India Chip Private Limited, the semiconductor joint venture between HCL Group and Hon Hai Technology Group (Foxconn), has appointed...
LG Electronics has secured its first order for laser direct imaging (LDI) equipment used in semiconductor packaging, marking an early...
TSMC, Micron, ASE, and SPIL continue to expand their advanced-node and OSAT investments, driving stronger first-half 2026 results for...
AI chip demand is sustaining a global rise in semiconductor packaging and testing prices, with STATS ChipPAC preparing a broad round...
India is moving deeper into semiconductor manufacturing with construction beginning on an INR23.87 billion (US$250 million) OSAT facility...
