At its booth at the China International Optoelectronic Expo (CIOE), Luxshare and its camera-module affiliate Luxvisions showcased the components they believe will define the next generation...
Huawei is emerging as a central organiser of China's effort to build a domestic semiconductor equipment supply chain, backing critical lithography suppliers and helping connect them...
Samsung Electronics has moved to accelerate its silicon photonics push by using the same test partners selected by Taiwan Semiconductor Manufacturing Co. for key validation work, according...
Co-packaged optics (CPO) has officially entered the mass-production deployment stage, but the critical testing processes responsible for safeguarding yield continue to face different...
The 27th China International Optoelectronic Exposition (CIOE 2026) will run September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors from over 30 countries and regions...
As AI processors advance toward higher compute density, larger package footprints, and increased bandwidth demands, advanced packaging and high-speed data transmission have emerged...
AI infrastructure and semiconductor supply chains led reader interest this week, from Taiwan's manufacturing recovery and Nexperia's legal battle to Sandisk's HBF, Micron's HBM expansion,...
AI data center demand is accelerating the shift to faster optical interconnects, putting transmission speed, power efficiency, and packaging integration at the center of next-generation...
Driven by the shift from copper to optical interconnects, silicon photonics (SiPh) and co-packaged optics (CPO) are moving rapidly toward mainstream adoption, fueling demand across...
System integration remains a key hurdle as the AI chip industry pushes for higher power efficiency and faster transmission speeds, drawing intense attention to when short-reach optical...
As silicon photonics (SiPh) and co-packaged optics (CPO) move toward mass production, suppliers say testing is shifting earlier in the process to catch defects at the wafer stage,...
Broadcom Senior Vice President and General Manager of the Core Switching Group Asad Khamisy said at the Semicon Taiwan 2026 master forum that co-packaged optics (CPO) is not necessarily...
AI infrastructure expansion is accelerating demand for 800G and 1.6T optical modules, lifting first-half 2026 results across major Chinese suppliers and extending order visibility...
Marvell SVP and chief technology officer Radha Nagarajan offered a clearer timeline for the commercialisation of co-packaged optics, or CPO, during a media briefing at Semicon Taiwan...
