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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Tuesday 9 September 2025
DDI supply chain shakeup for Apple's iPhone puts LX Semicon at risk

China's BOE Technology is moving to diversify Apple's iPhone display driver IC (DDI) supply chain, a shift that threatens South Korea's...

Tuesday 9 September 2025
Five years on, Taiwan's G2C positions local equipment makers at center of AI packaging shift
Soaring demand for AI computing is ushering the semiconductor sector into a fresh cycle of high-speed growth, pushing advanced packaging requirements to new heights. From infrastructure...
Tuesday 9 September 2025
Globalwafers chief warns materials, not process nodes, will decide chip industry's future
Speaking ahead of SEMICON Taiwan 2025, Globalwafers chairperson Doris Hsu said competition in semiconductors is shifting from process nodes and capacity to control of critical materials...
Tuesday 9 September 2025
Aplex partners with Adirtek to enter CoWoS supply chain
Industrial PC (IPC) manufacturers have been actively expanding into new application markets in recent years, optimistic about the semiconductor industry's growing demand for full-process...
Monday 8 September 2025
AI computing power reshapes global optoelectronics: 5,000 companies converge in Shenzhen for CIOE and SEMI-e shows
The 26th China International Optoelectronic Exposition (CIOE) will take place September 10–12, 2025, at the Shenzhen World Exhibition and Convention Center, alongside the International...
Monday 8 September 2025
Semicon Taiwan 2025 sets new records, focusing on AI, advanced packaging, and memory
SEMICON Taiwan 2025 will take place from September 10 to 12, 2025, at the Taipei Nangang Exhibition Center, bringing together over 1,200 global semiconductor and technology companies...
Monday 8 September 2025
Taiwan PCB makers pivot to AI servers amid China exodus
As the four major cloud service providers (CSPs) aggressively ramp up their presence in the AI computing market, Taiwan's printed circuit board (PCB) industry is experiencing a clear...
Saturday 6 September 2025
GCE plans to expand Taiwan capacity with NT$1.6B purchase of CMC Zhongli plant
As demand for AI servers drives full production capacity, PCB manufacturer Gold Circuit Electronics (GCE) announced on September 5, 2025, that its board of directors approved a NT$1.6...
Friday 5 September 2025
Asahi Kasei to double chip insulating material output by 2030 as AI data centers soar
Japan's semiconductor materials suppliers are racing to expand capacity as the AI data center build-out drives unprecedented demand for advanced chips and packaging inputs. Nikkei...
Friday 5 September 2025
Taiwan PCB makers brace for mixed 2H25 as tariffs cloud demand
As the second half of 2025 ushers in the peak season for consumer electronics, Taiwanese PCB suppliers are preparing for new product launches from key clients like Apple. Despite...
Thursday 4 September 2025
Taiwan PCB supply chain tightens capex scale; leaders increase AI and SEA investments
Despite facing global end-market inventory adjustments and rising geopolitical uncertainties, Taiwan's printed circuit board (PCB) supply chain is shifting its capital expenditure...
Thursday 4 September 2025
China's SiC substrate industry faces setback, seeks strategic pivot
In early 2025, a leading Chinese third-category silicon carbide (SiC) substrate manufacturer faced international IDM customer complaints over product quality, triggering market concerns...
Thursday 4 September 2025
Tech Forum 2025: China's SiC surge leaves Wolfspeed struggling beyond bankruptcy
Wolfspeed's recovery from bankruptcy protection remains uncertain, with core problems expected to extend beyond its anticipated year-end exit. The US power semiconductor firm is struggling...
Wednesday 3 September 2025
Nittobo to triple T-Glass cloth capacity by 2027
Japanese fiberglass cloth giant Nitto Boseki (Nittobo) announced plans to invest JPY15 billion(US$101.87 million) to expand its production facilities to meet surging demand from...
Wednesday 3 September 2025
Why TSMC is holding back on advanced packaging despite soaring demand
TSMC's CoWoS capacity remains in high demand, securing its dominant position in advanced semiconductor packaging with rumored gross margins nearing 80%. However, TSMC is proceeding...