Leading-edge processes, defined as sub-28nm technologies, accounted for the largest portion in terms of monthly installed capacity available in 2015. By the end of 2019, sub-28nm...

IC materials analysis specialists Integrated Service Technology (iST) and Material Analysis Technology (MA-tek) are expected to maintain their sales momentum in the fourth quarter...

TSMC has already seen its 16nm chip supply fall short of demand, with longer delivery lead times, according to sources at IC design service companies.

United Microelectronics (UMC) saw its September revenues decline 17.9% sequentially, while revenues at Vanguard International Semiconductor (VIS) increased nearly 2% on month.

The global IC foundry industry output value will grow by a CAGR of 5.3% to reach US$75.42 billion in 2024, the final year of a five-year forecast period, driven by chip demand for...

LCD driver IC design specialist Novatek Microelectronics is expected to enjoy a strong fourth-quarter 2019, thanks to continued ramp-up in TDDI chip shipments, coupled with revenues...

Taiwan-based IC distributors WPG Holdings and WT Microelectronics have disclosed that they will discontinue their Texas Instruments (TI) chip and component offerings starting from...

Niche-market IC packaging house Xintec is eyeing its return to profitability this year, according to industry observers.

Taiwan-based GaAs IC foundries and epitaxial wafer suppliers are set to enjoy strong sales in the fourth quarter of 2019 and beyond, driven by robust demand for VCSEL and PA (power...

Taiwan-based IC test solutions providers Chunghwa Precision Test Tech (CHPT) and Keystone Microtech have both seen orders for 5G SoC and other related chips ramp up substantially...

TSMC and other major Taiwanese IC backend service providers including ASE Technology and Powertech Technology (PTI) are ready to offer, or have exerted efforts to develop, AiP (antenna-in-package)...

Taiwan's IC design ability is currently leading China by at least 10 years, but the Ministry of Science and Technology (MOST) will continue to allocate more budget for basic research...

Backend house Powertech Technology (PTI) plans to invest up to US$200 million to expand production capacity for high-end logic chips at its Suzhou (China) plant, according to market...

In the era of heterogeneous chips integration, Taiwan Semiconductor Manufacturing Company (TSMC) is expected be among global top-3 players in the advanced 3D IC packaging field along...

Entegris and Gudeng Precision Industrial, both of which have received ASML certification for their reticle pods for high-volume IC manufacturing using extreme ultraviolet (EUV) lithography,...

Several leaders from semiconductor firms and organizations have paid a visit to Taiwan's president Tsai Ing-wen, asking the government to tackle the two biggest issues facing the...

Wafer test solution provider Chunghwa Precision Test Tech (CHPT) has announced the development of over-the-air (OTA) test solutions for mmWave 5G devices, including mmWave antenna-in-package...

After slowing in the past couple years, semiconductor merger and acquisition activity strengthened in the first eight months of 2019, according to IC Insights.

The Foxconn Group's development direction in the semiconductor industry will primarily focus on vertical integration, aiming to become a solution provider and devoting its investments...

Moore's Law will continue to drive semiconductor industry growth in decades to come, but Taiwan's IC sector is in need of sufficient engineers to support its development, according...

Powertech Technology (PTI) with its fan-out panel-level packaging (FOPLP) technology has obtained orders for high performance computing (HPC) solutions designed for AI and networking...

Huawei is stepping up purchases of IC substrates from its Taiwan-based suppliers, including Unimicron Technology and Nan Ya PCB, according to industry sources.

Leading IC backend house ASE Technology Holding will have its fan-out (FO) packaging technology ready in 2020 at the earliest for volume production of mmWave antenna-in-package (AiP)...

As 7nm and more-advanced process nodes are increasingly applied to fabricating high-performance computing (HPC) CPUs and GPUs, demand for high-end IC sockets for SLT (system level...

With global market demand on a moderate increase in second-quarter 2019, Taiwan-based semiconductor foundries showed recovery. Taiwan Semiconductor Manufacturing Company (TSMC), United...