News tagged OSAT at DIGITIMES

NEWS TAGGED OSAT

Friday 17 July 2026

TSMC's CoWoS capacity remains 'extremely tight' as OSAT partners ramp expansion

During its July 16 earnings conference, Taiwan Semiconductor Manufacturing Company (TSMC) offered an upbeat outlook on AI demand. Responding...

Thursday 16 July 2026

Taiwan OSATs expand non-China capacity with US and SEA push

As the global AI boom drives up demand for semiconductor packaging and testing, Taiwan's OSAT players are accelerating overseas capacity expansion beyond their home market and China...

Wednesday 15 July 2026

Taiwan's memory sector in June delivers standout performance by a wide margin

Taiwan's memory sector delivered an extraordinary June 2026, with aggregate revenue reaching US$2,829.5 million, up 6.4% month-over-month and a staggering 288.3% year-over-year —...

Wednesday 15 July 2026

Charts: Taiwan's OSAT sector grows a steady 23.7% YoY in June, but a small player is stealing the spotlight

Taiwan's back-end packaging and testing (OSAT) industry posted US$3,105.4 million in June 2026 revenue, up 2.9% month-over-month and 23.7% year-over-year — a solid, steady pace,...

Monday 6 July 2026

India launches third semiconductor plant as CG Semi begins commercial production in Gujarat

India Prime Minister Narendra Modi inaugurated CG Semi's Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat, marking the start of commercial production at...

Friday 3 July 2026

Cheng Mei accelerates semiconductor shift as polarizer market faces cost pressure

Cheng Mei Materials is expanding into semiconductor materials to support supply chain adjustments for outsourced chip assembly and...

Wednesday 1 July 2026

AI fuels OSAT pricing power as chip packaging orders fill through 2027

Cloud AI demand is reshaping the seasonal cycle of the semiconductor industry, with capacity tightness spreading from front-end manufacturing to back-end packaging and testing. Since...

Saturday 27 June 2026

Hanmi targets advanced packaging market with FC Bonder 3.5

Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean...

Tuesday 23 June 2026

Taiwan OSAT sector's strongest 1H in years puts 2026 full-year revenue records in sight

Taiwan's semiconductor packaging and testing (OSAT) industry delivered strong year-over-year revenue growth in May 2026, with 21 of...

Friday 12 June 2026

Taiwan OSAT firms gain from AI chip demand and foundry spillover

The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers...

Friday 22 May 2026

AMD deepens China packaging alliance with TF-AMD expansion in Suzhou

AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics),...

Thursday 21 May 2026

Five weak links India Semiconductor Mission 2.0 must fix

India's first semiconductor mission brought fabs, OSAT units, and chip projects into the policy pipeline. Its second phase is being shaped around a harder question: whether India can...

Wednesday 20 May 2026

China's OSATs chase bigger role as AI chips strain packaging supply

China's OSAT providers are trying to move deeper into advanced packaging as artificial intelligence (AI) demand strains global chip packaging...

Sunday 17 May 2026

Taiwan chipmakers quietly fill gaps left by Korea's HBM push

Taiwan's semiconductor ecosystem is getting an unexpected lift from the AI server investment boom. Supply pressure that began in high-bandwidth memory and leading-edge process technology...

Wednesday 13 May 2026

ChipMOS 1Q26 earnings jump 186% on strong packaging and testing demand

Taiwanese outsourced semiconductor assembly and test (OSAT) services company ChipMOS Technologies reported strong growth in both revenue and profit for the first quarter of 2026. Net...

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Jun 1, 08:00

LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

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