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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Thursday 16 July 2026
Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO
Generative AI is accelerating demand for computing power, memory and data bandwidth, shifting semiconductor innovation beyond front-end processes toward advanced packaging, silicon...
Wednesday 15 July 2026
Jensen Huang's Akihabara visit honors partners behind Nvidia's 33-year rise
Nvidia CEO Jensen Huang is scheduled to attend an event in Tokyo's Akihabara district on July 15, marking the 30th anniversary of the partnership between Nvidia GeForce Japan and gaming...
Wednesday 15 July 2026
Nam Liong posts strong Q2 as high-value materials drive growth
Nam Liong Global Corporation reported consolidated revenue of NT$245 million (US$8.4 million) for June 2026, down 2.56% from the previous month but up 21.66% year over year, reflecting...
Tuesday 14 July 2026
Taiwan AI suppliers ride global demand as substrate, and CCL markets tighten
Taiwan's AI hardware supply chain remained strong in June, as substrate and CCL makers posted sharp annual gains driven by demand for AI servers, ASICs, and high-performance computing...
Tuesday 14 July 2026
Six-inch SiC substrate price rebounds as supply tightens

Six-inch silicon carbide (SiC) substrates, a third-generation semiconductor product that has faced oversupply and falling prices for...

Tuesday 14 July 2026
Intel challenges HBM leaders with XBM and ZAM in a bid to reshape AI memory

Intel is developing a new memory architecture aimed at challenging the dominance of high-bandwidth memory (HBM), with commercialization...

Tuesday 14 July 2026
AI demand pushes global ABF substrate market into shortage, with pressure seen through 2028

The AI boom is tightening an important but often overlooked part of the chip supply chain, with global readers likely to feel the effects...

Tuesday 14 July 2026
C Sun sees advanced packaging and PCB demand driving 2026 revenue
C Sun said its 2026 revenue growth will be led by advanced packaging and advanced printed circuit board equipment as AI infrastructure spending continues to support industrial investment...
Tuesday 14 July 2026
Quartz component makers raise prices as material costs bite

Quartz component suppliers are raising prices as higher raw material costs from gold wire and ceramic bases squeeze margins. Industry...

Tuesday 14 July 2026
Tripod posts record second-quarter revenue as 2026 capex plan tops NT$10 billion
Tripod Technology said its business stayed strong in the first half of 2026, helping second-quarter revenue hit a new quarterly high. June sales still topped NT$8 billion (approx....
Tuesday 14 July 2026
TASC reshuffles management as PASC targets 2027 Taiwan Innovation Board listing
Taiwan-Asia Semiconductor (TASC) has announced senior management changes at its group companies as ProAsia Semiconductor (PASC) prepares for a Taiwan Innovation Board listing, now...
Monday 13 July 2026
Samsung develops glass interposer as TSMC expands packaging capacity

Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging...

Monday 13 July 2026
China Life commits US$700M to semiconductor fund under Beijing's patient capital strategy

China Life Insurance Company Limited plans to invest CNY4.999 billion (US$697 million) in a new CNY5 billion semiconductor private...

Monday 13 July 2026
CPO mass production accelerates new four-stage test equipment market
AI-driven demand is accelerating the shift of co-packaged optics (CPO) from technology validation to mass production, triggering a new wave of equipment demand. Companies including...
Sunday 12 July 2026
Taiwan PCB leaders launch fundraising wave for AI data centers

Taiwan's PCB industry is entering a new expansion cycle as investment in AI data centers and other emerging applications accelerates...