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NEWS TAGGED ADVANCED PROCESS
Thursday 5 February 2026
Arm pushes compute subsystems as chip design complexity grows
Arm Holdings executives highlighted a growing focus on integrated compute subsystems during the company's latest earnings call, as rising chip design complexity reshapes customer requirements...
Tuesday 3 February 2026
Alchip, GUC, and Faraday eye 2026 growth on US CSP chip orders
Alchip, Global Unichip (GUC), and Faraday each hold unique strengths as leading ASIC design service providers. Benefiting from major US cloud service providers' (CSPs) push for in-house...
Thursday 29 January 2026
In-depth: DeepSeek's one-year breakthrough shows how China builds AI without cutting-edge chips
In January 2025, while the global AI and semiconductor industries remained focused on advanced process nodes and high-performance GPUs, China's large-scale model DeepSeek-R1 emerged...
Thursday 29 January 2026
Scientech's growth signals shift in semiconductor investment toward packaging and system integration
As artificial intelligence (AI) and high-performance computing (HPC) expand rapidly, the global semiconductor industry is redirecting investments from advanced process nodes to advanced...
Wednesday 28 January 2026
Exclusive: Nvidia to reportedly shift 2028 chip production to Intel, reshaping TSMC strategy
TSMC's dominance in advanced process and packaging has made it a prime target amid US manufacturing mandates. Chip customers now face mounting pressure to diversify supply chains due...
Tuesday 27 January 2026
TSMC and Nvidia ignite AI growth, Taiwan supply chain accelerates expansion
With strong demand for AI servers, TSMC—holding the vast majority of AI chip orders—is executing major expansions in advanced process technology and packaging capacity...
Tuesday 27 January 2026
Apple, Qualcomm rethink heavy reliance on TSMC as costs rise

Even as TSMC retains a clear technological lead in advanced process nodes, Apple and Qualcomm are reassessing how heavily they rely...

Thursday 22 January 2026
Cloud ASIC shipments set to surge in 2026; memory capacity remains key risk
2026 is shaping up as a breakout year for cloud application-specific integrated circuit (ASIC) shipments. Not only has Broadcom secured mass production projects with multiple major...
Tuesday 20 January 2026
Strategies and deployment of edge AI chip startups

Introduction

Friday 16 January 2026
TSMC predicts rising advanced process costs; consumer SoCs may struggle to keep up
At its earnings call on January 15, 2026, TSMC signaled that its capital expenditures for 2026 will increase to US$52-56 billion, far exceeding market expectations. On top of demand...
Friday 9 January 2026
MA-tek reports higher December and full-year revenue driven by AI chip and advanced process demand
Taiwan-based semiconductor testing firm MA-tek announced December 2025 revenue of NT$501 million (approx. US$15.91 million), marking a 2.7% increase from November and a 10.65% rise...
Tuesday 6 January 2026
CES 2026: Intel's 18A Panther Lake narrows the gap between iGPUs and discrete graphics
At CES 2026, Intel unveiled its first mobile processor built on the 18A advanced process node, the Core Ultra Series 3, code-named Panther Lake. The launch marks Intel's first large-scale...
Tuesday 6 January 2026
Chinese chipmakers confront yield challenges despite localization push
China is speeding up efforts to localize its semiconductor supply chain to overcome US restrictions on high-end technology exports. Supply chain sources acknowledge that while Chinese...
Wednesday 24 December 2025
TSMC's N-2 restrictions hand Samsung US advanced chip opening
Samsung Electronics is poised to capitalize on US demand due to Taiwan's N-2 policy restricting TSMC's advanced process transfers and its capacity being booked by Apple and Nvidia...
Thursday 18 December 2025
Rising memory and wafer costs to weigh on 2026 smartphone shipments, Counterpoint Research says
The smartphone market is expected to contract in 2026 as rising costs for memory and advanced process wafers drive manufacturers to reconsider pricing and specifications, according...