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NEWS TAGGED AUTOMOTIVE
Thursday 28 October 2021
Yageo sees mixed prospects for specialty, commodity passive components
Taiwan's leading passive components maker Yageo continues to enjoy strong demand for automotive and industrial applications, but its capacity utilization rate for commodity offerings...
Thursday 28 October 2021
AI assistant empowers future of cars: Interview with Inago founder & CEO Ron Di Carlantonio
The well-established automotive industry is evolving very fast to electrify vehicles for the goal of net-zero carbon emissions. The electric revolution also redefines the concept...
Wednesday 27 October 2021
Software, semiconductor two major advantages for Taiwan to enter EV sector, says Foxconn chair
While EV is emerging as a new market arena for global automakers and tech players, Taiwan can take advantage of its strong prowess in software and semiconductor sectors to build a...
Wednesday 27 October 2021
PTI readies measures against SK Hynix-Intel NAND buyout deal
Memory and logic IC backend house Powertech Technology (PTI) expects its revenue performance to stay on the growth track in the fourth quarter of 2021 after posting record sales results...
Wednesday 27 October 2021
Leadframe supplier CWTC expects bright prospects for 4Q21 and beyond
Chang Wah Technology (CWTC) expects the overall leadframe demand for IC packaging to continue outpacing supply thanks to robust growth momentum for automotive ICs, networking chips...
Wednesday 27 October 2021
Foundry prices to continue rising in 2022, says PSMC chairman
Pure-play foundries will remain encouraged to raise their quotes in 2022, according to Frank Huang, chairman for Taiwan-based foundry Powerchip Semiconductor Manufacturing (PSMC).
Tuesday 26 October 2021
LG ADAS front camera module to be used in new Mercedes C-Class
LG Electronics has announced that its advanced driving assistance system (ADAS) front camera module will be made available in the new Mercedes-Benz C-Class. The camera module, which...
Tuesday 26 October 2021
Quartz component suppliers see clear order visibility through 1H22
Taiwan-based quartz component suppliers including Harmony Electronics, Siward Crystal Technology, Tai-Saw Technology, Taitien Electronics and TXC continue to see brisk order visibility...
Tuesday 26 October 2021
Mixed sales performance seen for different chip segments in 2022
IC design houses will see mixed business results for different chip segments in 2022. Vendors of automotive chips, Ethernet controllers, Wi-Fi chips and other networking ICs will...
Monday 25 October 2021
OSATs to see strong backend orders for car-use MCUs in 2022-2023
International IDMs are set to raise quotes for automotive MCUs in 2022, and their backend partners in Taiwan are all expected to sustain robust backend momentum through 2022-2023...
Friday 22 October 2021
China automaker Geely considers developing ICs in-house
China's Geely Automobile Holdings is reportedly mulling in-house development and production of chipsets for its own vehicles as it has newly expanded its registered businesses to...
Thursday 21 October 2021
Highlights of the day: Automotive chip prices set to rise
Automotive IDMs have already told their clients that their chip prices will go up by 10-20% starting 2022 amid rising...
Thursday 21 October 2021
ASML gearing up for EUV equipment boom
With Intel announcing plans to adopt ASML's high-NA EUV machines in its post-nanometer process technology that is expected to be ready for production by 2025, ASML has disclosed it...
Thursday 21 October 2021
IC design houses see clients increasingly reluctant to accept price hikes
Taiwan-based IC design houses, particularly those engaged in consumer ICs, have come under increasing pressure to maintain their quotes for 2022 as customers are more reluctant to...
Thursday 21 October 2021
Automotive IDMs to raise chip prices by 10-20% in 2022
Automotive IDMs have notified their clients about 10-20% price hikes for their chips starting 2022 as they continue to face mounting costs for raw materials, according to industry...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.