chip-level cooling tech
Surging demand for artificial intelligence computing has accelerated the buildout of data centers, pushing system cooling closer to its limits. As power consumption rises, heat-related...