The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly...

TSMC filed the most invention patent applications in Taiwan in the third quarter of 2023, with 443 cases, topping the domestic list for the same period for eight consecutive years,...

Japan-based Resonac, formerly Showa Denko, kicked off volume production of its new-generation 6-inch SiC epi-wafers on March 1, aiming to serve the needs of EVs and other high-end...