After more than a decade away, Apple may be preparing to return to the enterprise server market. According to The Information, as reported by Reuters, the company is...

Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged optics (CPO), chiplets, and glass...

SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with the HBM4E generation, a move that...

WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV) substrates for optical communications...

One word in Marvell Technology's August 19 filing decides how the Google agreement should be read. The custom silicon programs, it says, attach to the tensor processing...

DIGITIMES analyst Luke Lin, speaking on a recent podcast, used Intel's latest equity fundraising plan to examine who is benefiting most from the current surge in server...

Global AI computing is rapidly moving beyond single-GPU systems toward AI Factory architectures, where agentic AI and inference workloads are pushing data centers to rely...