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Tuesday 3 February 2026
Oracle plans US$50 billion fundraising in 2026, reportedly considering layoffs and asset sales
Oracle announced plans to raise US$45-50 billion in 2026 to expand its cloud infrastructure, aiming to meet demand from major customers including OpenAI, AMD, Meta, Nvidia, TikTok,...
Friday 23 January 2026
Anthropic's funding round oversubscribed as revenue projection surges despite margin squeeze
AI startup Anthropic has secured enthusiastic investor participation in its latest financing round, Bloomberg reported, citing insiders. Originally targeting US$10 billion,...
Friday 23 January 2026
Taiwan-US semiconductor pact's financing details spark interpretation issues with broader industrial implications
Taiwan and the US have agreed to reduce tariffs and grant Taiwan most-favored-nation status under Section 232 for semiconductors and related products. However, a major issue has arisen...
Thursday 22 January 2026
US-Taiwan tariff deal clears key uncertainty for chipmakers, says GlobalWafers chair
GlobalWafers chairwoman Doris Hsu spoke to the media on January 21, outlining the company's current US strategy and sharing her views on the recently finalized US-Taiwan tariff agr...
Thursday 22 January 2026
Taiwan says investment decisions remain with firms, even with US push for local manufacturing
Taiwan's Executive Yuan Vice Premier Li-Chun Cheng and Minister without Portfolio and chief trade negotiator Jen-Ni Yang held a press conference on January 20, 2026, accompanied by...
Monday 19 January 2026
US-Taiwan trade pact clears path for tech supply chain hubs in America
The US and Taiwan have reached a trade breakthrough that lowers reciprocal tariffs to 15% and applies most-favored-nation treatment without stacking, creating new momentum for Taiwanese...
Wednesday 14 January 2026
Cerebras Systems seeks US$1 billion funding round with US$22 billion valuation
AI chip startup Cerebras Systems is reportedly in talks to raise US$1 billion in a new financing round, aiming for a valuation of up to US$22 billion, according to Bloomberg...
Monday 12 January 2026
Samsung reportedly lands US$550 million state loan for chipmaking equipment
Samsung Electronics has reportedly secured KRW800 billion (US$550 million) through a low-interest loan program from the Korea Development Bank, according to sources cited by Korean...
Thursday 8 January 2026
China's 'Neuralink rival' raises US$286 million in BCI funding
China's brain–computer interface (BCI) unicorn BrainCo has completed a funding round of about CNY2 billion (US$286 million), making it the world's second-largest single BCI financing,...
Wednesday 7 January 2026
Tesla rolls out five-year zero-interest push in China as BYD widens EV lead
As 2026 opens, the global electric vehicle (EV) market is entering a pivotal phase. Tesla China has rolled out a five-year, zero-interest financing program covering its core models...
Friday 26 December 2025
Samsung pushing AI, manufacturing, and finance to drive growth in India
Samsung Electronics is prioritizing artificial intelligence adoption, local manufacturing, and consumer financing in India, foregoing an initial public offering for its local business...
Friday 19 December 2025
Japan poised to guarantee 80% of Rapidus chip loans
Japan plans to guarantee up to 80 percent of private-sector loans raised by Rapidus as the government intensifies financial backing for the chipmaker’s plan to mass-produce 2nm...
Wednesday 17 December 2025
SK Hynix taps US$340M state loan to ramp up HBM production
SK Hynix has secured approval for an additional KRW500 billion (US$340 million) in low-interest financing from the state-run Korea Development Bank. The funds will be used to increase...
Friday 12 December 2025
Japan's major banks and corporations back Rapidus with massive financing and new investments
Japan is accelerating its national push to rebuild an advanced semiconductor ecosystem as Rapidus, the country's flagship next-generation chip venture, secures financing from major...
Thursday 4 December 2025
Malaysian bank extends financing to Huawei Malaysia for digital infrastructure
AmBank Group has provided MYR350 million (approx. US$84.74 million) in financing to Huawei Technologies (Malaysia) Sdn Bhd to support the development of Malaysia's digital infrastructure,...