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    NEWS TAGGED OSAT
    Thursday 6 August 2026
    TSMC's CoW outsourcing spurs OSAT capacity push amid AI packaging bottleneck
    Taiwan Semiconductor Manufacturing Co. (TSMC) is expanding outsourcing of the chip-on-wafer (CoW) stage of its CoWoS advanced packaging to outsourced semiconductor assembly and test...
    Thursday 6 August 2026
    India's ASIP Technologies makes FCBGA core of OSAT plan
    ASIP Technologies will focus its Visakhapatnam semiconductor facility on flip-chip ball grid array packaging as it works toward volume production in the fourth quarter of 2027, Managing...
    Wednesday 5 August 2026
    Taiwan, US, and China OSAT strategies diverge as industry shifts toward capacity expansion, supply chain restructuring, and next-generation packaging

    Introduction

    Monday 3 August 2026
    India advances semiconductor ambitions as Visakhapatnam OSAT plant anchors South India packaging push

    India is moving deeper into semiconductor manufacturing with construction beginning on an INR23.87 billion (US$250 million) OSAT facility...

    Monday 3 August 2026
    Holtek raises MCU prices by up to 20% as wafer and OSAT costs continue climbing
    Microcontroller unit (MCU) supplier Holtek Semiconductor has confirmed a broad price increase across its entire microcontroller portfolio, marking its first company-wide adjustment...
    Monday 27 July 2026
    India's Paras Defense semiconductor unit to invest in Madhya Pradesh OSAT facility
    Indian defense engineering company Paras Defense and Space Technologies said its semiconductor subsidiary, Paras Semiconductors, will invest INR62 billion (approx. US$643.79 million)...
    Friday 17 July 2026
    TSMC's CoWoS capacity remains 'extremely tight' as OSAT partners ramp expansion

    During its July 16 earnings conference, Taiwan Semiconductor Manufacturing Company (TSMC) offered an upbeat outlook on AI demand. Responding...

    Thursday 16 July 2026
    Taiwan OSATs expand non-China capacity with US and SEA push
    As the global AI boom drives up demand for semiconductor packaging and testing, Taiwan's OSAT players are accelerating overseas capacity expansion beyond their home market and China...
    Wednesday 15 July 2026
    Taiwan's memory sector in June delivers standout performance by a wide margin
    Taiwan's memory sector delivered an extraordinary June 2026, with aggregate revenue reaching US$2,829.5 million, up 6.4% month-over-month and a staggering 288.3% year-over-year —...
    Wednesday 15 July 2026
    Charts: Taiwan's OSAT sector grows a steady 23.7% YoY in June, but a small player is stealing the spotlight
    Taiwan's back-end packaging and testing (OSAT) industry posted US$3,105.4 million in June 2026 revenue, up 2.9% month-over-month and 23.7% year-over-year — a solid, steady pace,...
    Monday 6 July 2026
    India launches third semiconductor plant as CG Semi begins commercial production in Gujarat
    India Prime Minister Narendra Modi inaugurated CG Semi's Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat, marking the start of commercial production at...
    Friday 3 July 2026
    Cheng Mei accelerates semiconductor shift as polarizer market faces cost pressure

    Cheng Mei Materials is expanding into semiconductor materials to support supply chain adjustments for outsourced chip assembly and...

    Wednesday 1 July 2026
    AI fuels OSAT pricing power as chip packaging orders fill through 2027
    Cloud AI demand is reshaping the seasonal cycle of the semiconductor industry, with capacity tightness spreading from front-end manufacturing to back-end packaging and testing. Since...
    Saturday 27 June 2026
    Hanmi targets advanced packaging market with FC Bonder 3.5

    Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean...

    Tuesday 23 June 2026
    Taiwan OSAT sector's strongest 1H in years puts 2026 full-year revenue records in sight

    Taiwan's semiconductor packaging and testing (OSAT) industry delivered strong year-over-year revenue growth in May 2026, with 21 of...

    1/23 pages
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    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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