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    Realme and OnePlus return to Oppo: Three-brand integration to counter supply chain and market pressure
    3h 19min ago
    CATL teams up with Nio to tackle the next phase of China's EV boom
    3h 19min ago
    Seeking independence from Starlink, Japan backs homegrown satellites
    3h 20min ago
    India advances local chip design ecosystem under incentive scheme, early outputs emerge
    3h 20min ago
    LinkCom targets high-end networking as magnetic component sales rebound
    3h 20min ago
    Taiwan's Yield Microelectronics rakes in IP royalties, stands as semiconductor outlier
    3h 20min ago
    Apple iPhone exports from India reach US$50 billion in 2025
    3h 20min ago
    CES 2026: Nvidia CEO says memory supply secure but AI demands more fabs
    3h 21min ago
    WinWay reports record revenue growth driven by AI demand in 2025
    3h 21min ago
    Jabil expands data center business with Hanley Energy acquisition
    3h 21min ago
    Hyundai pushes deeper into robotics with Atlas humanoid
    3h 22min ago
    Taiwan's telecom sector reshaped after mergers, profitability up but revenue growth stalls
    3h 22min ago
    China's humanoid robots outsell US rivals in 2025 shipments
    3h 22min ago
    China semiconductor leaders urge caution on Nvidia H200 deals
    Jan 10, 22:43
    AI-driven surge in computing power transforms data center energy architecture
    Jan 10, 22:43
    Exclusive interview: Hubble’s CEO explains how Bluetooth could power the next space network
    Jan 10, 22:42
    Excellence Opto advances multi-business strategy, Mexico plant to launch in 1Q26
    Jan 10, 22:42
    Chicony Power targets 2H26 benefits from Supermicro AI container supply chain entry
    Jan 10, 22:41
    LG Display sets transparent OLED as next growth pillar for automotive, XR
    Jan 10, 22:40
    LCD TV panel prices rise in January with potential for further gains in February
    Jan 10, 22:39
    Sporton passes first Wi-Fi 8 test and receives FCC approval
    Jan 10, 22:38
    Trump praises US stake as Lip-Bu Tan reports 18A chips on schedule
    Jan 10, 22:38
    Tex Year targets AI and optoelectronics specialty chemicals
    Jan 10, 22:38
    NEWS TAGGED CLOUD AI
    Friday 9 January 2026
    CES 2026: Red Hat expands collaboration with Nvidia to support Nvidia Vera Rubin platform
    At CES 2026 in the US, hybrid cloud open-source software provider Red Hat announced an expanded collaboration with Nvidia centered on the Vera Rubin computing platform. Red Hat will...
    Thursday 8 January 2026
    CES 2026: Lenovo unveils cloud-to-device strategy

    Lenovo detailed a Hybrid AI strategy at the CES 2026 technology conference, outlining plans to integrate artificial intelligence (AI)...

    Monday 5 January 2026
    Qualcomm cloud AI ASIC business strategy

    Introduction

    Monday 29 December 2025
    Nvidia's quasi-acquisition of Groq signals AI chip startups' survival challenges
    Nvidia has announced a US$20 billion deal to acquire non-exclusive technology licenses from AI chip startup Groq, with Groq's current CEO and core research and development team joining...
    Friday 26 December 2025
    Egis Technology Group outlines dual cloud and edge AI strategy targeting 2026 results
    Egis Technology Group recently held an investor briefing to present its operational outlook for 2026, focusing on a dual approach to cloud AI and edge AI development. The group aims...
    Friday 19 December 2025
    Brands cut specs and raise prices as memory supply turns scarce
    Memory prices are surging, sending shockwaves through the supply chain as suppliers prioritize higher-margin cloud and AI server demand. Rising procurement costs are squeezing downstream...
    Wednesday 10 December 2025
    Taiwan chipmakers shift to non-consumer AI markets as cloud AI outpaces edge
    Due to the lack of a significant surge in edge AI demand in 2025 and China's push for chip localization, Taiwan-based IC design houses are increasingly losing ground in global competition...
    Monday 24 November 2025
    Intel's EMIB becomes potential alternative to TSMC's CoWoS
    TSMC's advanced CoWoS packaging capacity has become extremely tight, resulting in only a few leading AI chipmakers having the means to book capacity in large quantities. Other ASIC...
    Wednesday 19 November 2025
    Taiwan IC designers: Edge AI boom hinges on shipment volume
    The stark contrast between cloud AI and edge AI markets has led chipmakers to respond very differently when assessing AI opportunities. While semiconductor companies in Europe and...
    Tuesday 18 November 2025
    PDG announces US$700 million data-center investment in South Korea

    Princeton Digital Group (PDG) has announced plans to enter the South Korean market with a US$700 million data-center investment, marking...

    Monday 17 November 2025
    Ceva's chief strategy officer says edge AI trend is set; physical AI to reshape chip industry
    IP provider Ceva held its Technology Symposium this week in Hsinchu, showcasing multiple edge AI technology solutions co-developed with partner IC design houses. Ceva chief strategy...
    Monday 17 November 2025
    Google to invest US$40 billion in Texas for cloud and AI data center expansion by 2027
    Google has announced plans to invest US$40 billion in Texas through 2027, expanding its cloud and AI infrastructure with new data center campuses in Armstrong and Haskell counties.
    Thursday 6 November 2025
    IC designers race to win orders despite declining margins
    At its most recent earnings call, MediaTek raised its forecast for the total ASIC market from US$40 billion to US$50 billion, reflecting surging demand for cloud AI ASICS. However,...
    Tuesday 4 November 2025
    Sanmina beats estimates, raises guidance on AI demand, and ZT Systems deal
    Sanmina reported better-than-expected fourth-quarter results and issued upbeat guidance, citing strong demand from communications networks and cloud, and AI infrastructure, and momentum...
    Thursday 30 October 2025
    AMD completes divestiture of ZT Systems manufacturing business to Sanmina
    On October 27, 2025, AMD completed the divestiture of ZT Systems' US-headquartered data center infrastructure manufacturing business to Sanmina Corporation. Under the agreement, AMD...
    1/6 pages
    Research Report Database
    BIZ FOCUS
    Jan 6, 16:39
    MSI Unveils Full Lineup of AI Products at CES 2026
    Tuesday 6 January 2026
    SK hynix Showcases Next Generation AI Memory Innovation at CES 2026
    Tuesday 6 January 2026
    Mobilint Brings Award-Winning Edge AI Hardware to the Global Stage at CES 2026
    Tuesday 6 January 2026
    Skyted's Sound Bubble at CES 2026
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