Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies are increasingly turning to...
BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the evening of May 20 that it had signed a...
China's OSAT providers are trying to move deeper into advanced packaging as artificial intelligence (AI) demand strains global chip packaging supply, creating an opening for...
AI server demand is pushing semiconductor packaging into a new growth cycle, but the market remains heavily concentrated among a small group of global outsourced...
Japan's diamond semiconductor sector is moving closer to practical use, as university-backed startups advance factory construction, sample production, and device...
LG Innotek is seeking to enter Tesla's AI semiconductor supply chain by targeting ABF-based FC-BGA substrate orders for the automaker's AI4 chips, intensifying its...
The transition from 800G to 1.6T optical modules is no longer an upgrade cycle — it is a physics-driven inflection point.
Zhen Ding Technology has broken ground on its HD campus at the Huai'an Technology City in China, as it accelerates investment to expand high-end printed circuit board (PCB)...
SaiMemory, a next-generation memory developer established by SoftBank, said on April 22 that its development project has been selected for subsidies by Japan's New Energy...
Samsung Electronics has begun testing domestic EUV blank masks in its 4nm foundry production line, a shift aimed at cutting reliance on Japanese suppliers and tightening...
