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    NEWS TAGGED OSAT
    Friday 17 April 2026
    Taiwan's OSAT expansion could tighten global test capacity and raise costs
    Taiwan's outsourced semiconductor assembly and test industry is expanding rapidly, driven by AI, high-performance computing, and memory demand. Global supply chains may face tighter...
    Tuesday 14 April 2026
    JCET CEO sees robotics extending automotive semiconductor growth

    China's leading OSAT provider JCET has sustained steady growth in automotive electronics, driven by the rapid expansion of new energy...

    Tuesday 14 April 2026
    JCET advances CPO, glass substrates to capture AI packaging demand
    JCET, China's leading outsourced semiconductor assembly and test (OSAT) provider, is accelerating its push into advanced packaging, sharpening its position in AI servers, data centres,...
    Monday 13 April 2026
    India roundup: Domestic chip firms anchor India's semiconductor ambitions

    India is advancing its semiconductor ecosystem via design alliances and acquisitions, while recalibrating...

    Saturday 11 April 2026
    ASE leads US$3.4B advanced testing push in Renwu
    Global OSAT leader ASE continued its expansion into advanced processes as its subsidiary ASE Test held a groundbreaking ceremony on April 10, 2026, at the Renwu Industrial Park. ASE...
    Friday 10 April 2026
    China OSATs step up investment drive as AI demand lifts advanced packaging race

    China's outsourced semiconductor assembly and test (OSAT) sector is accelerating capacity expansion and technology upgrades, with leading...

    Tuesday 7 April 2026
    IndieSemiC eyes India's general-purpose chip gap with Kaynes OSAT deal
    India-based fabless startup IndieSemiC is betting that its new OSAT partnership with Kaynes Semicon can help it move from RF modules into vertically integrated chip products. However,...
    Tuesday 7 April 2026
    FOPLP and WMCM emerge as key to fan-out packaging competitive field
    The advanced packaging market is entering a structural turning point. Among emerging technologies, fan-out packaging has hit a sweet spot between cost and performance, making it a...
    Thursday 2 April 2026
    Mobile chip inventory correction weighs on OSAT supply chain
    As the industry enters the stocking phase ahead of new smartphone launches, mobile chip customers are undergoing an inventory adjustment period. The supply chain indicates that this...
    Thursday 2 April 2026
    Top 10 Chart: Advanced packaging, not volume, drives OSAT shift as markets signal 2026 inflection

    Taiwan's outsourced semiconductor assembly and test (OSAT) sector is entering 2026 with relatively modest revenue growth, but market behavior...

    Tuesday 31 March 2026
    Global Foundry 2.0 market climbs to record US$320 billion in 2025 revenue
    The semiconductor industry has formally entered the Foundry 2.0 era, a phase defined by the deep integration of manufacturing, assembly, and testing, profitably driven by the global...
    Friday 20 March 2026
    Analog Devices activates Thailand plant to boost global manufacturing resilience
    Analog Devices has officially launched its advanced manufacturing facility in Thailand, aiming to enhance the company's advanced manufacturing and testing capabilities while promoting...
    Monday 16 March 2026
    Taiwan OSAT firms log double-digit annual growth despite slow season
    Benefiting from the continued expansion of AI applications, demand for chips used in high-performance computing (HPC), memory, networking, and smartphones has grown simultaneously,...
    Monday 16 March 2026
    India roundup: A reality check of chipmaking dream
    Despite semiconductor manufacturing facilities expected in 2026, India remains a small player in the global chipmaking industry, as it is reportedly considering further incentives.
    Monday 9 March 2026
    Mitsui partners with Kaynes and AOI Electronics to support Indian OSAT business
    Mitsui has concluded a strategic business partnership agreement with Kaynes Semicon Private Limited, an OSAT (semiconductor back-end process) company in India, and AOI Electronics,...
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    TechForum0520
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook