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    China's share of global solar module demand falls below 40% as Europe and India gain ground
    6min ago
    NEWS TAGGED OSAT
    Thursday 1 October 2026
    China OSAT share in cloud AI accelerators to hit 13% in 2026 as local ASIC volume ramps up
    As China accelerates its push for homegrown AI computing chips, custom ASIC accelerators from domestic tech giants—including Huawei, Cambricon, and Alibaba—are entering...
    Wednesday 30 September 2026
    ASE Technology buys Singapore factory for AI chip testing expansion
    ASE Technology Holding's Singapore unit has approved the purchase of a factory in Yishun Industrial Park from Dutch LED maker Lumileds Singapore for about US$68.44 million, or about...
    Wednesday 30 September 2026
    SK Hynix resumes DDR4, DDR5 packaging orders with Winpac
    SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023...
    Wednesday 30 September 2026
    Foundry 2.0 revenue hits record as growth spreads beyond TSMC
    Global Foundry 2.0 market revenue reached a record US$96.6 billion in the second quarter of 2026, up 25% year-over-year and 11% sequentially, as semiconductor demand tied to data-center...
    Tuesday 22 September 2026
    Hanmi Semiconductor ships first FC Bonder 75 for 2.5D packaging
    Hanmi Semiconductor said on September 22 that it has shipped its first FC Bonder 75 to a customer, expanding the South Korean equipment maker's reach beyond high-bandwidth memory (HBM)...
    Tuesday 22 September 2026
    India's fifth chip plant goes live, capping Suchi Semicon's three-year buildout
    Prime Minister Narendra Modi virtually inaugurated commercial production at Suchi Semicon's outsourced semiconductor assembly and test (OSAT) plant in Palsana, Surat, on September...
    Thursday 17 September 2026
    20 of China's OSATs push into advanced packaging amid EUV curbs
    China is broadening its advanced packaging base as restrictions on leading-edge semiconductor equipment complicate further process-node scaling. The effort now extends beyond the country's...
    Monday 7 September 2026
    China's JCET seeks US$968M for AI-driven packaging expansion

    JCET Group is preparing a CNY6.5 billion (approx. US$968 million) private share placement to expand advanced packaging and testing capacity...

    Friday 4 September 2026
    LB Semicon starts Qualcomm shipments as DDI dependence fades
    South Korean OSAT player LB Semicon has begun shipments to Qualcomm Inc., marking a key step in its effort to move beyond a business structure long centered on display driver ICs (DDI)...
    Friday 28 August 2026
    AI packaging race heats up: Taiwan OSATs plan US$14.6 billion capex

    The AI investment cycle is spreading from leading-edge wafer fabrication into semiconductor packaging and testing, with Taiwan's largest...

    Thursday 27 August 2026
    India's CG Power targets 70% utilization at larger semiconductor packaging plant
    CG Power and Industrial Solutions is targeting 70% utilization at its larger semiconductor packaging facility within about four years, with the unit potentially generating around US$500...
    Thursday 27 August 2026
    AI glass substrate race shifts toward reliability and mass production
    The competition to develop glass substrates for artificial intelligence (AI) semiconductor packaging is intensifying, with Japanese and South Korean manufacturers pursuing different...
    Wednesday 26 August 2026
    India chip manufacturing push exposes production-test skills gap, NI says
    India's semiconductor expansion is beginning to expose a shortage of engineers with experience in production testing, a capability that will become increasingly important as new OSAT...
    Monday 24 August 2026
    TPK TGV pilot line to start by September, Thailand plant eyes 2027 ramp
    TPK Holding is accelerating its move from consumer touch panels into semiconductors, with its Through Glass Via (TGV) pilot line in Taoyuan, Taiwan set to begin operations in August...
    Wednesday 19 August 2026
    Shikhar Malhotra named chairman of HCL-Foxconn chip venture as Jewar plant advances

    India Chip Private Limited, the semiconductor joint venture between HCL Group and Hon Hai Technology Group (Foxconn), has appointed...

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