Long-term prospects are bright for advanced packaging technology, thanks to robust demand for AI and HPC chips, according to sources at backend houses.

Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...

The importance of advanced packaging to the continuation of Moore's Law has already attracted TSMC and Intel to the field.

AMD plans to incorporate TSMC's 3D SoIC (system on integrated circuits) stacking and chiplet packaging technology into its gaming notebook processors, following the company's implementation...

TSMC's 3D Fabric advanced packaging and testing plant, AP6, has officially started operation. Advanced packaging and testing providers have indicated that the 3D Chiplet and System-on-Integrated-Chip...

TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking.

At its 2023 North America Technology Symposium, TSMC showcased progress in its 2nm technology and new 3nm process variants, including an improved N3E.

Nvidia is expected to use TSMC's 3D SoIC (system on integrated chips) stacking and chiplet packaging technology in its high-end processors set to debut between 2024 and 2025, according...

Though TSMC is building advanced wafer fabs in the US, Taiwanese OSAT companies still have concerns about constructing facilities there to provide cutting-edge packaging services...

TSMC expects to scale up its advanced packaging production capacity in 2022, which will be 300% greater than that in 2018, and to further boost the output by 2026 thanks to the commercialization...