SK Hynix is pushing deeper into logic design as it develops a next-generation 3D DRAM architecture that could separate memory-cell processing from the peripheral circuits...
South Korea's DB HiTek is gaining pricing power as tightening 8-inch foundry supply, high utilization, and stronger demand for power-management chips improve conditions...
MediaTek's new Dimensity 9600 Pro puts agentic AI at the center of its flagship smartphone strategy, supporting on-device mixture-of-experts (MoE) models with up to 30...
As global AI investment continues to expand and US-China geopolitical pressure intensifies, how Taiwan and South Korea can preserve their semiconductor and manufacturing...
The logic die at the bottom of a high-bandwidth memory (HBM) stack has become the semiconductor industry's newest contested territory. Within weeks, SK Hynix has been...
SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with the HBM4E generation, a move that...
SK Hynix is targeting 2028 to apply High-NA extreme ultraviolet lithography to DRAM mass production and is considering joining an industry initiative to develop 12-inch...
Japanese electronics giant NEC stopped development of gate-based superconducting quantum computer hardware at the end of March 2026. According to Japanese media reports,...
Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules submitted to TSMC takes longer...
