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    Exclusive: AI-driven demand and chip price hikes raise fears of another car chip shortage
    3h 15min ago
    China auto market slumps as exports face rising geopolitical risk
    3h 15min ago
    Exclsuive: PC brands reportedly rush to secure CXMT memory as orders extend to end-2027
    3h 16min ago
    Apple price hikes raises questions for device upgrade timing
    3h 16min ago
    Commentary: ASML's race to catch u p shows AI's real bottleneck isn't chips — it's cleanrooms
    3h 16min ago
    China reveals first official commercial space member list, backing mature players and NTN chain
    3h 16min ago
    NEWS TAGGED OSAT
    Thursday 16 July 2026
    Taiwan OSATs expand non-China capacity with US and SEA push
    As the global AI boom drives up demand for semiconductor packaging and testing, Taiwan's OSAT players are accelerating overseas capacity expansion beyond their home market and China...
    Wednesday 15 July 2026
    Taiwan's memory sector in June delivers standout performance by a wide margin
    Taiwan's memory sector delivered an extraordinary June 2026, with aggregate revenue reaching US$2,829.5 million, up 6.4% month-over-month and a staggering 288.3% year-over-year —...
    Wednesday 15 July 2026
    Charts: Taiwan's OSAT sector grows a steady 23.7% YoY in June, but a small player is stealing the spotlight
    Taiwan's back-end packaging and testing (OSAT) industry posted US$3,105.4 million in June 2026 revenue, up 2.9% month-over-month and 23.7% year-over-year — a solid, steady pace,...
    Monday 6 July 2026
    India launches third semiconductor plant as CG Semi begins commercial production in Gujarat
    India Prime Minister Narendra Modi inaugurated CG Semi's Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat, marking the start of commercial production at...
    Friday 3 July 2026
    Cheng Mei accelerates semiconductor shift as polarizer market faces cost pressure

    Cheng Mei Materials is expanding into semiconductor materials to support supply chain adjustments for outsourced chip assembly and...

    Wednesday 1 July 2026
    AI fuels OSAT pricing power as chip packaging orders fill through 2027
    Cloud AI demand is reshaping the seasonal cycle of the semiconductor industry, with capacity tightness spreading from front-end manufacturing to back-end packaging and testing. Since...
    Saturday 27 June 2026
    Hanmi targets advanced packaging market with FC Bonder 3.5

    Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean...

    Tuesday 23 June 2026
    Taiwan OSAT sector's strongest 1H in years puts 2026 full-year revenue records in sight

    Taiwan's semiconductor packaging and testing (OSAT) industry delivered strong year-over-year revenue growth in May 2026, with 21 of...

    Friday 12 June 2026
    Taiwan OSAT firms gain from AI chip demand and foundry spillover
    The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers...
    Friday 22 May 2026
    AMD deepens China packaging alliance with TF-AMD expansion in Suzhou
    AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics),...
    Thursday 21 May 2026
    Five weak links India Semiconductor Mission 2.0 must fix
    India's first semiconductor mission brought fabs, OSAT units, and chip projects into the policy pipeline. Its second phase is being shaped around a harder question: whether India can...
    Wednesday 20 May 2026
    China's OSATs chase bigger role as AI chips strain packaging supply

    China's OSAT providers are trying to move deeper into advanced packaging as artificial intelligence (AI) demand strains global chip packaging...

    Sunday 17 May 2026
    Taiwan chipmakers quietly fill gaps left by Korea's HBM push
    Taiwan's semiconductor ecosystem is getting an unexpected lift from the AI server investment boom. Supply pressure that began in high-bandwidth memory and leading-edge process technology...
    Wednesday 13 May 2026
    ChipMOS 1Q26 earnings jump 186% on strong packaging and testing demand
    Taiwanese outsourced semiconductor assembly and test (OSAT) services company ChipMOS Technologies reported strong growth in both revenue and profit for the first quarter of 2026. Net...
    Wednesday 13 May 2026
    Hanwha Semitech to supply FO-PLP equipment for SpaceX-linked chip production
    South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging (FO-PLP) equipment for advanced chip packaging in the second...
    1/22 pages
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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    VIA Labs Announces MST Hub Controllers for Multi-Display USB-C Docking
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