India's first wave of OSAT facilities is moving from capacity announcements to competitive positioning, with some domestic players now benchmarking themselves against established...
AOI Electronics, a Japan-based semiconductor assembly and test provider, has entered into a business alliance with India's Kaynes Semicon Private Limited and Japan's Mitsui to support...
India's semiconductor sector has increasingly turned to cross-border acquisitions and investments, reflecting a broader push to accelerate technology capabilities and integrate into...
Apple is reportedly in preliminary talks with Indian chip manufacturers to assemble and package components for the iPhone, potentially marking a first step in shifting part of its...
As major US CSPs are ramping up ASIC development, the capacity gap in TSMC's CoWoS advanced packaging continues to widen. Thus, the rise of "CoWoS-like" capacity by OSAT providers...
Memory demand remains overheated and supply tight, driving upstream manufacturers to lift utilization while majors such as Micron pivot toward customized, higher value-added output...
Geopolitical realignments are accelerating a reshaping of the global outsourced assembly and test (OSAT) landscape. Industry analysts say that over the next five years, advanced AI-chip...
Taiwan-based integrated circuit (IC) test solution provider WinWay is planning to establish a production facility in Arizona by 2026, a move that reflects shifting global strategies...
Amkor, one of the largest US-based outsourced semiconductor assembly and test (OSAT) providers, has begun investing over KRW260 billion (approx. US$177 million) in South Korea to...
Kaynes Semicon, the semiconductor division of India's Kaynes Technology, is expanding beyond its success in power module packaging toward advanced chiplet and co-packaged optics as...
TSMC is accelerating development beyond the 2nm process node while expanding mass production of CoWoS-L, SoIC, and next-gen WMCM and CoPoS technologies. The semiconductor industry...
India's newly approved multilayer and high-density interconnect (HDI) printed circuit board (PCB) projects mark a crucial upstream shift in the country's electronics manufacturing...
Artificial intelligence (AI) is reshaping the global semiconductor supply chain and accelerating transformation in IC packaging and testing. As Qualcomm moves into the AI data center...
Rising demand for AI, 5G, and high-performance computing (HPC) chips is turning advanced packaging into a key front in the semiconductor race. China's largest OSAT provider and the...
