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    Tsinghua Unigroup distances itself as Dongguan chip-cloud city land is reclaimed
    8h 26min ago
    Manz Asia targets PLP demand with three lines and three sizes
    8h 26min ago
    Panel-level packaging splits roles as FOPLP targets cost and CoPoS courts AI chips
    8h 26min ago
    Google expands TPU lineup, AMD may not crowd out Broadcom or MediaTek
    8h 27min ago
    US-China tech war spreads to optical transceivers and upstream supply chain
    8h 27min ago
    NEWS TAGGED OSAT
    Tuesday 18 August 2026
    LG Electronics lands first OSAT order for chip packaging LDI

    LG Electronics has secured its first order for laser direct imaging (LDI) equipment used in semiconductor packaging, marking an early...

    Monday 17 August 2026
    TSMC and Micron boom drives Taiwan 'fab five's 1H26 profits

    TSMC, Micron, ASE, and SPIL continue to expand their advanced-node and OSAT investments, driving stronger first-half 2026 results for...

    Tuesday 11 August 2026
    Chip price increases are set to keep spreading into the second half of 2026
    Global chip buyers from device makers to cloud companies are likely to face higher semiconductor costs for longer as supply-chain price increases continue to spread into the second...
    Monday 10 August 2026
    India roundup: Chip push broadens as localization and capacity remain works in progress
    India is accelerating its bid to build a broader semiconductor and electronics ecosystem, combining new packaging capacity, longer-term tax incentives and deeper localization with...
    Friday 7 August 2026
    Exclusive: STATS ChipPAC readies broad packaging price hikes on AI-driven OSAT squeeze

    AI chip demand is sustaining a global rise in semiconductor packaging and testing prices, with STATS ChipPAC preparing a broad round...

    Thursday 6 August 2026
    TSMC's CoW outsourcing spurs OSAT capacity push amid AI packaging bottleneck
    Taiwan Semiconductor Manufacturing Co. (TSMC) is expanding outsourcing of the chip-on-wafer (CoW) stage of its CoWoS advanced packaging to outsourced semiconductor assembly and test...
    Thursday 6 August 2026
    India's ASIP Technologies makes FCBGA core of OSAT plan
    ASIP Technologies will focus its Visakhapatnam semiconductor facility on flip-chip ball grid array packaging as it works toward volume production in the fourth quarter of 2027, Managing...
    Wednesday 5 August 2026
    Taiwan, US, and China OSAT strategies diverge as industry shifts toward capacity expansion, supply chain restructuring, and next-generation packaging

    Introduction

    Monday 3 August 2026
    India advances semiconductor ambitions as Visakhapatnam OSAT plant anchors South India packaging push

    India is moving deeper into semiconductor manufacturing with construction beginning on an INR23.87 billion (US$250 million) OSAT facility...

    Monday 3 August 2026
    Holtek raises MCU prices by up to 20% as wafer and OSAT costs continue climbing
    Microcontroller unit (MCU) supplier Holtek Semiconductor has confirmed a broad price increase across its entire microcontroller portfolio, marking its first company-wide adjustment...
    Monday 27 July 2026
    India's Paras Defense semiconductor unit to invest in Madhya Pradesh OSAT facility
    Indian defense engineering company Paras Defense and Space Technologies said its semiconductor subsidiary, Paras Semiconductors, will invest INR62 billion (approx. US$643.79 million)...
    Friday 17 July 2026
    TSMC's CoWoS capacity remains 'extremely tight' as OSAT partners ramp expansion

    During its July 16 earnings conference, Taiwan Semiconductor Manufacturing Company (TSMC) offered an upbeat outlook on AI demand. Responding...

    Thursday 16 July 2026
    Taiwan OSATs expand non-China capacity with US and SEA push
    As the global AI boom drives up demand for semiconductor packaging and testing, Taiwan's OSAT players are accelerating overseas capacity expansion beyond their home market and China...
    Wednesday 15 July 2026
    Taiwan's memory sector in June delivers standout performance by a wide margin
    Taiwan's memory sector delivered an extraordinary June 2026, with aggregate revenue reaching US$2,829.5 million, up 6.4% month-over-month and a staggering 288.3% year-over-year —...
    Wednesday 15 July 2026
    Charts: Taiwan's OSAT sector grows a steady 23.7% YoY in June, but a small player is stealing the spotlight
    Taiwan's back-end packaging and testing (OSAT) industry posted US$3,105.4 million in June 2026 revenue, up 2.9% month-over-month and 23.7% year-over-year — a solid, steady pace,...
    1/23 pages
    Research_DB
    BIZ FOCUS
    Aug 13, 08:00
    AI Memory & Storage: GMIF 2026 Hits Shenzhen Sept 22-23
    Wednesday 12 August 2026
    From Campus to Global R&D: Joining Phison in Malaysia
    Tuesday 11 August 2026
    ViTrox showcases AI packaging inspection solutions at SEMICON Taiwan 2026.
    Monday 10 August 2026
    BIOSTAR to Showcase at EMBEDDED WORLD NORTH AMERICA 2026
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