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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Tuesday 19 August 2025
China's CCL makers raise prices amid surging costs; Taiwan's PCB sector braces for impact
China's copper-clad laminate (CCL) producers, pressured by surging raw material costs and intensifying competition, have issued new price increase notices. Kingboard, Meizhou Weilibang...
Tuesday 19 August 2025
Nan Pao revises down capex, as semiconductor adhesives drive growth
Nan Pao Resins Chemical Group has been expanding into the semiconductor sector, with an eye on semiconductor adhesives and other electronic applications driving growth. Following...
Tuesday 19 August 2025
Intelligo reports 52% jump in Q2 profit, sees stronger 2H25
Taiwan-based ASIC design firm Intelligo Technology, which specializes in AI-powered acoustics and speech recognition, posted solid gains in the second quarter of 2025 as consumer...
Tuesday 19 August 2025
Yageo extends tender offer deadline for Shibaura Electronics amid MinebeaMitsumi price match
Taiwan's Yageo Corporation has extended the deadline for its tender offer bid (TOB) for Japan's Shibaura Electronics to August 28 amid a competitive price increase from rival MinebeaMitsumi...
Monday 18 August 2025
Topco Scientific prepares for 2027 showdown as Chinese wafer makers strengthen market hold
As China's semiconductor juggernaut gathers pace, a fierce contest for dominance in the silicon wafer market is becoming inevitable for global suppliers.
Monday 18 August 2025
Strong demand for advanced nodes drives Topco's 1H25 revenue growth
Topco Scientific (TSC) stated during an earnings call on August 14, 2025, that current semiconductor market conditions are on par with the first quarter of 2025, adding that advanced...
Monday 18 August 2025
Section 232 investigations loom over Taiwan's key industries
Despite TSMC's US$165 billion investment in the US, Taiwan does not appear to have any special favor from the United States. Taiwan faces a higher reciprocal tariff compared to Japan...
Monday 18 August 2025
Strong AI and HPC demand drives Daxin Materials' dual growth engines, ready to expand capacity
Daxin Materials reported solid operational performance in the first half of 2025, with expectations for continued growth in the semiconductor and display materials sectors in the...
Friday 15 August 2025
Minebea Mitsumi raises Shibaura Electronics tender offer, matching Yageo's bid
Minebea Mitsumi has increased its tender offer bid (TOB) for shares of Shibaura Electronics to JPY6,200 (US$41.99) per share, matching the bid made by Taiwanese company Yageo Corporation...
Friday 15 August 2025
Taiwanese firms secure M9-grade CCL certifications as ASIC server demand surges
In response to the global surge in large-scale AI computing power deployment, the usage and value of PCBs for AI servers have significantly increased. High-end copper-clad laminate...
Friday 15 August 2025
Taiwan gains competitive edge as China faces steep US tariffs
On July 31, 2025, US President Donald Trump signed an executive order to adjust reciprocal tariff rates, setting the provisional tariff for Taiwan at 20%, effective from August 7,...
Thursday 14 August 2025
Commentary: Trump's trillion-dollar shakedown and how tariff threats turned into investment windfalls
Following South Korea's shocking announcement to invest US$350 billion in the US, with 90% of the profits staying in the US, Nvidia and AMD reportedly have agreed to pay 15% of their...
Thursday 14 August 2025
Topoint races to meet surging drill bit demand as AI and HPC boom

As artificial intelligence (AI) and high-performance computing (HPC) drive explosive growth in demand for advanced printed circuit boards...

Thursday 14 August 2025
Tongtai Machine & Tool lifts 1H25 revenue 4%, backed by NT$3B order backlog
Tongtai Machine & Tool Co. Ltd. reported first-half 2025 consolidated revenue of NT$2.8 billion (US$93.8 million), a 4% increase from a year earlier, supported by stable operations...
Wednesday 13 August 2025
Zhen Ding bullish on CoWoP despite long road to mass production
Nvidia is reportedly collaborating with its supply chain to develop an advanced packaging architecture called Chip-on-Wafer-on-PCB (CoWoP) for its Rubin GPU platform. This new design...