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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Wednesday 4 February 2026
Samsung Electro-Mechanics poised to enter Nvidia NVSwitch substrate supply chain

Samsung Electro-Mechanics (Semco) has secured its first supply role with Nvidia, the world's leading GPU manufacturer, to provide high-end...

Tuesday 3 February 2026
Huawei-linked Hubble invests in automotive chipmaker Norelsys pre-IPO

Norelsys (Tianjin) Co., Ltd. has begun IPO counseling after filing registration for listing guidance with the Tianjin branch of the China...

Tuesday 3 February 2026
Shanghai fast-tracks 'Oriental IC Port,' adds fourth-gen semiconductors to roadmap

China is pushing ahead with its semiconductor materials strategy. Shanghai, one of the country's leading cities, has included brain-computer...

Tuesday 3 February 2026
Ample Electronic expects quarterly growth as silver price drop prompts passive component clients to resume orders
Ample Electronic Technology, a major upstream manufacturer of conductive pastes for passive components, said that the sharp decline in silver has revived downstream customers' ordering...
Tuesday 3 February 2026
C Sun invests NT$1.48 billion in Taichung plant to boost AI advanced packaging equipment
Semiconductor and printed circuit board (PCB) equipment maker C Sun announced plans to invest approximately NT$1.48 billion (US$46.87 million) to acquire a nearly 3,000-ping (106,750...
Tuesday 3 February 2026
Sumitomo Bakelite to acquire Kyocera unit, paving way for Chang Wah expansion
Japanese materials maker Sumitomo Bakelite has announced plans to acquire the materials business of Japanese electronic components company Kyocera. Industry observers say the companies'...
Monday 2 February 2026
Kinsus approves US$744M ABF expansion on clear three-year demand outlook
Kinsus, the IC substrate arm of Pegatron, has approved additional project-based capital spending totaling NT$23.5 billion (approx. US$744 million) to support ABF substrate equipment...
Monday 2 February 2026
Chinese process control powerhouse Jingce targets nearly triple profit growth in 2025
Wuhan Jingce Electronic Group forecasts net profit of CNY80 million to CNY90 million (approx. US$11.5 million to US$13 million) for 2025, representing year-over-year growth of 181.97%...
Monday 2 February 2026
Semco's Tianjin MLCC plant capacity runs flat out on EV, AI server expansion
Rising automotive electronics demand has pushed Samsung Electro-Mechanics (Semco)'s Tianjin plant to full capacity across its multilayer ceramic capacitor (MLCC) production lines,...
Monday 2 February 2026
Taiwan PCB makers vie for AI server market with new 2026 capacity
As demand for AI infrastructure continues to grow steadily, major networking and server PCB suppliers such as Gold Circuit Electronics (GCE), First Hi-tec (FHt), and Allied Circuit...
Friday 30 January 2026
ABF substrate crunch reshapes market: Unimicron leads and rivals close in

AI server architectures are rapidly shifting toward ultra-high-density designs, keeping advanced CoWoS packaging capacity persistently tight...

Friday 30 January 2026
DRAM price surge ripples downstream as CWE plans EMC hike
The recent surge in DRAM prices is widening pricing headroom across the semiconductor supply chain, prompting Chang Wah Electromaterials (CWE), a major semiconductor materials supplier...
Thursday 29 January 2026
Cmsemicon triggers MCU, NOR Flash price hikes of up to 50% in widening China chip cost cycle
Chinese microcontroller (MCU) supplier Cmsemicon has raised prices on its MCU and NOR Flash products by 15% to 50%, citing tighter chip supply and higher packaging and testing costs...
Thursday 29 January 2026
Elite Material Co. invests in Taoyuan to boost high-end PCB production for AI demand
Elite Material Co. (EMC), a leading copper-clad laminate (CCL) manufacturer, has acquired land and buildings in Taiwan's Taoyuan Guanyin Industrial Park from Far Eastern New Century...
Wednesday 28 January 2026
Powertech will invest NT$43.3 billion to accelerate FOPLP, targets mass production in 1H27
In response to growing demand from AI and high-performance computing (HPC) for advanced packaging capacity such as fan-out panel-level packaging (FOPLP), Powertech chairman DK Tsai...