T-Head Semiconductor, a subsidiary of Alibaba, is reportedly preparing for an initial public offering (IPO), signaling a new growth phase for China's domestic AI chip sector. Industry...
The growing emphasis on power efficiency in cloud AI computing has drawn focus to the high-voltage direct current (HVDC) 800V supply chain, presenting notable opportunities and challenges...
Demand for power management integrated circuits (PMICs) from Taiwanese manufacturers is showing signs of stabilization, particularly in cloud AI servers, industrial control, and automotive...
Cloud service providers (CSPs) are significantly increasing capital expenditures, continuously investing in high-end AI servers and deploying cloud AI computing projects. This surge...
An internal structural photo of Nvidia's Quantum-X Photonics silicon photonics (SiPh) switch revealed that its solid-state drive (SSD) controller chip was branded with the iconic Realtek...
DIGITIMES has recently published three latest research reports regarding Qualcomm's cloud AI ASIC business strategy for 2026, the status of the worldwide top-3 memory makers, plus...
The passive component industry is facing price increases because of upstream metal price fluctuations. Taiwanese manufacturers have started raising prices on tantalum capacitors, with...
At CES 2026 in the US, hybrid cloud open-source software provider Red Hat announced an expanded collaboration with Nvidia centered on the Vera Rubin computing platform. Red Hat will...
Nvidia has announced a US$20 billion deal to acquire non-exclusive technology licenses from AI chip startup Groq, with Groq's current CEO and core research and development team joining...
Egis Technology Group recently held an investor briefing to present its operational outlook for 2026, focusing on a dual approach to cloud AI and edge AI development. The group aims...
Memory prices are surging, sending shockwaves through the supply chain as suppliers prioritize higher-margin cloud and AI server demand. Rising procurement costs are squeezing downstream...
Due to the lack of a significant surge in edge AI demand in 2025 and China's push for chip localization, Taiwan-based IC design houses are increasingly losing ground in global competition...
TSMC's advanced CoWoS packaging capacity has become extremely tight, resulting in only a few leading AI chipmakers having the means to book capacity in large quantities. Other ASIC...
