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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Tuesday 15 September 2026
Sivers Semiconductors positions laser arrays as solution to copper's limits

At this year's China International Optoelectronic Expo (CIOE), Sivers Semiconductor brought two products to its booth that trace the...

Tuesday 15 September 2026
AI server tracker: CCL makers outpace PCB and substrate suppliers as server demand grows
Taiwan's copper-clad laminate (CCL) makers significantly outpaced printed circuit board (PCB) and IC substrate suppliers in August, as stronger server demand, pricing and product-mix...
Tuesday 15 September 2026
Chinese chip tools reach 35% of equipment installed at local fabs
Chinese-made semiconductor equipment accounted for roughly 35% of tools installed at fabs in China in 2025, up from about 25% a year earlier, as domestic suppliers gain ground in key...
Tuesday 15 September 2026
Inside CIOE: takeaways from China's biggest optoelectronics show
Last week, from September 9 to 11, thousands of vendors gathered for an enormous trade show in the Chinese tech hub of Shenzhen. At the China International Optoelectronic Expo (CIOE),...
Tuesday 15 September 2026
Global data center capex could reach US$31.6 trillion by 2050 as AI demand surges
PwC and Oxford Economics jointly released their Global Data Centre Outlook 2026–50 in early September, projecting cumulative global...
Tuesday 15 September 2026
Exclusive: China's 8-inch SiC suppliers turn to pricing discipline after 6-inch price war

As the silicon carbide (SiC) industry shifts from 6-inch to 8-inch wafer manufacturing, leading China-based substrate suppliers are...

Monday 14 September 2026
STMicro lead times top 1 year, boosting Taiwan chip makers
AI crowd-out effects are rippling through the supply chain, with lead times for microcontroller units (MCUs) from STMicroelectronics reportedly stretching beyond 1 year and triggering...
Monday 14 September 2026
DIGITIMES Insight: China's GaN challengers are no longer playing catch-up
Chinese GaN power semiconductor maker Innoscience gained direct access to capital markets after listing in Hong Kong at the end of 2024, giving it fresh funding to expand GaN capacity...
Monday 14 September 2026
Samsung, Qualcomm deepen 2nm talks as pricing and yield hurdles persist
Samsung Electronics and Qualcomm are expanding discussions over 2nm foundry cooperation, with pricing, yield, and process optimization still unresolved as Samsung seeks to regain a...
Monday 14 September 2026
A Taiwan PCB maker's China affiliate is worth three times its parent — and the parent just bought more of it

UK-based investment firm Palliser Capital announced on September 9 that following several months of constructive dialogue with the management...

Monday 14 September 2026
Renesas readies second price hike amid stronger power-chip demand

Renesas Electronics is reportedly preparing a second product price increase this year, with new pricing set to take effect January 1,...

Sunday 13 September 2026
Artery secures spot in Arm ecosystem, pushing high-end MCUs into robotics, physical AI

As Arm targets expansion in physical AI, microcontroller (MCU) maker Artery Technology has emerged as a key ecosystem partner. Focusing...

Saturday 12 September 2026
AI server boom reshuffles MLCC supply, opening a rare expansion window for Taiwan makers

Strong demand for AI computing is creating a capacity squeeze across the passive-component industry, opening new opportunities for Taiwanese...

Saturday 12 September 2026
Murata targets mass production of its AI power substrate next year
Murata Manufacturing plans to begin mass production next year of iPaS, the power substrate it has spent several years developing for AI chips, a step that would carry the world's largest...
Friday 11 September 2026
Samsung Electro-Mechanics, LG Innotek vie in AI package substrates
At South Korea's recent KPCA Show 2026, Samsung Electro-Mechanics and LG Innotek showcased their next-generation package substrate technologies. As AI semiconductors evolve toward...