Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged optics (CPO), chiplets, and glass...

As the industry shifts toward greater use of optical interconnects and less reliance on copper, market speculation has emerged that wider adoption of co-packaged optics...

Nvidia's latest AI platform roadmap is taking shape, with supply chain sources saying the company will enter a heavy shipment phase for Vera Rubin in the second half of...

Nan Ya Plastics is speeding up its transformation in electronic materials as cloud service providers expand capex at a rapid pace, making printed circuit board (PCB)...

Shihlin Electric is bullish on continued growth in heavy electrical equipment and energy-related businesses as demand rises for Taiwan Power grid reinforcement, energy...

LG Innotek is applying internally developed artificial intelligence to semiconductor glass substrate manufacturing, targeting microcracks, one of the technology's toughest...

WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV) substrates for optical communications...