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NEWS TAGGED IC
Friday 30 July 2021
Primax expects acoustic components sales to drive 3Q21 growth
Primax Electronics has expressed optimism about its operations in the third quarter of 2021, citing robust growth of its acoustic components sales.
Friday 30 July 2021
IC unit shipments to surge 21% in 2021
IC unit shipments are forecast to surge 21% in 2021, following an 8% increase in 2020 and a 6% drop in 2019, according to IC Insights.
Friday 30 July 2021
IC backend sector to see new supply-demand balance in 2023, says ASE Technology
ASE Technology expects the IC backend sector not to reach a new balance between supply and demand until 2023 at the earliest, and it has landed some long-term orders set for fulfillment...
Thursday 29 July 2021
MediaTek terminates deal to acquire assets related to PWM IC from Intel
MediaTek has announced that on behalf of subsidiary Richtek Technology, its agreement with Intel to acquire assets related to the power management solutions product line sold under...
Thursday 29 July 2021
CHPT expects revenue increases through 4Q21
Taiwan-based IC test solutions provider Chunghwa Precision Test Tech (CHPT) expects to post sequential revenue increases through the fourth quarter of 2021, buoyed by growing demand...
Wednesday 28 July 2021
IC substrate maker Kinsus posts 2-fold profit jump in 2Q21
IC substrate maker Kinsus Interconnect Technology saw its net profits for second-quarter 2021 shoot up 202% on year to NT$1.01 billion (US$36.1 million), thanks to substantial improvements...
Wednesday 28 July 2021
Foxconn installs advanced packaging equipment at China plant
Foxconn Technology (Hon Hai Precision Industry) has started installing equipment including lithography systems for high-end IC packaging at its chip plant in Qingdao, northeast China,...
Wednesday 28 July 2021
PTI raises capex outlook for 2021
Logic and memory IC backend house Powertech Technology (PTI) has revised upward its capex target this year to NT$17 billion (US$606.05 million) from the NT$15 billion estimated pre...
Wednesday 28 July 2021
Taiwan analog IC firms poised to raise prices
Taiwan-based analog IC suppliers all intend to follow in the footsteps of their bigger international peers and raise their chip quotes, according to industry sources.
Tuesday 27 July 2021
Realtek guardedly optimistic about 3Q21 business
Networking IC specialist Realtek Semiconductor has said that it remains guardedly optimistic about its business prospects for the third quarter of 2021 as demand for its products...
Tuesday 27 July 2021
Lead times at TI still long, sources say
Industry sources have expressed doubts about Texas Instruments' less optimistic outlook for the third quarter, given the still prolonged lead times at the analog IC vendor.
Tuesday 27 July 2021
Supply constraints of memory controller ICs to remain in 2022
The persistent tight supply of controller ICs for memory devices, particularly those built using a 28nm process node, will stretch into the end of 2022, with related suppliers expecting...
Monday 26 July 2021
IC materials distributor CWE to transform into manufacturer
Chang Wah Electomaterials (CWE), after building a solid presence in the distribution of semiconductor materials, is on track to transform into a manufacturer of diverse materials...
Monday 26 July 2021
China top-3 OSATs to see combined revenue climb over 20% in 2021, says Digitimes Research
China's top-3 OSAT providers - Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Huatian Technology - are expected to see their combined revenue surge...
Monday 26 July 2021
UMC to raise quotes for 40nm, other processes in 1Q22
United Microelectronics (UMC) plans to raise its foundry quotes for 40nm process technology by 10-15% starting the first quarter of 2022, as well as quotes for other mature process...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.