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NEWS TAGGED OSAT
Thursday 8 October 2026
India's chip packaging plants start exporting, but scale, skills, and subsidies test the next phase
India's outsourced semiconductor assembly and test (OSAT) sector has moved from inaugurations to its first export shipments. The challenge now is scale. The new plants are small, still...
Wednesday 7 October 2026
Sigurd raises prices, signs long AI capacity contracts, eyes higher 2026 capex
Taiwanese OSAT provider Sigurd Microelectronics and its subsidiary Winstek Semiconductor held a joint investor briefing on October 6. President Charles Yeh reported that surging demand...
Wednesday 7 October 2026
Chip price hikes loom as Taiwan IC designers brace to pass on costs through 2027
Taiwanese integrated circuit (IC) design firms report that passing on costs to customers will likely continue through 2027 as upstream foundry and outsourced semiconductor assembly...
Tuesday 6 October 2026
LB Semicon expands power chip capacity as Qualcomm production ramps up
South Korean outsourced semiconductor assembly and test (OSAT) provider LB Semicon is expanding power semiconductor backend capacity at its Gumi plant as it steps up efforts to reduce...
Monday 5 October 2026
Nanya Tech expands 3D OSAT to chase HBM-like demand
Nanya Technology is stepping up investment in new factory capacity to expand packaging and testing as some customers move into trial production for specification-based designs. The...
Friday 2 October 2026
ASE stake, expansion open doors for Machvision
AI servers and advanced packaging continue to drive demand for semiconductor manufacturing, outsourced semiconductor assembly and test (OSAT), and equipment. Machvision said Advanced...
Friday 2 October 2026
JCET Group partners with Wuxi to advance 2.5D advanced packaging facilities
JCET Group signed an agreement on September 29 for a high-end advanced packaging and testing project in Wuxi, Jiangsu Province. Wuxi municipal leadership pledged operational support...
Thursday 1 October 2026
ASE expands smart OSAT push with six university research partnerships
Advanced Semiconductor Engineering (ASE) held its 11th Automation Industry-Academia Project Results Presentation on September 30, unveiling 12 technology projects developed with six...
Thursday 1 October 2026
China OSAT share in cloud AI accelerators to hit 13% in 2026 as local ASIC volume ramps up
As China accelerates its push for homegrown AI computing chips, custom ASIC accelerators from domestic tech giants—including Huawei, Cambricon, and Alibaba—are entering...
Wednesday 30 September 2026
ASE Technology buys Singapore factory for AI chip testing expansion
ASE Technology Holding's Singapore unit has approved the purchase of a factory in Yishun Industrial Park from Dutch LED maker Lumileds Singapore for about US$68.44 million, or about...
Wednesday 30 September 2026
SK Hynix resumes DDR4, DDR5 packaging orders with Winpac
SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023...
Wednesday 30 September 2026
Foundry 2.0 revenue hits record as growth spreads beyond TSMC
Global Foundry 2.0 market revenue reached a record US$96.6 billion in the second quarter of 2026, up 25% year-over-year and 11% sequentially, as semiconductor demand tied to data-center...
Tuesday 22 September 2026
Hanmi Semiconductor ships first FC Bonder 75 for 2.5D packaging
Hanmi Semiconductor said on September 22 that it has shipped its first FC Bonder 75 to a customer, expanding the South Korean equipment maker's reach beyond high-bandwidth memory (HBM)...
Tuesday 22 September 2026
India's fifth chip plant goes live, capping Suchi Semicon's three-year buildout
Prime Minister Narendra Modi virtually inaugurated commercial production at Suchi Semicon's outsourced semiconductor assembly and test (OSAT) plant in Palsana, Surat, on September...
Thursday 17 September 2026
20 of China's OSATs push into advanced packaging amid EUV curbs
China is broadening its advanced packaging base as restrictions on leading-edge semiconductor equipment complicate further process-node scaling. The effort now extends beyond the country's...