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Tuesday 2 June 2026
KYEC chair CK Lee steps down; vice chair Chi-chun Hsieh takes over
Semiconductor testing company King Yuan Electronics (KYEC) recently convened its 2026 shareholders' meeting, during which it completed the election of nine board directors. Longtime...
Tuesday 2 June 2026
Commentary: Intel turns AI packaging crunch into foundry comeback test
Intel's foundry revival may depend less on beating TSMC at the most advanced process nodes than on whether it can turn AI-driven demand into a profitable advanced packaging busines...
Tuesday 2 June 2026
Analysis: Advanced packaging shifts from TSMC dominance to industry collaboration
Nvidia CEO Jensen Huang has repeatedly backed TSMC's price hikes, saying its advanced process and supply-chain services are difficult and highly valuable. As AI chip demand surges,...
Monday 1 June 2026
MediaTek highlights supply chain advantage, says focus with Nvidia is product cooperation
MediaTek held a pre-Computex 2026 media event in Taipei, Taiwan, on May 29, after which president and COO Joe Chen and CFO and co-COO David Ku spoke with reporters. Ku shared his views...
Sunday 31 May 2026
AI demand and chip investment lift Taiwan exports and business outlook
Taiwan's economic outlook improved in April 2026 as rising AI demand and receding Middle East geopolitical risks boosted manufacturers' business sentiment, the National Development...
Friday 29 May 2026
Analysis: ASIC market tightens as capacity becomes key battleground for cloud chips
Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply...
Tuesday 26 May 2026
Chiplet boom puts Taiwan's InPsytech and its AI connectivity IPs in the spotlight
As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die —...
Tuesday 26 May 2026
Intel's Rio Rancho fab becomes test case for AI-era chip packaging
Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions...
Thursday 21 May 2026
Texas Instruments sues former exec over trade secret theft at GlobalFoundries
Bloomberg reports that Texas Instruments (TI) has sued former vice president Kannan Soundarapandian, alleging he joined GlobalFoundries without fully disclosing his new employer...
Thursday 14 May 2026
TSMC expands CoWoS and SoIC capacity on AI boom
TSMC said on May 14, 2026, that it is rapidly expanding CoWoS and SoIC advanced packaging capacity as AI demand drives the construction of 18 new fabs and advanced packaging facilities...
Tuesday 12 May 2026
TSMC's US and Japan expansion lifts Trusval
Taiwan-based semiconductor facility engineering firm Trusval reported strong results for the first quarter of 2026, supported by continued growth in global AI computing demand, TSMC's...
Thursday 7 May 2026
Intel targets entry-level advanced packaging, draws interest from Google and Amazon
Over the past decade, market assessments of Intel have largely been confined to a single lens: execution in advanced process technology. By that metric, Intel has struggled, with delays...
Wednesday 29 April 2026
Commentary: How TSMC anchors Taiwan's semiconductor supply chain from within
As competition in the semiconductor industry intensifies, TSMC maintains its lead while actively supporting the domestic supply chain. In recent years, driven by the need for cost...
Tuesday 28 April 2026
US chip packaging capacity to hit 10% by 2032
The Trump administration continues to push for reshoring the semiconductor industry to the US. As global foundry giants TSMC, Intel, and Samsung Electronics expand advanced manufacturing...
Tuesday 28 April 2026
AI chip testing complexity lifts probe card and upstream supply chain demand
As AI chips move to advanced process nodes and packaging technologies, semiconductor testing requirements are becoming significantly more complex.