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NEWS TAGGED AUTOMOTIVE
Friday 27 January 2023
miniLED-backlit LCD, OLED in competition for use in automotive displays
Before microLED technology becomes mature for commercial use, miniLED-backlit LCD panels will compete with OLED panels for application to high-end automotive displays.
Thursday 26 January 2023
Foundry fabs may see automotive clients cut back on orders
As carmakers are significantly adjusting their chip demand structure, semiconductor manufacturers could face new challenges of both consumer and automotive applications cooling down,...
Tuesday 24 January 2023
Opportunities and challenges for semiconductor industry in automotive applications (2)
The semiconductor industry can learn from its past development history for making changes needed to cope with the trends and phenomena of the automotive industry.
Tuesday 24 January 2023
Passive component makers deepening deployments in sensor segment
Taiwan's passive components makers including Yageo and Thinking Electronic Industrial are tapping deeper into the segment of sensors to explore huge business potentials for automotive,...
Monday 23 January 2023
Opportunities and challenges for semiconductor industry in automotive applications (1)
Driven by geopolitical influences and pandemic-induced supply chain disruptions, the supply chains in the past global trade system are being restructured, and one of the possible...
Wednesday 18 January 2023
Mobiletron gearing up for output ramp-up
Automotive electronics component maker Mobiletron Electronics is gearing up for its output ramp-up with additional one-stop production lines, according to the company.
Tuesday 17 January 2023
Pegatron looks to automotive, communication devices for 2023 growth
Pegatron expects sales generated from automotive and communication devices will drive overall revenue growth in 2023, according to president and co-CEO Johnson Deng.
Monday 16 January 2023
IC designers see limited demand recovery momentum for 2H23
Inventory corrections at the entire semiconductor supply chains are widely expected to last throughout the first half of 2023, to be followed by market recovery in the second half...
Friday 13 January 2023
OLED to be in competition with LCD for application as automotive displays
While LCD panels have been dominantly used in automotive displays, demand for higher-quality in-vehicle displays will lead to competition between OLED and LCD panels, according to...
Friday 13 January 2023
PCB materials suppliers expect demand recovery after 2Q23
Suppliers of copper-clad laminates (CCL), flexible CCL, and other PCB materials expect customer demand to rebound after the second quarter of 2023, according to industry sources.
Friday 13 January 2023
Compal to build assembly plant for automotive electronics in Mexico
Compal Electronics has disclosed plans to set up an assembly plant for automotive electronics products for new energy vehicles in Mexico with mass production scheduled to begin in...
Friday 13 January 2023
Compal looks to non-notebooks for 2023 growth
ODM Compal Electronics has warned its notebook shipments may suffer a decline this year, but shipments for non-notebook applications such as servers, automotive electronics, and wearables...
Friday 13 January 2023
Automotive IC supply shortfall to further narrow in 2H23
Automotive IC supply will remain constrained in 2023, but the shortfall will further narrow in the second half, according to industry sources.
Thursday 12 January 2023
TSMC considers making automotive chips in Europe, boosts mature node overseas capacity in 5 years
For the first time, TSMC CEO C. C. Wei confirmed in the Q4 earnings conference call on Jan 12 that it is engaging with customers and partners to evaluate the possibility of building...
Thursday 12 January 2023
Taiwan semiconductor talents favored by international IDMs, IC distributors
Taiwan's semiconductor professionals are highly relied on by international IDMs and IC distributors as a result of their advantages such as excellent system design capability, quick...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.