DIGITIMES news archive

Total: 84 items

Global market for advanced chip packaging set for rapid expansion

Wednesday 24 June 2026

The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global readers, the shift could shape future...

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TSMC glass substrate rollout unlikely before 2030

Monday 22 June 2026

The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in...

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TSMC DIGITIMES glass substrate 2030 Intel

Global suppliers race accelerates: TSMC's first CoPoS demo tools enter validation

Monday 22 June 2026

TSMC is accelerating its CoPoS rollout, replacing traditional round wafers with larger rectangular glass panels to support packaging demand for AI GPUs and HPC chips over the next several years. Supply chain sources...

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TSMC CoPoS packaging equipment demand

TSMC reportedly teams with Ibiden, Innolux to push CoPoS, glass substrates

Tuesday 16 June 2026

TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The...

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TSMC Innolux Ibiden packaging CoWoS

TSMC PLP timeline faces skepticism from Taiwan industry sources

Tuesday 16 June 2026

A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has drawn skepticism from Taiwan industry...

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TSMC Taiwan packaging production FOPLP

CoPoS and FOPLP accelerate as Manz delivers its first 310mm electrochemical deposition equipment

Monday 15 June 2026

Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD)...

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Manz equipment FOPLP packaging TSMC

AI servers and MLCC recovery drive growth at Ample Electronic

Friday 5 June 2026

As artificial intelligence fuels demand across the electronics supply chain, Taiwanese conductive paste supplier Ample Electronic is seeing a rebound in one of the industry's most overlooked segments: passive components.

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Ample Electronic AI server MLCC demand growth recovery

TSMC chair says CoPoS could scale within years while downplaying risk from Terafab

Thursday 4 June 2026

Taiwan Semiconductor Manufacturing Co. (TSMC) told shareholders on June 4 that the AI surge is creating major opportunities, but also leaving TSMC with the bulk of the investment and operating burden. Chairman C.C. Wei...

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TSMC CoPoS investment fab Taiwan

AEM targets semiconductor and AI markets, begins sampling anti-warpage film and PTFE materials

Tuesday 19 May 2026

Flexible copper clad laminate (FCCL) manufacturer Asia Electric Material (AEM) said that its long-term investment in new product development has begun to yield results, with the company's operational focus shifting...

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FCCL materials substrate 2026

TSMC SVP: better AI days lie ahead, remember the keyword 'COUPE'

Thursday 14 May 2026

Taiwan Semiconductor Manufacturing Co. (TSMC) used its 2026 Technology Forum on May 14 to outline a sweeping view of the AI-driven transformation in semiconductors. Co-COO and senior vice president Kevin Zhang argued...

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TSMC optical components packaging demand 2026

TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead

Friday 8 May 2026

TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to widen its lead over rivals in the AI...

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TSMC packaging CoWoS expansion capacity

ASE raises 2026 capex to record US$8.5 billion on strong advanced packaging demand

Thursday 30 April 2026

ASE Technology Holding Co. raised its 2026 capex plan to as much as US$8.5 billion as demand for advanced packaging and testing services exceeded expectations, the company said.

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ASE packaging 2026 demand capex

US chip packaging capacity to hit 10% by 2032

Tuesday 28 April 2026

The Trump administration continues to push for reshoring the semiconductor industry to the US. As global foundry giants TSMC, Intel, and Samsung Electronics expand advanced manufacturing capacities stateside,...

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capacity packaging OSAT reshoring TSMC

TSMC's refusal of ASML's expensive High-NA EUV equipment, explained

Monday 27 April 2026

ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first, but the company has held back. TSMC...

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TSMC ASML High-NA EUV equipment

TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker

Friday 24 April 2026

The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate (CoWoS) and...

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TSMC equipment packaging Taiwan ASE

ASE's CoPos advanced packaging accelerates as Skytech and CMIt boost equipment deliveries

Sunday 19 April 2026

AI and high-performance computing (HPC) are driving increasingly stringent chip performance demands, marking a pivotal shift in advanced packaging technology from traditional wafers to large-size panels. Semiconductor...

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equipment HPC packaging Skytech ASE

TSMC revises advanced process and packaging strategy

Friday 17 April 2026

TSMC chairman C.C. Wei emphasized persistent capacity shortages during the company's earnings call, noting that 3nm technology accounted for about 25% of first-quarter 2026 revenue. New 3nm production capacities will...

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TSMC fab 3nm packaging production

TSMC chairman C.C. Wei denies customer favoritism regarding tight 1Q26 capacity

Friday 17 April 2026

TSMC delivered an above-expectations financial performance in the first quarter of 2026 and remains optimistic about continued strong demand for advanced process technologies entering the second quarter. Regarding tight...

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TSMC capacity demand Taiwan

Global Expansion of 2.5D/3D Packaging: Strategic Moves in the US, Asia, and Beyond

Thursday 16 April 2026

... production. TSMC also plans to introduce more advanced packaging technologies, including CoPoS and System on Integrated... introducing CoPoS and SoIC technologies to meet strong customer demand. If US permitting proceeds smoothly, civil construction...

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packaging Asia demand capacity production

ASE accelerates panel-level packaging push with fully automated 310mm line by 2026

Wednesday 25 February 2026

AI and high-performance computing chip demand continue to expand, keeping TSMC's CoWoS capacity tight into 2026. The supply constraint is pushing Taiwan's major OSAT providers, including ASE Holdings, SPIL and PTI...

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packaging ASE 2026 demand panel

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