DIGITIMES news archive

Total: 512 items

Commentary: AI memory boom turns WF6 squeeze into an opening for CXMT

Tuesday 16 June 2026

The semiconductor supply chain is facing another raw material shock — this time from tungsten hexafluoride, or WF6, a specialty gas used in chip manufacturing....

Tags

Commentary: TSMC's pricing power stays intact as AI demand keeps fabs full

Thursday 11 June 2026

Market chatter about TSMC has intensified, with reports that its advanced process and packaging prices will rise again in the second half of 2026 and 2027, while some Google TPU production could shift to Intel, and some...

Tags

TSMC demand price packaging advanced process

Commentary: YMTC, CXMT relisting shows US-China tech controls are moving beyond chips

Wednesday 10 June 2026

YMTC and CXMT have returned to Washington's Chinese Military Companies list, placing China's two leading memory chipmakers back at the center of US scrutiny over semiconductors, military-civil fusion, and China's...

Tags

CXMT YMTC Entity List chips robotics US-China trade war

Analysis: E-paper moves beyond the shelf into smart mobility at COMPUTEX 2026

Tuesday 9 June 2026

At COMPUTEX 2026, e-paper moved beyond e-readers and electronic shelf labels, finding new applications in vehicles, signage, and smart mobility. The technology's expansion signals a widening role in low-power displays...

Tags

e-paper 2026 smart mobility retail BMW

Exclusive: TSMC SoIC deepens AI chipmaker lock-in while Huawei hits process wall

Monday 1 June 2026

The global semiconductor industry is at an inflection point, split between those who can still shrink transistors and those who can no longer do so. US export controls and the denial of EUV lithography equipment have...

Tags

Huawei TSMC DIGITIMES SoIC 3D

Analysis: Huawei's Tau Law masks a bigger target — TSMC's node gap and Nvidia's compute moat

Monday 1 June 2026

Huawei's Tau Law is being framed in China as a new semiconductor principle, but its strategic value may lie beyond catching TSMC in process nodes. The real question is whether Huawei can combine LogicFolding, optical...

Tags

Huawei TSMC Nvidia manufacturing chips

Analysis: ASIC market tightens as capacity becomes key battleground for cloud chips

Friday 29 May 2026

Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply tighten worldwide. For readers across...

Tags

ASIC Cloud chips capacity demand

Analysis: Huawei's Tau Law signals a new semiconductor framework — with implications beyond China

Tuesday 26 May 2026

As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced "Tau (τ) Law" and a related...

Tags

Huawei semiconductor industry transistor technology development

Column: US summit signals shift to trusted supply chains, reshaping global manufacturing partnerships

Monday 25 May 2026

At the 2026 SelectUS Investment Summit in Maryland, US officials used the flagship investment forum to outline a national industrial strategy prioritizing supply chain reconstruction and alliances, casting manufacturing...

Tags

USA manufacturing investment supply chain 2026

Commentary: Trump's Taiwan chip claim tests TSMC's silence

Thursday 21 May 2026

US President Donald Trump, after recently concluding a visit to China, again publicly accused Taiwan of having "stolen our chip industry." This was not the first time he had made such a claim. From the 2024 campaign...

Tags

Taiwan IC manufacturing TSMC Donald Trump Geopolitics

Commentary: China builds its memory twin engines; IPO push for YMTC, CXMT intensifies

Thursday 21 May 2026

China's memory chip industry is entering a critical capital markets phase, with YMTC formally launching IPO counselling and CXMT resuming its STAR Market listing review after...

Tags

YMTC CXMT IPO DRAM NAND

Commentary: China hardens AI self-reliance push after Trump-Xi talks

Wednesday 20 May 2026

After the Trump-Xi meeting in Beijing, China's senior leadership has stepped up inspections of artificial intelligence, smart manufacturing and computing infrastructure, offering a clear signal of where Beijing wants...

Tags

Beijing technology infrastructure chips policy

Commentary: Sanctions reshaped China's foundry sector — just not in the way markets expected

Tuesday 19 May 2026

China's foundry sector is charting a different course as the global semiconductor market remains focused on AI GPUs, the 2nm process node, and advanced packaging. Led by Semiconductor Manufacturing International (SMIC)...

Tags

SMIC demand market capacity revenue

Commentary: SEA semiconductor industry pivots towards AI as a strategic hub

Tuesday 12 May 2026

SEMICON SEA 2026 drew heavy crowds, underscoring Southeast Asia's emergence as an indispensable "strategic hub" in the global AI compute supply chain. The region's semiconductor players are now moving from "capacity...

Tags

Asia 2026 supply chain equipment technology

Interview: Cyient Semiconductors CEO on Kinetic acquisition — why power is the new compute bottleneck

Tuesday 12 May 2026

As the semiconductor industry grapples with the growing energy demands of artificial intelligence, Cyient Semiconductors is repositioning itself away from being a primarily semiconductor engineering and ASIC services...

Tags

India semiconductor industry acquisition ASIC infrastructure

Commentary: Trump-Xi Summit puts Taiwan's chip industry at center of global politics

Friday 8 May 2026

US President Donald Trump is expected to visit Beijing on May 14-15 for a summit with Chinese President Xi Jinping. If the trip proceeds as planned, it would mark Trump's...

Tags

Donald Trump Xi Jinping China USA Taiwan

TeraFab is already changing the semiconductor landscape — before a single chip is made

Friday 1 May 2026

Elon Musk has a habit of building what he cannot buy.

Tags

Tesla manufacturing AI chip Intel TSMC

Analysis: Taiwan's two major panel makers enter semiconductor packaging; CPO and FOPLP become key

Wednesday 29 April 2026

Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level to panel-level, bringing...

Tags

CPO FOPLP packaging AUO Innolux panel Taiwan

Analysis: ASML lifts 2026 guidance on strong EUV demand

Friday 17 April 2026

ASML delivered first-quarter 2026 results that exceeded expectations, prompting management to raise its full-year guidance despite a cautious outlook for the second quarter. The company announced plans to expand its...

Tags

ASML 2026 demand EUV guidance

Commentary: US MATCH Act tightens chip tool controls as China builds local supply chain

Wednesday 8 April 2026

At SEMICON China 2026, Applied Materials and ASML kept a low profile under tightening US export controls, while domestic Chinese suppliers dominated visibility and floor presence.

Tags

2026 SEMICON China equipment Applied Materials ASML

1/26 pages

Date range

News overview

Relevant articles

Beta — AI answers are generated from DIGITIMES content by relevancy and available date ranges.
They may contain errors or miss the latest updates. Please verify critical information. Contact us if you experience issues.

Syntax	Example	Finds articles containing
AND && A B	Intel AND AMD Intel && AMD Intel AMD	"Intel" and "AMD"
OR \|\|	Intel OR AMD Intel \|\| AMD	"Intel" or "AMD"
NOT !	Intel NOT AMD Intel ! AMD	"Intel" but not "AMD"
"A B"	"Smart TV"	Phrase "Smart TV"
("A B" OR C) AND D NOT X	("Smart TV" OR panel) AND maker NOT Taiwan	Multiple terms form a complex query combined together with Boolean operators