DIGITIMES news archive

Total: 145 items

From ISM 1.0 to Semicon 2.0—India's chip subsidy overhaul draws early interest, raises the bar for investors

Friday 25 September 2026

India's new semiconductor incentive regime is putting more capital at risk for manufacturers, but the first wave of investment commitments suggests lower subsidies have not stopped companies from considering fresh...

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Interview: Advanced packaging shifts toward system-level co-design for AI

Saturday 19 September 2026

Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged optics (CPO), chiplets, and glass...

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packaging Taiwan 2026 technology materials

Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line

Saturday 12 September 2026

Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains traction, Resonac CTO for...

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Resonac materials packaging equipment coating

Analysis: Imec's EUV edge raises question over how far Taiwan should replicate research fab model

Tuesday 8 September 2026

If Taiwan's government is determined enough, finding funding and land for the Industrial Technology Research Institute (ITRI) or the National Institutes of Applied Research (NIAR) is not necessarily the hardest part....

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IMEC EUV fab ITRI government Taiwan

Exclusive Interview: Turning scale into value — AUO chair's post-LCD ambition

Saturday 29 August 2026

Price wars. Capacity races. Years of losses steep enough to earn a lasting nickname.

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AUO panel Taiwan display solar

Manz Asia says yield is key to glass core mass production

Saturday 22 August 2026

As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies including FOPLP, CoPoS, and Glass...

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Manz Asia Advanced Packaging equipment production

Interview: QuantumDiamond's EU-backed quantum leap in chip inspection lands in Taiwan

Friday 17 July 2026

The global tech landscape is currently dominated by two massive tides: the race for semiconductor supremacy and the long-promised dawn of the quantum era. While quantum...

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Quantum IC inspection startup Germany Taiwan

Exclusive Interview: Dutch startup Nearfield targets AI chip process control expansion after US$380 million funding round

Monday 6 July 2026

Dutch semiconductor equipment startup Nearfield Instruments has completed a US$380 million Series D funding round, the largest-ever fundraising for a Dutch deep-tech company. The company is now targeting an initial...

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Dutch funding AI chip process control expansion

Interview: MicroLED and SiPh eye 3.2T AI data race

Thursday 18 June 2026

The AI wave is rapidly reshaping the global semiconductor supply chain, and that upheaval is opening a new growth chapter for Taiwan's LED industry. As Taiwan's LED makers move away from the price wars of the consumer...

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microLED SiPh CPO optical communications supply chain Taiwan

Commentary: How TSMC anchors Taiwan's semiconductor supply chain from within

Wednesday 29 April 2026

As competition in the semiconductor industry intensifies, TSMC maintains its lead while actively supporting the domestic supply chain. In recent years, driven by the need for cost reduction, breaking international...

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TSMC supply chain competition Taiwan semiconductor industry

Analysis: Taiwan's two major panel makers enter semiconductor packaging; CPO and FOPLP become key

Wednesday 29 April 2026

Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level to panel-level, bringing...

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CPO FOPLP packaging AUO Innolux panel Taiwan

Interview: Seiko Epson outlines engineered future vision for 2035 amid geopolitical challenges

Thursday 23 April 2026

Amid volatile geopolitical tensions affecting Japan's components, manufacturing, and end-user sectors, Seiko Epson unveiled its Engineered Future 2035 long-term vision. The plan aims to shift Epson from a traditional...

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Seiko Epson investment manufacturing inkjet printer technology

Interview: AI compute startup TBC details biological computing platform linking living neurons and machine learning

Friday 17 April 2026

In an era where AI systems are rapidly scaling beyond the limits of traditional silicon, new experimental companies are beginning to question what "compute" itself should look like. One of the most unusual entrants is...

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machine learning startup efficiency performance silicon

Commentary: US MATCH Act tightens chip tool controls as China builds local supply chain

Wednesday 8 April 2026

At SEMICON China 2026, Applied Materials and ASML kept a low profile under tightening US export controls, while domestic Chinese suppliers dominated visibility and floor presence.

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2026 SEMICON China equipment Applied Materials ASML

DIGITIMES Insight: TSMC's swelling facilities budget signals a global capacity race

Thursday 19 February 2026

When chipmakers spend big, it is usually the machines that cost the most. Process equipment — the lithography tools, deposition systems, and etch chambers that define the bleeding edge of semiconductor...

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TSMC DIGITIMES 2026 budget equipment

Commentary: NSTC chief’s reform remarks ignite debate over Taiwan’s research metrics

Friday 13 February 2026

Minister of the National Science and Technology Council (NSTC) Cheng-wen Wu has recently sparked a firestorm across Taiwan's academic community. His blunt critique of long-standing structural problems—punctuated...

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Taiwan NSTC academia

Analysis: How Singapore turns talent, R&D into an optics edge

Tuesday 10 February 2026

Despite possessing a land area roughly one-fiftieth the size of Taiwan, Singapore has established itself as one of the most closely watched economies and supply chain hubs in Asia. This ascent is the result of a...

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optics talent Taiwan Asia education

Commentary: Taiwan secures most-favored-treatment with tariffs but loses investment edge in China and Vietnam

Wednesday 21 January 2026

On January 16, 2026, Taiwan and the US finalized a trade agreement that cuts tariffs on Taiwanese exports to the US to 15% without stacking. The US also pledged most-favored-nation status and duty-free quotas for Taiwan...

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Taiwan exports USA Tariffs 2026

Column: Macroscopic quantum tunneling discovery redefines limits of quantum mechanics and fuels quantum technology advances

Thursday 16 October 2025

The 2025 Nobel Prize in Physics has been awarded to John Clarke, Michel Devoret, and John Martinis for their groundbreaking experimental work demonstrating macroscopic quantum tunneling, a phenomenon showing that...

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Quantum technology 2025

Commentary: Would splitting semiconductor profits with US leave Taiwan with scraps?

Monday 13 October 2025

Taiwanese President Ching-te Lai remarked that the US takes 80% of semiconductor profits. While TSMC leads in manufacturing, US firms dominate IC design. The US seeks a balanced production split with Taiwan, but Taiwan...

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Taiwan USA TSMC chips equipment manufacturing production

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